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71. 外观设计

USD584249S1 Grooves formed around a semiconductor device on a circuit board 有权
公开(公告)号：USD584249S1
公开(公告)日：2009-01-06
申请号：US29303706
申请日：2008-02-15
申请人： Emiko Tani , Tetsuya Ohsawa
设计人： Emiko Tani , Tetsuya Ohsawa

72. 发明授权

US07351914B2 Flexible printed circuit board for catheter, catheter using same, and production method of catheter 失效
标题翻译：用于导管的柔性印刷电路板，使用其的导管以及导管的制造方法
公开(公告)号：US07351914B2
公开(公告)日：2008-04-01
申请号：US11405587
申请日：2006-04-18
申请人： Masayuki Kaneto , Yasuhito Ohwaki , Tetsuya Ohsawa
发明人： Masayuki Kaneto , Yasuhito Ohwaki , Tetsuya Ohsawa
IPC分类号： H05K1/00
CPC分类号： A61B5/03 , A61B5/01 , A61B5/6852 , A61B2562/222 , A61M25/00 , A61M25/0105 , H05K1/028 , H05K3/0061 , H05K2201/055
摘要： The present invention provides a flexible printed circuit board having a band-like meandering pattern as a whole, which includes multiple linear parts configured about parallel to each other and a folding margin connected to one end in a longitudinal direction of two adjacent linear parts of the multiple linear parts, and which can turn into a single linear product having a total length of not less than 300 mm when the folding margin is double-folded at about a center thereof, and, at the folding margin, either of the two linear parts connected to the folding margin is folded back in a direction opposite by 180 degrees. As a result, a flexible printed circuit board for a catheter, which is sufficiently elongate for use as a signal line of a catheter, can be produced using a general-purpose production apparatus.
摘要翻译：本发明提供了一种柔性印刷电路板，其具有整体上的带状曲折图案，该柔性印刷电路板包括彼此平行配置的多个直线部分，以及连接到两个相邻直线部分的纵向方向上的一端的折叠边缘多个线性部分，并且当折叠边缘在其中心附近被折叠时，可以变成具有不小于300mm的总长度的单个线性产品，并且在折叠边缘处，两个直线部分连接到折叠边缘的方向与180度相反的方向折回。结果，可以使用通用生产设备来制造用于导管的用于导管的信号线的足够细长的用于导管的柔性印刷电路板。

73. 发明授权

US07288725B2 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US07288725B2
公开(公告)日：2007-10-30
申请号：US11433503
申请日：2006-05-15
申请人： Yoshihiko Takeuchi , Mitsuru Honjo , Tetsuya Ohsawa
发明人： Yoshihiko Takeuchi , Mitsuru Honjo , Tetsuya Ohsawa
IPC分类号： H05K1/16
CPC分类号： H01L23/4985 , H01L21/563 , H01L2224/73203 , H01L2924/01004 , H01L2924/01079 , H01L2924/09701 , H05K3/284 , H05K3/3452 , H05K2201/0989 , H05K2201/10674 , H05K2201/10689
摘要： A wired circuit board prevents a sealing resin filled in an electronic component mounting portion from overflowing and spreading to a different area other than the electronic component mounting portion. An electronic component placing area is provided in the electronic component mounting portion for the electronic component to be placed and terminals are located within the electronic component placing area and formed to extend continuously with the conductive wires. Also, a groove extending around the electronic component mounting portion to intersect with the conductive wires is formed in the insulating cover layer. Further, protrusions protruding in a direction of the conductive wires being extended in the groove are formed at an intersecting portion thereof with the conductive wires. This can reduce a tendency of the overly filled sealing resin to flow over the groove, thus preventing the spread of the sealing resin from the groove to the outside thereof.
摘要翻译：布线电路板防止填充在电子部件安装部分中的密封树脂溢出并扩展到电子部件安装部分以外的不同区域。电子部件放置区域设置在待放置的电子部件的电子部件安装部中，并且端子位于电子部件放置区域内并形成为与导线连续延伸。此外，在绝缘覆盖层中形成有围绕电子部件安装部分延伸以与导线相交的凹槽。此外，在导电线的方向上突出的突起在沟槽中延伸的突起形成在其与导线的交叉部分处。这可以减少过度填充的密封树脂在槽上流动的趋势，从而防止密封树脂从凹槽扩展到其外部。

