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71. 发明申请

US20070128747A1 Method for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US20070128747A1
公开(公告)日：2007-06-07
申请号：US11602261
申请日：2006-11-21
申请人： Tomoko Tamura , Tomoyuki Aoki , Takuya Tsurume , Koji Dairiki
发明人： Tomoko Tamura , Tomoyuki Aoki , Takuya Tsurume , Koji Dairiki
IPC分类号： H01L21/00
CPC分类号： H01L27/1266 , H01L27/1214
摘要： First semiconductor integrated circuits and second semiconductor integrated circuits arranged over a first substrate so that each of the second semiconductor integrated circuits is adjacent to one of the first semiconductor integrated circuits are transferred to additional substrates through multiple transfer operations. After the first semiconductor integrated circuits and the second semiconductor integrated circuits formed over the first substrate are transferred to the additional substrates (a fourth substrate and a fifth substrate) respectively, the circuits are divided into a semiconductor device corresponding to each semiconductor integrated circuit. The first semiconductor integrated circuits are arranged while keeping a distance from each other over the fourth substrate, and the second semiconductor integrated circuits are arranged while keeping a distance from each other over the fifth substrate. Thus, a large division margin of each of the fourth substrate and the fifth substrate can be obtained.
摘要翻译：第一半导体集成电路和第二半导体集成电路布置在第一基板上，使得第二半导体集成电路中的每一个与第一半导体集成电路之一相邻，通过多次传送操作被传送到附加的基板。在第一半导体集成电路和形成在第一衬底上的第二半导体集成电路分别转移到附加衬底（第四衬底和第五衬底）之后，将电路分成对应于每个半导体集成电路的半导体器件。第一半导体集成电路在第四衬底上彼此保持距离的同时被布置，并且第二半导体集成电路被布置成在第五衬底上彼此保持距离。因此，可以获得第四基板和第五基板中的每一个的大分割裕度。

72. 发明申请

US20070111391A1 Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device 有权
标题翻译：具有功能的层，具有该层的柔性基板的形成方法以及半导体装置的制造方法
公开(公告)号：US20070111391A1
公开(公告)日：2007-05-17
申请号：US11592249
申请日：2006-11-03
申请人： Tomoyuki Aoki , Takuya Tsurume
发明人： Tomoyuki Aoki , Takuya Tsurume
IPC分类号： H01L21/00
CPC分类号： H01Q7/00 , G02F1/133305 , G02F1/1362 , G02F2001/13613 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/0106 , H01L2924/01067 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H01Q1/38 , H05K3/207 , H05K3/28 , H05K2203/016 , H05K2203/0531 , H01L2224/81 , H01L2924/00
摘要： It is an object of the present invention to provide a method for forming a layer having functionality including a conductive layer and a colored layer and a flexible substrate having a layer having functionality with a high yield. Further, it is an object of the present invention to provide a method for manufacturing a semiconductor device that is small-sized, thin, and lightweight. After coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, after attaching an adhesive to the layer having functionality, the layer having functionality is peeled from the substrate. Further, after coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, an adhesive is attached to the layer having functionality. Thereafter, the layer having functionality is peeled from the substrate, and a flexible substrate is attached to the layer having functionality.
摘要翻译：本发明的目的是提供一种形成具有包括导电层和着色层的功能的层的方法和具有具有高产率功能的层的柔性基板。此外，本发明的目的是提供一种小型，薄型和轻量化的半导体器件的制造方法。用硅烷偶联剂涂布具有耐热性的基材后，形成具有官能团的层。然后，在将粘合剂粘贴到具有官能团的层上之后，将具有官能团的层从基材上剥离。此外，在用硅烷偶联剂涂布具有耐热性的基材之后，形成具有官能团的层。然后，将粘合剂附着到具有功能性的层上。此后，具有功能性的层从基板剥离，并且柔性基板附着到具有功能的层。

