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71. 发明授权

US08339738B1 Method for providing a magnetic recording transducer having a hybrid moment pole 有权
标题翻译：提供具有混合力矩极的磁记录换能器的方法
公开(公告)号：US08339738B1
公开(公告)日：2012-12-25
申请号：US13528007
申请日：2012-06-20
申请人： Ut Tran , Zhigang Bai
发明人： Ut Tran , Zhigang Bai
IPC分类号： G11B5/127
CPC分类号： G11B5/3116 , G11B5/1278 , G11B5/3163
摘要： A method for fabricating a magnetic transducer having an air-bearing surface (ABS) is provided. The method comprises providing an underlayer, and providing a main pole residing on the underlayer and having a front and a rear. The step of providing a main pole further includes providing a first portion having a first magnetic moment, the first portion having a front face at the ABS and terminating between the ABS and the rear of the main pole, and providing a second portion having a second magnetic moment. A part of the second portion resides on the first portion, and another part of the second portion resides between the first portion of the main pole and the rear of the main pole. The first magnetic moment is less than the second magnetic moment.
摘要翻译：提供一种制造具有空气轴承表面（ABS）的磁换能器的方法。该方法包括提供底层，并提供驻留在底层上并具有前后的主极。提供主极的步骤还包括提供具有第一磁矩的第一部分，第一部分在ABS处具有前表面并终止于ABS和主极的后部之间，并且提供具有第二磁体的第二部分磁力矩第二部分的一部分位于第一部分上，第二部分的另一部分位于主极的第一部分和主极的后部之间。第一个磁矩小于第二个磁矩。

72. 发明授权

US08209848B2 Method of making a PMR writer with seamless shields 有权
标题翻译：制作具有无缝屏蔽的PMR写入器的方法
公开(公告)号：US08209848B2
公开(公告)日：2012-07-03
申请号：US12798560
申请日：2010-04-07
申请人： Zhigang Bai , Moris Dovek , Yan Wu , Cherng-Chyi Han , Jiun-Ting Lee
发明人： Zhigang Bai , Moris Dovek , Yan Wu , Cherng-Chyi Han , Jiun-Ting Lee
IPC分类号： G11B5/17 , G11B5/23
CPC分类号： G11B5/1278 , G11B5/3116 , G11B5/3163 , Y10T29/49039 , Y10T29/49043 , Y10T29/4906
摘要： A process (and the structure resulting therefrom) is described for manufacturing a magnetic write head in which there is no physical interface between the first and second trailing shields. This is achieved by laying down a sacrificial layer which is patterned to extend inwards towards the top yoke whereby the dimensions and shapes of the shields are defined.
摘要翻译：描述了一种用于制造其中在第一和第二后挡板之间没有物理接口的磁写头的过程（以及由此产生的结构）。这通过铺设牺牲层来实现，该牺牲层被图案化以朝向顶部轭部向内延伸，由此限定了屏蔽件的尺寸和形状。

73. 发明授权

US08166631B1 Method for fabricating a magnetic recording transducer having side shields 有权
标题翻译：制造具有侧屏蔽的磁记录换能器的方法
公开(公告)号：US08166631B1
公开(公告)日：2012-05-01
申请号：US12199624
申请日：2008-08-27
申请人： Ut Tran , Zhigang Bai , Kevin K. Lin
发明人： Ut Tran , Zhigang Bai , Kevin K. Lin
IPC分类号： G11B5/17 , H04R31/00
CPC分类号： G11B5/315 , G11B5/1278 , G11B5/3116 , G11B5/3163 , Y10T29/49043 , Y10T29/49044 , Y10T29/49046 , Y10T29/49048 , Y10T29/49052
摘要： A method provides a magnetic transducer that includes an underlayer and a nonmagnetic layer on the underlayer. The method includes providing a plurality of trenches in the nonmagnetic layer. A first trench of corresponds to a main pole, while at least one side trench corresponds to at least one side shield. The method also includes providing mask covering the side trench(es) and providing the main pole. At least a portion of the main pole resides in the first trench. The method also includes removing at least a portion of the nonmagnetic layer residing between the side trench(es) and the main pole. The method also includes providing at least one side shield. The shield(s) extend from at least an air-bearing surface location to not further than a coil front location.
摘要翻译：一种方法提供一种磁传感器，其包括底层上的底层和非磁性层。该方法包括在非磁性层中提供多个沟槽。第一沟槽对应于主极，而至少一个侧沟槽对应于至少一个侧屏蔽。该方法还包括提供覆盖侧沟槽并提供主极的掩模。主极的至少一部分位于第一沟槽中。该方法还包括去除位于侧沟槽和主极之间的非磁性层的至少一部分。该方法还包括提供至少一个侧屏蔽。屏蔽件至少从空气轴承表面位置延伸到不超过线圈前部位置。