74. 发明申请

US20060202357A1 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US20060202357A1
公开(公告)日：2006-09-14
申请号：US11224108
申请日：2005-09-13
申请人： Hitoki Kanagawa , Tetsuya Ohsawa , Yasunari Ooyabu
发明人： Hitoki Kanagawa , Tetsuya Ohsawa , Yasunari Ooyabu
IPC分类号： H01L23/52
CPC分类号： G11B5/4853 , G11B5/4846 , G11B5/486 , H01L2924/0002 , H05K1/056 , H05K1/111 , H05K3/3452 , H05K3/3478 , H05K2201/09472 , H05K2201/09745 , H05K2203/041 , Y02P70/611 , H01L2924/00
摘要： A wired circuit board having terminals that can ensure large electrical connection areas while preventing shorting of adjacent terminals, to ensure that the terminals are electrically connected with external terminals through molten metal. An insulating base layer 3 is formed on a supporting board 2 so that insulating concave portions 13 are formed at portions thereof where external connecting terminals 8 are to be formed. A conductive pattern 4 is formed on the insulating base layer 3 so that a number of lines of wire 4a, 4b, 4c, 4d, the magnetic head connecting terminals 7, and the external connecting portions 8 are integrally formed, and conductive concave portions 9 are formed in the external connecting terminals 8. Thereafter, an insulating cover layer 10 is formed on the insulating base layer 3 so that the magnetic head connecting terminals 7 and the external connecting terminals 8 are exposed from the insulating cover layer 10. In the suspension board with circuit 1 thus formed, when the external connecting terminals 8 are connected with connecting terminals of a read/write substrate via the solder balls 21, reliable connection therebetween can be ensured.
摘要翻译：一种具有能够确保大的电气连接区域的端子的布线电路板，同时防止相邻端子的短路，以确保端子通过熔融金属与外部端子电连接。绝缘基层3形成在支撑板2上，使得绝缘凹部13形成在其外部连接端子8将要形成的部分处。导电图案4形成在绝缘基底层3上，使得线4a，4b，4c，4d的线数，磁头连接端子7和外部连接部8一体形成，导电凹部9形成在外部连接端子8中。此后，在绝缘基底层3上形成绝缘覆盖层10，使得磁头连接端子7和外部连接端子8从绝缘覆盖层10露出在具有如此形成的电路1的悬挂板中，当外部连接端子8经由焊球21与读取/写入基板的连接端子连接时，可以确保其间的可靠连接。

75. 发明申请

US20060023435A1 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US20060023435A1
公开(公告)日：2006-02-02
申请号：US11187865
申请日：2005-07-25
申请人： Yasunari Ooyabu , Yasuhito Funada , Hitoki Kanagawa , Tetsuya Ohsawa
发明人： Yasunari Ooyabu , Yasuhito Funada , Hitoki Kanagawa , Tetsuya Ohsawa
IPC分类号： H05K7/06 , G11B5/49
CPC分类号： H05K1/181 , H05K1/056 , H05K3/28 , H05K2201/09972 , Y02P70/611
摘要： A wired circuit board that can prevent inconsistency in characteristic impedance to allow effective transmission of electrical signals from a magnetic head to a control board portion. A wired circuit board 1 is constructed so that a suspension board portion 2 for supporting the magnetic head 15 and a control board portion 3 for controlling the magnetic head 15 are formed to be continuous and integral with each other. To be more specific, a first conductor layer 10 connected to the magnetic head 15 in the suspension board portion 2 and a second conductor layer 11 connected to a preamplifier IC 12 in the control board portion 3 are formed from the same material and formed on a common insulating base layer 9 simultaneously. Further, a common insulating cover layer 13 to cover the first conductor layer 10 and the second conductor layer 11 is formed on the common insulating base layer 9. This arrangement of the wired circuit board 1 can eliminate the need of providing the connection point for connecting the first conductor layer 10 of the suspension board portion 2 and the second conductor layer 11 of the control board portion 3 at the boundary therebetween.
摘要翻译：一种可以防止特性阻抗不一致的有线电路板，以允许有效地将电信号从磁头传输到控制板部分。布线电路板1被构造成使得用于支撑磁头15的悬挂板部分2和用于控制磁头15的控制板部分3彼此连续并且一体地形成。更具体地说，连接到悬挂板部分2中的磁头15的第一导体层10和连接到控制板部分3中的前置放大器IC 12的第二导体层11由相同的材料形成并形成在公共绝缘基层9同时。此外，在公共绝缘基底层9上形成覆盖第一导体层10和第二导体层11的公共绝缘覆盖层13。布线电路板1的这种布置可以消除在其间的边界处提供用于连接悬挂板部分2的第一导体层10和控制板部分3的第二导体层11的连接点的需要。