73. 发明申请

US20050116310A1 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US20050116310A1
公开(公告)日：2005-06-02
申请号：US10957747
申请日：2004-10-05
申请人： Kazuo Nishi , Hiroki Adachi , Junya Maruyama , Naoto Kusumoto , Yuusuke Sugawara , Tomoyuki Aoki , Eiji Sugiyama , Hironobu Takahashi
发明人： Kazuo Nishi , Hiroki Adachi , Junya Maruyama , Naoto Kusumoto , Yuusuke Sugawara , Tomoyuki Aoki , Eiji Sugiyama , Hironobu Takahashi
IPC分类号： H01L23/538 , H01L21/00 , H01L23/00 , H01L27/06 , H01L27/12 , H01L27/14 , H01L27/144 , H01L27/146 , H01L29/78 , H01L29/786 , H01L29/792 , H01L29/861 , H01L31/00 , H01L31/02 , H01L31/0203 , H01L31/0392 , H01L31/048 , H01L31/18
CPC分类号： H01L31/0203 , H01L27/1446 , H01L27/14618 , H01L31/048 , H01L2924/0002 , Y02E10/50 , H01L2924/00
摘要： The present invention provides a semiconductor device formed over an insulating substrate, typically a semiconductor device having a structure in which mounting strength to a wiring board can be increased in an optical sensor, a solar battery, or a circuit using a TFT, and which can make it mount on a wiring board with high density, and further a method for manufacturing the same. According to the present invention, in a semiconductor device, a semiconductor element is formed on an insulating substrate, a concave portion is formed on a side face of the semiconductor device, and a conductive film electrically connected to the semiconductor element is formed in the concave portion.
摘要翻译：本发明提供一种半导体器件，其形成在绝缘基板上，通常是半导体器件，其具有可以在光学传感器，太阳能电池或使用TFT的电路中增加布线板的安装强度的结构，并且其可以使其安装在高密度的布线板上，并且还提供其制造方法。根据本发明，在半导体器件中，半导体元件形成在绝缘基板上，在半导体器件的侧面形成有凹部，与半导体元件电连接的导电膜形成在凹部一部分。

74. 发明授权

US6059896A Composition and process for treating the surface of aluminiferous metals 失效
标题翻译：用于处理含铝金属表面的组成和方法
公开(公告)号：US6059896A
公开(公告)日：2000-05-09
申请号：US347
申请日：1998-01-21
申请人： Ryoji Ehara , Masahiro Motozawa , Tomoyuki Aoki
发明人： Ryoji Ehara , Masahiro Motozawa , Tomoyuki Aoki
IPC分类号： C23C22/36 , C23C22/48
CPC分类号： C23C22/361
摘要： A surface of aluminiferous metal is brought into contact at 25 to 65.degree. C. for 2 to 100 seconds with a surface treatment bath with a pH of 1.0 to 6.0 that contains phosphate ions, dissolved titanium and/or zirconium compounds, dissolved fluorine-containing anions, and a water soluble polymer in the following weight proportions: 1-100:1-50:1-200:1-200. This is followed by a water rinse and drying. The water soluble polymer has a chemical structure conforming to formula (I), in which each of X.sup.1 and X.sub.2 represents a hydrogen atom, a C.sub.1 to C.sub.5 alkyl group, or a C.sub.1 to C.sub.5 hydroxyalkyl group; each of Y.sup.1 and Y.sup.2 represents a hydrogen atom or a moiety "Z" that to formula (II) or (III), wherein each of R.sup.1, R.sup.2, R.sup.3, R.sup.4, and R.sup.5 represents a C.sub.1 to C.sub.10 alkyl group or a C.sub.1 to C.sub.10 hydroxyalkyl group; the average value for the number of Z moieties substituted on each aromatic ring in the polymer molecules is from 0.2 to 1.0; n is an integer; and the average value of n for the total polymer is from 2 to 50. ##STR1##
摘要翻译： PCT No.PCT / US96 / 11537 Sec。 371日期1998年1月21日 102（e）1998年1月21日PCT PCT 1996年7月19日PCT公布。出版物WO97 / 04145 日期：1997年2月6日利用含有磷酸根离子，溶解的钛和/或锆化合物的pH为1.0〜6.0的表面处理液，使含铝金属的表面在25〜65℃下接触2〜100秒，溶解的含氟阴离子和水溶性聚合物的重量比例如下：1-100：1-50：1-200：1-200。然后进行水冲洗和干燥。水溶性聚合物具有符合式（I）的化学结构，其中X1和X2各自表示氢原子，C1至C5烷基或C1至C5羟烷基; Y 1和Y 2各自表示氢原子或符合式（II）或（III）的部分“Z”，其中R 1，R 2，R 3，R 4和R 5各自表示C 1至C 10烷基或C 1至C 10烷基至C10羟烷基; 聚合物分子中每个芳环上取代的Z部分的数目的平均值为0.2-1.0; n是整数; 总聚合物的n的平均值为2〜50。

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