74. 发明申请

US20110316130A1 THIN SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：薄半导体封装及其制造方法
公开(公告)号：US20110316130A1
公开(公告)日：2011-12-29
申请号：US13092159
申请日：2011-04-22
申请人： Yeqing Su , Zhigang Bai , Weimin Chen , Wei Shen , Jianhong Wang , Baoguan Yin , Wanming Yu
发明人： Yeqing Su , Zhigang Bai , Weimin Chen , Wei Shen , Jianhong Wang , Baoguan Yin , Wanming Yu
IPC分类号： H01L23/495 , H01L21/28
CPC分类号： H01L21/6835 , H01L21/568 , H01L23/3107 , H01L23/49541 , H01L24/48 , H01L24/85 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/8501 , H01L2924/00014 , H01L2924/18165 , H01L2224/45099
摘要： A method for manufacturing a thin semiconductor package includes providing a lead frame with a removable substrate that has an attaching surface attached to a first surface of the lead frame. The lead frame is formed from an electrically conductive sheet and has leads that extend inwardly from a lead frame boundary towards a central region of the lead frame. A semiconductor die is mounted on the removable substrate at the central region. The semiconductor die has a connection pad surface with die pads on it, and the connection pad surface is attached to the attaching surface of the removable substrate. The lead frame and die are encapsulated with a first encapsulant so that the lead frame is sandwiched between the first encapsulant and the removable substrate. The removable substrate is removed from the lead frame to expose the first surface of the lead frame and then the die pads are electrically connected to respective ones of the leads. The die and lead frame then are encapsulated with a second encapsulant so that the lead frame and die are sandwiched between the first and second encapsulants. Part of the first encapsulant is then removed to reduce the thickness of the package and expose the leads.
摘要翻译：一种用于制造薄半导体封装的方法，包括：提供具有可移除基板的引线框架，该可移除基板具有附接到引线框架的第一表面的附接表面。引线框架由导电片形成，并且具有从引线框架边界朝向引线框架的中心区域向内延伸的引线。半导体管芯安装在中央区域的可拆卸基板上。半导体管芯具有连接焊盘表面，其上具有焊盘，并且连接焊盘表面附接到可移除基板的附接表面。引线框架和管芯用第一密封剂封装，使得引线框架夹在第一密封剂和可移除基板之间。将可移除基板从引线框架移除以露出引线框架的第一表面，然后将管芯焊盘电连接到相应的引线。然后，管芯和引线框架用第二密封剂封装，使得引线框架和管芯夹在第一和第二密封剂之间。然后去除部分第一密封剂以减小包装的厚度并暴露引线。