76. 发明申请

US20050161775A1 Wiring circuit board and production method thereof 有权
标题翻译：接线电路板及其制作方法
公开(公告)号：US20050161775A1
公开(公告)日：2005-07-28
申请号：US11020350
申请日：2004-12-22
申请人： Yasuhito Funada , Tetsuya Ohsawa , Yasuhito Ohwaki
发明人： Yasuhito Funada , Tetsuya Ohsawa , Yasuhito Ohwaki
IPC分类号： G11B5/60 , G11B5/31 , G11B5/39 , G11B21/21 , G11B33/12 , H01L23/58 , H05K1/02 , H05K1/11 , H05K3/00 , H05K3/28 , H05K3/46
CPC分类号： G11B33/122 , G11B5/3103 , G11B5/3967 , H05K3/0023 , H05K3/0082 , H05K3/28 , H05K2201/0154 , H05K2201/0191
摘要： In the vicinity of the exposed part 1A of the multiply formed plural wiring conductors 1, of the thicknesses of the insulating cover layer 2 made of a polyimide layer, the thickness (T1) of a part located at about the middle point between the adjacent wiring conductors 1 is made smaller than the thickness (T2) of a part located on wiring conductor 1. Preferably, the difference in the thicknesses of a part located at about the middle point between the adjacent wiring conductors of the insulating cover layer 2 and that of a part located on wiring conductor is made to fall within the range of 1-5 μm. As a result, the insulating cover layer does not peel off easily.
摘要翻译：在由聚酰亚胺层制成的绝缘覆盖层2的厚度的多重形成的多个布线导体1的露出部分1A的附近，位于中间点之间的部分的厚度（T 1）使相邻布线导体1小于位于布线导体1上的部分的厚度（T 2）。优选地，将位于绝缘覆盖层2的相邻布线导体和位于布线导体的部分的相邻布线导体之间的中点附近的部分的厚度差设为在1-5μm的范围内。结果，绝缘覆盖层不容易剥离。

77. 发明授权

US08895870B2 Printed circuit board and method of manufacturing the same 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US08895870B2
公开(公告)日：2014-11-25
申请号：US12862338
申请日：2010-08-24
申请人： Tetsuya Ohsawa , Mitsuru Honjo , Daisuke Yamuchi
发明人： Tetsuya Ohsawa , Mitsuru Honjo , Daisuke Yamuchi
IPC分类号： H05K1/11 , H05K3/24 , C25D5/06 , C25D5/02 , H05K1/02 , H05K1/05
CPC分类号： C25D5/02 , C25D5/06 , H05K1/0237 , H05K1/056 , H05K3/242 , H05K2201/09727
摘要： A plurality of wiring traces and a plurality of lead wires for plating are formed on a base insulating layer. Each wiring trace and each lead wire for plating are integrally formed with each other. An electrode pad is provided at an end of each wiring trace, and the lead wire for plating is provided to extend from each electrode pad toward the opposite side to the wiring trace. A width of each lead wire for plating is set larger than a width of each wiring trace.
摘要翻译：在基底绝缘层上形成多个布线迹线和多个用于电镀的引线。每个布线迹线和每个用于电镀的引线彼此一体形成。电极焊盘设置在每个布线迹线的端部，并且提供用于电镀的引线以从每个电极焊盘朝着与布线迹线相反的一侧延伸。用于电镀的每个引线的宽度被设定为大于每个布线迹线的宽度。

