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71. 发明授权

US06291884B1 Chip-size semiconductor packages 有权
标题翻译：芯片尺寸半导体封装
公开(公告)号：US06291884B1
公开(公告)日：2001-09-18
申请号：US09437013
申请日：1999-11-09
申请人： Thomas P. Glenn , Roy D. Hollaway
发明人： Thomas P. Glenn , Roy D. Hollaway
IPC分类号： H01L2348
CPC分类号： H01L24/81 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/94 , H01L24/97 , H01L2224/05554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05669 , H01L2224/05684 , H01L2224/16145 , H01L2224/32145 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/73215 , H01L2224/81801 , H01L2224/85203 , H01L2224/85205 , H01L2224/92247 , H01L2224/94 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01055 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2224/85 , H01L2224/83 , H01L2224/81 , H01L2924/20752 , H01L2924/20753 , H01L2924/00012
摘要： A wafer-level method for mass production of surface-mounting, chip-size (“CS”) ball grid array (“BGA”), land grid array (“LGA”), and lead-less chip carrier (“LCC”) semiconductor packages includes the wire-bond or flip-chip attachment of ceramic substrates to the active surface of corresponding chips while they are still integral to a semiconductor wafer, thereby reducing manufacturing costs of the packages relative to that of individually packaged chips. The substrates have a thermal coefficient of expansion (TCE) closely matching that of the underlying chip. This eliminates the need for a silicone “interposer” between the substrate and the chip otherwise necessary to prevent stress-related problems caused by the difference in the respective thermal expansion and contraction of the chip and substrate with changes in temperature, further reducing the cost of the packages, improving heat transfer from the chips, and resulting in a package that is relatively free of thermal-induced stresses.
摘要翻译：用于大规模生产表面贴装芯片尺寸（“CS”）球栅阵列（“BGA”），光栅阵列（LGA）和无铅芯片载体（“LCC”）的晶圆级方法，半导体封装包括陶瓷衬底的线接合或倒装芯片附着到相应芯片的有源表面，同时它们仍然与半导体晶片成一体，由此降低了封装相对于单独封装芯片的制造成本。衬底的热膨胀系数（TCE）与下面的芯片的热膨胀系数密切相关。这消除了在基板和芯片之间需要硅树脂“插入件”，否则为防止由于温度变化导致的芯片和基板的各自的热膨胀和收缩的差异引起的应力相关问题，进一步降低了成本包装，改善了从芯片的热传递，并产生相对不受热诱导应力的包装。