75. 发明授权

US07888186B2 Method for assembling stackable semiconductor packages 有权
标题翻译：堆叠式半导体封装的组装方法
公开(公告)号：US07888186B2
公开(公告)日：2011-02-15
申请号：US12499788
申请日：2009-07-08
申请人： Zhigang Bai , Weimin Chen , Zhijie Wang
发明人： Zhigang Bai , Weimin Chen , Zhijie Wang
IPC分类号： H01L21/00
CPC分类号： H01L23/3107 , H01L21/565 , H01L23/3121 , H01L24/45 , H01L24/48 , H01L25/105 , H01L2224/16225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2225/1058 , H01L2924/01013 , H01L2924/01079 , H01L2924/15153 , H01L2924/15165 , H01L2924/15331 , H01L2924/181 , Y10T29/41 , Y10T29/51 , H01L2924/00014 , H01L2924/00012
摘要： A method for assembling a stackable semiconductor package includes providing a substrate having a first surface and a second surface. The first surface includes bond pads and one or more die pads. Conductive bumps are formed on the bond pads and one or more semiconductor dies are attached to the one or more die pads. The first surface of the substrate, the semiconductor dies and the conductive bumps are placed in a side-gate molding cast and a mold material is supplied to the first surface of the substrate to form a stackable semiconductor package. Similarly formed semiconductor packages may be stacked, one on another to form a stacked semiconductor package.
摘要翻译：一种用于组装可堆叠半导体封装的方法包括提供具有第一表面和第二表面的衬底。第一表面包括接合焊盘和一个或多个管芯焊盘。导电凸块形成在接合焊盘上，并且一个或多个半导体管芯附接到一个或多个管芯焊盘。将基板的第一表面，半导体管芯和导电凸块放置在侧浇口模铸件中，并将模具材料供应到基板的第一表面以形成可堆叠的半导体封装。类似地形成的半导体封装可以彼此层叠以形成堆叠的半导体封装。

76. 发明申请

US20150243586A1 SEMICONDUCTOR DIE PACKAGE WITH PRE-MOLDED DIE 有权
标题翻译：具有预成型模具的半导体芯片封装
公开(公告)号：US20150243586A1
公开(公告)日：2015-08-27
申请号：US14551069
申请日：2014-11-23
申请人： Zhijie Wang , Zhigang Bai , Aipeng Shu , Yanbo Xu , Huchang Zhang , Fei Zong
发明人： Zhijie Wang , Zhigang Bai , Aipeng Shu , Yanbo Xu , Huchang Zhang , Fei Zong
IPC分类号： H01L23/495 , H01L23/433 , H01L23/498 , H01L21/56
CPC分类号： H01L23/49503 , H01L21/56 , H01L21/561 , H01L23/16 , H01L23/3107 , H01L23/3737 , H01L23/42 , H01L23/4334 , H01L23/49541 , H01L23/49551 , H01L23/49568 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014
摘要： A semiconductor die is packaged by providing a die assembly that includes a semiconductor die with an active surface and an opposite mounting surface with an attached thermally conductive substrate. The die assembly is mounted on a first surface of a lead frame die flag so that the thermally conductive substrate is sandwiched between the die flag and the semiconductor die. Bonding pads of the die are electrically connected with bond wires to lead frame lead fingers. A mold compound then encapsulates the semiconductor die, bond wires, and thermally conductive substrate. A second surface of the die flag is exposed through the mold compound.
摘要翻译：通过提供包括具有活性表面的半导体管芯和具有附接的导热衬底的相对安装表面的管芯组件来封装半导体管芯。模具组件安装在引线框架模具标记的第一表面上，使得导热基板夹在模具标记和半导体管芯之间。管芯的接合焊盘与接合线电连接以引导框架引线指。然后，模制化合物封装半导体管芯，接合线和导热衬底。模具标记的第二表面通过模具化合物暴露。