78. 发明授权

US08208227B2 Suspension board with circuit and producing method thereof 有权
公开(公告)号：US08208227B2
公开(公告)日：2012-06-26
申请号：US13317107
申请日：2011-10-11
申请人： Tetsuya Ohsawa
发明人： Tetsuya Ohsawa
IPC分类号： G11B5/48
CPC分类号： G11B5/486 , H05K1/056 , H05K3/4685 , Y10T29/49032
摘要： A suspension board with circuit includes a metal supporting board, an insulating layer formed on the metal supporting board, and a conductive layer formed on the insulating layer. The insulating layer includes a first insulating layer and a second insulating layer. The conductive layer includes a first conductive pattern and a second conductive pattern. The first conductive pattern includes a first connecting portion formed on the first insulating layer and under the second insulating layer and a first terminal. The second conductive pattern includes a second connecting portion formed on the second insulating layer and a second terminal. The suspension board with circuit is formed with an opening, and a slider is provided such that an electronic element is inserted in the opening to be electrically connected to the first terminal and a magnetic head on the slider is electrically connected to the second terminal.

79. 发明授权

US08179691B2 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US08179691B2
公开(公告)日：2012-05-15
申请号：US12318689
申请日：2009-01-06
申请人： Takahiko Yokai , Tetsuya Ohsawa , Yasunari Ooyabu
发明人： Takahiko Yokai , Tetsuya Ohsawa , Yasunari Ooyabu
IPC分类号： H05K7/00
CPC分类号： H05K1/0245 , G11B5/484 , G11B5/486 , H05K1/0216 , H05K1/0248 , H05K1/056 , H05K2201/0352 , H05K2201/09236 , H05K2201/09672 , H05K2201/09736
摘要： A wired circuit board includes a first insulating layer; a first wire formed on the first insulating layer; a second insulating layer formed on the first insulating layer so as to cover the first wire; and a second wire formed on the second insulating layer so as to be arranged in opposed relation to the first wire in a thickness direction. The thickness of the first wire is 1 μm or less and is ⅓ or less of the thickness of the second insulating layer.
摘要翻译：布线电路板包括第一绝缘层; 形成在所述第一绝缘层上的第一线; 形成在所述第一绝缘层上以覆盖所述第一线的第二绝缘层; 以及形成在所述第二绝缘层上以在厚度方向上相对于所述第一布线布置的第二布线。第一线的厚度为1μm以下，为第二绝缘层的厚度的1/3以下。

80. 发明授权

US08015703B2 Method of manufacturing a wired circuit board 有权
标题翻译：布线电路板的制造方法
公开(公告)号：US08015703B2
公开(公告)日：2011-09-13
申请号：US12081835
申请日：2008-04-22
申请人： Hitoki Kanagawa , Tetsuya Ohsawa , Yasunari Ooyabu
发明人： Hitoki Kanagawa , Tetsuya Ohsawa , Yasunari Ooyabu
IPC分类号： H01R9/00 , H05K3/00
CPC分类号： H05K1/112 , G11B5/4833 , H01L2224/11003 , H01L2224/742 , H05K1/056 , H05K3/06 , H05K3/244 , H05K3/28 , H05K3/363 , H05K3/44 , H05K2201/0394 , H05K2201/09063 , H05K2201/0969 , H05K2201/10666 , H05K2203/0323 , H05K2203/041 , H05K2203/0455 , Y10T29/49117 , Y10T29/49124 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/49204
摘要： A method of manufacturing a wired circuit board including a metal supporting board. An insulating layer is formed on the metal supporting board in a pattern in which concave portions are formed. A conductive pattern in a pattern having terminals for connecting with external terminals via a molten metal is formed on the metal supporting board and the insulating layer. The terminals include shoulder portions corresponding to the concave portions and are concaved downward from an upper surface. First through holes penetrate the terminals in a thickness direction thereof Second through holes are formed communicating with the first through holes in portions of the insulating layer corresponding to the terminals by removing the concave portions to expose a lower surface of the terminals such that the second through holes penetrate the insulating layer in a thickness direction thereof and have a diameter larger than that of the first through holes.
摘要翻译：一种制造包括金属支撑板的布线电路板的方法。绝缘层以形成有凹部的图案形成在金属支撑板上。在金属支撑板和绝缘层上形成具有用于经由熔融金属与外部端子连接的端子的图案中的导体图案。端子包括对应于凹部的肩部，并且从上表面向下凹入。第一通孔在厚度方向上贯穿端子。通过除去凹部以露出端子的下表面，在绝缘层的与端子对应的部分中的第一通孔形成第二通孔，以使第二通孔孔的厚度方向穿过绝缘层，其直径大于第一通孔的直径。

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