72. 发明授权

US06281568B1 Plastic integrated circuit device package and leadframe having partially undercut leads and die pad 有权
标题翻译：塑料集成电路器件封装和引线框架具有部分底切引线和裸片焊盘
公开(公告)号：US06281568B1
公开(公告)日：2001-08-28
申请号：US09176614
申请日：1998-10-21
申请人： Thomas P. Glenn , Scott J. Jewler , David Roman , J. H. Yee , D. H. Moon
发明人： Thomas P. Glenn , Scott J. Jewler , David Roman , J. H. Yee , D. H. Moon
IPC分类号： H01L2312
CPC分类号： H01L23/49548 , H01L23/3107 , H01L23/4951 , H01L23/49541 , H01L23/49555 , H01L24/48 , H01L2224/05599 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/85439 , H01L2224/85444 , H01L2224/85455 , H01L2224/85464 , H01L2224/8547 , H01L2924/00014 , H01L2924/01039 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , Y10T29/49121 , Y10T29/49146 , Y10T29/49171 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2924/00 , H01L2224/45099
摘要： Packages for an integrated circuit device and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, leads, bond wires, and an encapsulant. The lower surfaces of the die pad and leads are provided with a stepped profile by an etching step that etches partially through the thickness of a peripheral portion of the die pad, and also etches partially through the thickness of portions of the leads. Encapsulant material fills in beneath the recessed, substantially horizontal surfaces of the die pad and leads formed by the above-described etching step, and thereby prevents the die pad and leads from being pulled vertically from the package body. Other portions of the die pad and leads are exposed at the lower surface of the package for connecting the package externally. A metal leadframe for making an encapsulated package includes an outer frame. A die pad is within and connected to the frame. Leads extend from the frame toward the die pad without contacting the die pad. After an encapsulation step, the die pad and leads are severed from the leadframe, and a completed package is cut from the leadframe. A portion of the severed leads may extend laterally beyond the package sides, and may be bent upwards at an oblique angle to facilitate connection of a solder interconnection to the package. The packages may be made one at a time, or a plurality of packages may be made simultaneously. Packages may be cut from the leadframe with a punch or saw.
摘要翻译：公开了用于集成电路器件的封装以及用于制造这种封装的方法和引线框。封装包括管芯，管芯焊盘，引线，接合线和密封剂。芯片焊盘和引线的下表面通过蚀刻步骤设置有阶梯形轮廓，蚀刻步骤部分地蚀刻通过芯片焊盘的周边部分的厚度，并且还通过引线部分的厚度部分蚀刻。封装材料填充在芯片焊盘的凹入的，基本水平的表面下方，并且通过上述蚀刻步骤形成的引线，从而防止芯片焊盘和引线从封装主体垂直拉出。芯片焊盘和引线的其他部分暴露在封装的下表面处，用于将封装外部连接。用于制造封装封装的金属引线框包括外框。芯片垫在框架内并连接到框架上。导线从框架朝向芯片焊盘延伸，而不接触芯片焊盘。在封装步骤之后，将芯片焊盘和引线从引线框架切断，并且从引线框架切割完成的封装。切断的引线的一部分可以横向延伸超过封装侧，并且可以以倾斜的角度向上弯曲，以便于焊接互连连接到封装。封装可以一次制成一个，或者多个封装可以同时进行。包装可以用引脚或锯切从引线框架上切割。

73. 发明授权

US06266197B1 Molded window array for image sensor packages 有权
标题翻译：用于图像传感器封装的模制窗阵列
公开(公告)号：US06266197B1
公开(公告)日：2001-07-24
申请号：US09458033
申请日：1999-12-08
申请人： Thomas P. Glenn , Steven Webster
发明人： Thomas P. Glenn , Steven Webster
IPC分类号： G02B702
CPC分类号： H04N5/2254 , G01J5/045 , G01J5/0875 , H01L24/97 , H01L27/14618 , H01L2224/48091 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , H01L2924/15787 , H01L2924/181 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2924/00
摘要： Image sensor packages are fabricated simultaneously to minimize the cost associated with each individual image sensor package. To fabricate the image sensor packages, windows are molded in molding compound to form a molded window array. A substrate includes a plurality of individual substrates integrally connected together in an array format. Image sensors are attached and electrically connected to corresponding individual substrates. An adhesive layer attaches the molded window array to the substrate. The substrate and attached molded window array are singulated into a plurality of individual image sensor packages.
摘要翻译：同时制造图像传感器封装以最小化与每个单独的图像传感器封装相关联的成本。为了制造图像传感器封装，将窗口模制成模制化合物以形成模制的窗口阵列。衬底包括以阵列形式整体连接在一起的多个单独衬底。图像传感器被附接并电连接到相应的各个基板。粘合剂层将模制的窗口阵列附着到基底上。衬底和附着的模制窗阵列被分割成多个单独的图像传感器封装。