77. 发明授权

US08792208B1 Method for providing side shields having non-conformal regions for a magnetic recording transducer 有权
标题翻译：用于提供具有用于磁记录换能器的非共形区域的侧屏蔽的方法
公开(公告)号：US08792208B1
公开(公告)日：2014-07-29
申请号：US13481158
申请日：2012-05-25
申请人： Feng Liu , Yugang Wang , Zhigang Bai , Hongzhou Jiang , Tao Pan , Shaoping Li
发明人： Feng Liu , Yugang Wang , Zhigang Bai , Hongzhou Jiang , Tao Pan , Shaoping Li
IPC分类号： G11B5/11
CPC分类号： G11B5/3163 , G11B5/1278 , G11B5/3116 , G11B5/315
摘要： A method and system provide a magnetic recording transducer having air-bearing surface (ABS). The magnetic recording transducer includes a pole, a side shield, a nonmagnetic gap between the side shield and the pole and at least one coil for energizing the pole. The pole has a pole tip proximate to the ABS. The side shield includes at least one nonconformal portion that extends from a throat height in a stripe height direction perpendicular to the ABS and is nonconformal with the pole. The spacing between the nonconformal portion(s) of the side shield and the pole varies based on a distance from the ABS.
摘要翻译：一种方法和系统提供具有空气轴承表面（ABS）的磁记录换能器。磁记录传感器包括极，侧屏蔽，侧屏蔽和极之间的非磁性间隙，以及至少一个用于激励磁极的线圈。极杆具有靠近ABS的极尖。所述侧护罩包括至少一个非整形部分，其从与所述ABS垂直的条带高度方向上的喉部高度延伸并且与所述杆不一致。侧护罩的非共形部分和极之间的间距基于距离ABS的距离而变化。

78. 发明授权

US08724259B1 Conformal high moment side shield seed layer for perpendicular magnetic recording writer 有权
标题翻译：用于垂直磁记录刻录机的保形高力侧屏蔽种子层
公开(公告)号：US08724259B1
公开(公告)日：2014-05-13
申请号：US13493903
申请日：2012-06-11
申请人： Feng Liu , Dehua Han , Yugang Wang , Zhigang Bai , Tao Pan
发明人： Feng Liu , Dehua Han , Yugang Wang , Zhigang Bai , Tao Pan
IPC分类号： G11B5/147
CPC分类号： G11B5/11 , G11B5/1278 , G11B5/23 , G11B5/3116 , G11B5/315 , G11B5/4886
摘要： A perpendicular magnetic recording writer for use in a data storage device, the recording transducer has a magnetic writer pole, a pole tip facing an air bearing surface (ABS). The pole tip has a pole face, leading side wall, a trailing side wall, a first side wall and a second side wall. A trailing side wall nonmagnetic gap layer on the trailing side wall, a first side wall nonmagnetic gap layer deposited on the first side wall, and a second side wall nonmagnetic gap layer deposited on the second side wall. A high magnetic moment seed layer is deposited on the trailing side wall nonmagnetic gap layer, the first side wall nonmagnetic gap layer, and the second side wall nonmagnetic gap layer. In other aspects of the invention shields are provided that have magnetic moments less than the magnetic moment of the seed layers.
摘要翻译：一种在数据存储装置中使用的垂直磁记录刻录机，记录换能器具有磁写入极，极尖面向空气轴承表面（ABS）。极尖具有极面，前侧壁，后侧壁，第一侧壁和第二侧壁。在后侧壁上的后侧壁非磁性间隙层，沉积在第一侧壁上的第一侧壁非磁性间隙层和沉积在第二侧壁上的第二侧壁非磁性间隙层。在后侧壁非磁性间隙层，第一侧壁非磁性间隙层和第二侧壁非磁性间隙层上沉积高磁矩种子层。在本发明的其它方面，提供了具有小于种子层的磁矩的磁矩的屏蔽。

79. 发明授权

US08693141B1 Systems and methods for providing stacked writer leads for magnetic transducers 有权
标题翻译：用于为磁换能器提供堆叠式写入器引线的系统和方法
公开(公告)号：US08693141B1
公开(公告)日：2014-04-08
申请号：US13291766
申请日：2011-11-08
申请人： Carl F. Elliott , Zhigang Bai , Tao Pan
发明人： Carl F. Elliott , Zhigang Bai , Tao Pan
IPC分类号： G11B5/48
CPC分类号： G11B5/4853 , G11B5/17
摘要： Systems and methods for providing stacked writer leads for magnetic transducers used in disk drives are provided. One such system for providing stacked writer leads for a magnetic transducer includes a writer coil for the magnetic transducer, a first pad on the magnetic transducer, a second pad on the magnetic transducer, a first circuit trace coupled to the first pad and a first terminal of the writer coil, and a second circuit trace coupled to the second pad and a second terminal of the writer coil, where a preselected length of the first circuit trace and the second circuit trace is configured in a stacked configuration where each of the preselected lengths of the first circuit trace and the second circuit trace is positioned at about the same location in spaced apart planes.
摘要翻译：提供了用于为磁盘驱动器中使用的磁换能器提供堆叠写入引线的系统和方法。一种用于提供用于磁换能器的堆叠写入器引线的这种系统包括用于磁换能器的写入器线圈，磁换能器上的第一焊盘，磁换能器上的第二焊盘，耦合到第一焊盘的第一电路迹线和第一端以及耦合到第二焊盘的第二电路迹线和写入器线圈的第二端子，其中第一电路迹线和第二电路迹线的预选长度被配置为堆叠配置，其中每个预选长度并且第二电路迹线位于间隔开的平面中的大致相同的位置处。