74. 发明授权

US5482736A Method for applying flux to ball grid array package 失效
标题翻译：将焊剂施加到球栅阵列封装的方法
公开(公告)号：US5482736A
公开(公告)日：1996-01-09
申请号：US286153
申请日：1994-08-04
申请人： Thomas P. Glenn , Roy D. Hollaway
发明人： Thomas P. Glenn , Roy D. Hollaway
IPC分类号： B23K1/20 , H05K3/34 , B05D1/28 , B23K3/00
CPC分类号： H05K3/3489 , B23K1/203 , B23K2201/40
摘要： A method and apparatus for applying flux to a series of metallization contacts or plated contact pad a substrate exposed by an apertured solder mask, employs a compressible transfer pad. A central flux pick-up area is formed on the transfer pad bottom surface. The bottom surface may be spherical and may include a cylindrical post onto which a predetermined amount of flux is transferred, such as by dipping the pick-up area into a reservoir of semi-liquid paste flux. The transfer pad is then positioned over and compressed on the solder mask such that the picked up flux on the flux pick-up area of the transfer pad is pressure forced by compression of the transfer pad through apertures in the solder mask directly and successively into all the series of depressions formed on the substrate until all the depressions are substantially filled with flux. After breaking away and removal of the transfer pad, a solder ball or bonder applied solder is deposited in each flux-containing depression to form a metallurgical bond between the ball and a plated contact pad or package metallization such as a lead frame.
摘要翻译：一种用于向一系列金属化触点或电镀接触焊盘施加焊剂的方法和装置，其通过有孔焊接掩模暴露的衬底采用可压缩转移垫。在转印垫底表面上形成中心的吸收区域。底表面可以是球形的，并且可以包括其上传送预定量的助焊剂的圆柱形柱，例如通过将拾取区域浸入半液体糊剂焊剂的储存器中。然后将转移垫定位在焊接掩模上并在其上压缩，使得转印垫的助焊剂拾取区上的拾取通量被压力通过压接传递垫通过焊接掩模中的孔直接并连续地变成所有形成在衬底上的一系列凹陷，直到所有凹陷基本上充满助熔剂。在分离和移除转移垫之后，将焊球或焊接剂施加的焊料沉积在每个含焊剂的凹陷中以在球和镀覆的接触焊盘或封装金属化（例如引线框架）之间形成冶金结合。

75. 发明授权

US07059040B1 Optical module with lens integral holder fabrication method 有权
标题翻译：具有透镜一体式支架制造方法的光学模块
公开(公告)号：US07059040B1
公开(公告)日：2006-06-13
申请号：US09764196
申请日：2001-01-16
申请人： Steven Webster , Thomas P. Glenn , Roy Dale Hollaway
发明人： Steven Webster , Thomas P. Glenn , Roy Dale Hollaway
IPC分类号： H05K3/20
CPC分类号： H01L27/14618 , G02B7/02 , H01L24/73 , H01L24/97 , H01L27/14625 , H01L27/14632 , H01L27/14685 , H01L27/14687 , H01L31/0203 , H01L31/02325 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01057 , H01L2924/01082 , H01L2924/12041 , H01L2924/14 , H01L2924/15153 , H01L2924/15311 , H01L2924/19041 , H04N5/2253 , H04N5/2254 , H04N5/2257 , Y10T29/49128 , Y10T29/4913 , Y10T29/49146 , Y10T29/49787 , H01L2924/00014 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： A method of forming an optical module includes mounting an image sensor to a base of a substrate and bonding a lens housing to a sidewall of the substrate. A mounting surface of the lens housing includes a locking feature having a horizontal surface and a vertical surface. The sidewall of the substrate includes a joint surface. To bond the lens housing to the sidewall of the substrate, a bond is formed between the horizontal surface of the locking feature of the lens housing and the joint surface of the sidewall. Further, a bond is formed between the vertical surface of the locking feature of the lens housing and an interior surface of the sidewall.
摘要翻译：一种形成光学模块的方法包括将图像传感器安装到基底的基底上，并将透镜外壳粘合到基底的侧壁上。透镜壳体的安装表面包括具有水平表面和垂直表面的锁定特征。基板的侧壁包括接合表面。为了将透镜壳体粘合到基板的侧壁，在透镜壳体的锁定特征的水平表面和侧壁的接合表面之间形成结合。此外，在透镜壳体的锁定特征的垂直表面和侧壁的内表面之间形成结合。