80. 发明申请

US20140034273A1 EVAPORATIVE CONDENSER RADIATING MODULE FOR STEAM EXHAUST OF A STEAM TURBINE 有权
标题翻译：蒸汽涡轮蒸汽排放用蒸发冷凝器放射模块
公开(公告)号：US20140034273A1
公开(公告)日：2014-02-06
申请号：US13882154
申请日：2011-08-29
申请人： Honghui Shi , Qingzhong Ma , Jin Wang , Jiayong Lu , Longying Zhang , Zhigang Bai
发明人： Honghui Shi , Qingzhong Ma , Jin Wang , Jiayong Lu , Longying Zhang , Zhigang Bai
IPC分类号： F28B1/06
CPC分类号： F28B1/06 , F01K9/00 , F28B7/00 , F28D7/163 , F28F9/26
摘要： An evaporative condenser radiating module for steam exhaust of a steam turbine comprises tube bundles and steam-water separating chambers. A steam-water separating chamber (4) between a section A and a section B, a section A downflow cooling section tube bundle (3), a section B downflow cooling section tube bundle (5), and a section C counter flow cooling section tube bundle (8) are disposes at the left side of a central steam-water separating chamber (7). An upper sealed space (10) of the steam-water separating chamber (4) between the section A and the section B is in communication with the central steam-water separating chamber (7) through the section C counter flow cooling section tube bundle (8). A lower sealed space of the steam-water separating chamber (4) between the section A and the section B is in communication with the central steam-water separating chamber (7) through the section B downflow cooling section tube bundle (5). A sealed section A steam entering chamber (2) is arranged on the left side of the steam-water separating chamber (4) between the section A and the section B. The section A downflow cooling section tube bundle (3) is arranged between the section A steam entering chamber (2) and the lower sealed space of the steam-water separating chamber (4) between the section A and the section B. The right side of the central steam-water separating chamber (7) is provided with tube bundles and steam-water separating chambers totally structurally identical with those arranged on the left side of the central steam-water separating chamber (7).
摘要翻译：用于汽轮机蒸汽排气的蒸发冷凝器辐射模块包括管束和蒸汽 - 水分离室。 A部分和B部分之间的蒸汽 - 水分离室（4），A部分下降冷却部分管束（3），B部分下降冷却部分管束（5）和C部逆流冷却部分管束（8）配置在中央蒸汽 - 水分离室（7）的左侧。部分A和部分B之间的蒸汽 - 水分离室（4）的上部密封空间（10）通过部分C逆流冷却部分管束与中央蒸汽 - 水分离室（7）连通 8）。部分A和部分B之间的蒸汽 - 水分离室（4）的下部密封空间通过部分B下降冷却部分管束（5）与中央蒸汽 - 水分离室（7）连通。密封部分A蒸汽进入室（2）布置在部分A和部分B之间的蒸汽 - 水分离室（4）的左侧。部分A下降冷却部分管束（3）布置在部分A蒸汽进入室（2）和蒸汽 - 水分离室（4）的下部密封空间在部分A和部分B之间。中央蒸汽 - 水分离室（7）的右侧设有管束和蒸汽 - 水分离室在结构上与布置在中央蒸汽 - 水分离室（7）左侧的那些分离室完全相同。

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