76. 发明授权

US06943429B1 Wafer having alignment marks extending from a first to a second surface of the wafer 失效
标题翻译：晶片具有从晶片的第一表面延伸到第二表面的对准标记
公开(公告)号：US06943429B1
公开(公告)日：2005-09-13
申请号：US09803084
申请日：2001-03-08
申请人： Thomas P. Glenn , Roy Dale Hollaway , Steven Webster
发明人： Thomas P. Glenn , Roy Dale Hollaway , Steven Webster
IPC分类号： B23K26/00 , H01L23/12 , H01L23/544 , H01L27/01 , H01L27/04
CPC分类号： H01L23/544 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： A marked wafer includes a front-side surface and a back-side surface. A vertical scribe line and a horizontal scribe line are on the front-side surface of the wafer. A back-side alignment mark is located at an intersection of the vertical scribe line and the horizontal scribe line. The back-side alignment mark extends from the front-side surface to the back-side surface of the wafer. The back-side alignment mark is used to aligning a saw, which singulates the wafer from the back-side surface.
摘要翻译：标记的晶片包括前侧表面和后侧表面。垂直刻划线和水平划线位于晶片的正面上。背面对准标记位于垂直划线和水平划线的交点处。背面对准标记从晶片的前侧表面延伸到背面。背面对准标记用于对准从后侧表面对晶片进行单片化的锯。

77. 发明授权

US06765801B1 Optical track drain package 有权
标题翻译：光学导轨封装
公开(公告)号：US06765801B1
公开(公告)日：2004-07-20
申请号：US09891678
申请日：2001-06-25
申请人： Thomas P. Glenn , Roy Dale Hollaway
发明人： Thomas P. Glenn , Roy Dale Hollaway
IPC分类号： H05K118
CPC分类号： H01S5/022 , H01L33/52 , H01L33/54 , H01L2224/32225 , H01L2224/48091 , H01L2224/73265 , H01S5/02228 , H01S5/02288 , H01S5/02296 , H01L2924/00014
摘要： A package includes a substrate having a pocket, an overflow reservoir around a periphery of the pocket, and a mating surface around a periphery of the overflow reservoir. An electronic component is mounted within the pocket. The pocket is over filled with a flowable material. A window or waveguide is mounted to the substrate. The overflow reservoir captures the flowable material that spills out of the pocket during mounting of the window or waveguide thus preventing contamination of the mating surface.
摘要翻译：包装包括具有袋的基板，围绕该袋的周边的溢流储存器以及围绕溢流储存器周边的配合表面。电子部件安装在口袋内。口袋里充满了可流动的材料。窗口或波导安装到基板。溢流储存器捕获在窗口或波导安装过程中从袋中溢出的可流动材料，从而防止配合表面的污染。

78. 发明授权

US06723582B2 Method of making a semiconductor package having exposed metal strap 有权
标题翻译：制造具有暴露的金属带的半导体封装的方法
公开(公告)号：US06723582B2
公开(公告)日：2004-04-20
申请号：US10356046
申请日：2003-01-31
申请人： Thomas P. Glenn , Blake A. Gillett
发明人： Thomas P. Glenn , Blake A. Gillett
IPC分类号： H02L2144
CPC分类号： H01L24/40 , H01L23/49524 , H01L23/49562 , H01L24/37 , H01L24/48 , H01L24/49 , H01L2224/05553 , H01L2224/05554 , H01L2224/32245 , H01L2224/37011 , H01L2224/37147 , H01L2224/40095 , H01L2224/40245 , H01L2224/40247 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/49175 , H01L2224/73221 , H01L2224/73265 , H01L2224/84801 , H01L2224/8485 , H01L2224/85399 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： Semiconductor devices and methods of forming such devices are disclosed. The devices include a package allowing for increased thermal dissipation. In one embodiment, the device includes a power MOSFET die that is electrically connected to a portion of the substrate with a metal strap. The die and at least portions of the strap and substrate are encapsulated in an insulative encapsulant, such as molded plastic. A top surface of the strap is exposed to the environment through the encapsulant. The exposed surface may have grooves formed therein, or fins formed thereon, to facilitate heat transfer.
摘要翻译：公开了形成这种器件的半导体器件和方法。这些器件包括允许增加散热的封装。在一个实施例中，该器件包括功率MOSFET管芯，其通过金属带电连接至衬底的一部分。模具和带和基底的至少一部分被封装在诸如模制塑料的绝缘密封剂中。带子的顶面通过密封剂暴露在环境中。暴露的表面可以具有形成在其中的凹槽或形成在其上的翅片，以便于热传递。

79. 发明授权

US06672773B1 Optical fiber having tapered end and optical connector with reciprocal opening 有权
标题翻译：具有锥形端的光纤和具有往复开口的光学连接器
公开(公告)号：US06672773B1
公开(公告)日：2004-01-06
申请号：US09751536
申请日：2000-12-29
申请人： Thomas P. Glenn , Steven Webster
发明人： Thomas P. Glenn , Steven Webster
IPC分类号： G02B638
CPC分类号： G02B6/30
摘要： A method and apparatus for connecting optical fibers to waveguides and other optical elements are disclosed. In one embodiment, an optical fiber is modified so as to have opposing orthogonal tapered sidewalls that taper toward a tip of the fiber. An optical connector for the fiber includes a base having a receiving section and a waveguide formed therein. The receiving section is a flared channel having opposing orthogonal tapered sidewalls and a horizontal bottom surface perpendicular to the sidewalls. The waveguide is optically accessible at a narrow inner end of the channel. The angle of taper of the sidewalls of the channel matches the angle of taper of the sidewalls of the optical fiber. When the optical fiber is inserted into the open end of the channel and is moved toward the narrow inner end of the channel, the sidewalls of the fiber and channel come into contact with each other. In addition, a bottom surface of the fiber rests on the horizontal bottom surface of the channel. The tip of the fiber is positioned adjacent to the waveguide in precise alignment along the x, y, and z axes. The optical fiber is thereby positioned for optical communication through the waveguide with another optical fiber, a light source, or a light receiving element positioned at an opposite end of the waveguide.
摘要翻译：公开了一种将光纤连接到波导和其它光学元件的方法和装置。在一个实施例中，光纤被修改为具有朝向纤维的尖端逐渐变细的相对的正交锥形侧壁。用于光纤的光学连接器包括具有形成在其中的接收部分和波导的基座。接收部分是具有相对的正交锥形侧壁和垂直于侧壁的水平底表面的扩口通道。波导在通道的窄内端处是光学可访问的。通道的侧壁的锥度角与光纤的侧壁的锥度角相匹配。当光纤插入通道的开口端并朝向通道的窄内端移动时，光纤和通道的侧壁彼此接触。此外，纤维的底面位于通道的水平底面上。纤维的尖端沿着x，y和z轴精确对准地定位在波导附近。因此，光纤被定位成通过波导与另一个光纤，光源或位于波导的相对端的光接收元件进行光通信。

80. 发明授权

US06670698B1 Integrated circuit package mounting 有权
标题翻译：集成电路封装安装
公开(公告)号：US06670698B1
公开(公告)日：2003-12-30
申请号：US10068717
申请日：2002-02-05
申请人： Thomas P. Glenn , Steven Webster , Roy Dale Hollaway
发明人： Thomas P. Glenn , Steven Webster , Roy Dale Hollaway
IPC分类号： H01L23495
CPC分类号： H05K3/325 , H01L23/04 , H01L24/48 , H01L24/72 , H01L2224/05599 , H01L2224/45099 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K3/4007 , H05K2201/0367 , H05K2201/10719 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A packaged electronic device includes connection contacts that are formed on the contact pads on the second surface of the substrate. In contrast to the prior art, the connection contacts are not solder contacts but are formed of nickel/aluminum plated copper and are therefore harder and less malleable and subject to deformation than prior art solder balls. The connection contacts are formed to align with, and contact, attachment pads formed on the motherboard or other system component. A tension device is then used to mechanically attach the packaged electronic device of the invention to the motherboard.
摘要翻译：封装的电子器件包括形成在衬底的第二表面上的接触焊盘上的连接触头。与现有技术相比，连接触点不是焊接触点，而是由镀镍/镀铝的铜形成，因此比现有技术的焊球更硬，更不可塑并且变形。连接触点被形成为与形成在母板或其他系统部件上的附接焊盘对准并接触。然后使用张紧装置将本发明的包装电子装置机械地附接到母板。

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