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1. 发明授权

US08455753B2 Solar cell and semiconductor device, and manufacturing method thereof 有权
标题翻译：太阳能电池和半导体器件及其制造方法
公开(公告)号：US08455753B2
公开(公告)日：2013-06-04
申请号：US11324491
申请日：2006-01-04
申请人： Kazuo Nishi , Tomoyuki Aoki , Toshiyuki Isa , Gen Fujii
发明人： Kazuo Nishi , Tomoyuki Aoki , Toshiyuki Isa , Gen Fujii
IPC分类号： H01L31/00
CPC分类号： G04C10/02 , H01L31/022425 , H01L31/022466 , H01L31/022475 , H01L31/0465 , H01L31/048 , H01L31/1884 , H01L31/202 , Y02E10/50 , Y02P70/521
摘要： It is an object of the present invention to minimize an electrode in a solar cell to minimize the solar cell. The present invention provides a method for manufacturing a solar cell comprising the steps of forming a first electrode layer over a substrate, forming a photoelectric conversion layer over the first electrode layer, forming an organic layer over the photoelectric conversion layer, forming an opening reaching the first electrode layer in the photoelectric conversion layer, and forming a second electrode layer by filling the opening with a conductive paste, wherein the organic layer modifies the surface of the photoelectric conversion layer and a contact angle between the conductive paste and the photoelectric conversion becomes greater. According to the present invention, wettability of a photoelectric conversion layer can be decreased by forming an organic layer on a surface of the photoelectric conversion layer. Thereby an electrode layer and an insulating isolation layer can be thinned.
摘要翻译：本发明的目的是使太阳能电池中的电极最小化以最小化太阳能电池。本发明提供一种太阳能电池的制造方法，包括以下步骤：在基板上形成第一电极层，在第一电极层上形成光电转换层，在光电转换层上形成有机层，形成开口到达第一电极层，并且通过用导电膏填充开口形成第二电极层，其中有机层改性光电转换层的表面，并且导电糊和光电转换之间的接触角变得更大。根据本发明，通过在光电转换层的表面上形成有机层，可以降低光电转换层的润湿性。由此，可以使电极层和绝缘隔离层变薄。

2. 发明授权

US08436354B2 Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device 有权
公开(公告)号：US08436354B2
公开(公告)日：2013-05-07
申请号：US13232011
申请日：2011-09-14
申请人： Tomoyuki Aoki , Takuya Tsurume
发明人： Tomoyuki Aoki , Takuya Tsurume
IPC分类号： H01L29/04 , H01L31/20 , H01L21/331 , H01L21/336
CPC分类号： H01Q7/00 , G02F1/133305 , G02F1/1362 , G02F2001/13613 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/0106 , H01L2924/01067 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H01Q1/38 , H05K3/207 , H05K3/28 , H05K2203/016 , H05K2203/0531 , H01L2224/81 , H01L2924/00
摘要： It is an object of the present invention to provide a method for forming a layer having functionality including a conductive layer and a colored layer and a flexible substrate having a layer having functionality with a high yield. Further, it is an object of the present invention to provide a method for manufacturing a semiconductor device that is small-sized, thin, and lightweight. After coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, after attaching an adhesive to the layer having functionality, the layer having functionality is peeled from the substrate. Further, after coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, an adhesive is attached to the layer having functionality. Thereafter, the layer having functionality is peeled from the substrate, and a flexible substrate is attached to the layer having functionality.

3. 发明授权

US08354962B2 Antenna and manufacturing method thereof, semiconductor device including antenna and manufacturing method thereof, and radio communication system 有权
标题翻译：天线及其制造方法，包括天线的半导体装置及其制造方法以及无线通信系统
公开(公告)号：US08354962B2
公开(公告)日：2013-01-15
申请号：US11604583
申请日：2006-11-27
申请人： Tomoyuki Aoki
发明人： Tomoyuki Aoki
IPC分类号： H01Q1/38
CPC分类号： H01L23/66 , H01L23/49822 , H01L23/49827 , H01L23/49855 , H01L23/49883 , H01L23/528 , H01L23/564 , H01L25/16 , H01L27/1214 , H01L27/1266 , H01L27/13 , H01L2223/6677 , H01L2924/0002 , H01L2924/12044 , H01Q1/38 , H01Q9/27 , H05K3/323 , H01L2924/00
摘要： An antenna includes a first substrate, a first pattern, a second substrate, a second pattern, and an anisotropic conductive material. The first substrate has an insulating surface. The first pattern is formed over the insulating surface of the first substrate, and made of a conductive material. The second substrate is provided so as to face the surface over which the first pattern of the first substrate is formed and has an insulating surface. The second pattern is formed over the insulating surface facing the first substrate of the second substrate, and made of a conductive material. The anisotropic conductive material electrically connects the first pattern and the second pattern. The whole region of the first pattern overlaps with the second pattern with the anisotropic conductive material interposed therebetween.
摘要翻译：天线包括第一基板，第一图案，第二基板，第二图案和各向异性导电材料。第一基板具有绝缘表面。第一图案形成在第一基板的绝缘表面上，并且由导电材料制成。第二基板被设置为面对形成有第一基板的第一图案并具有绝缘表面的表面。第二图案形成在面向第二基板的第一基板的绝缘表面上，并且由导电材料制成。各向异性导电材料电连接第一图案和第二图案。第一图案的整个区域与第二图案重叠，各向异性导电材料插入其间。

4. 发明授权

US08278663B2 Paper including semiconductor device and manufacturing method thereof 有权
标题翻译：纸包括半导体器件及其制造方法
公开(公告)号：US08278663B2
公开(公告)日：2012-10-02
申请号：US12985364
申请日：2011-01-06
申请人： Yoshitaka Dozen , Tomoyuki Aoki , Hidekazu Takahashi , Daiki Yamada , Kaori Ogita , Naoto Kusumoto
发明人： Yoshitaka Dozen , Tomoyuki Aoki , Hidekazu Takahashi , Daiki Yamada , Kaori Ogita , Naoto Kusumoto
IPC分类号： H01L29/786
CPC分类号： D21H21/48 , B32B29/00 , D21H27/32 , G06K19/07749 , H01L23/49855 , H01L27/1214 , H01L27/1255 , H01L27/1266 , H01L29/78603 , H01L2924/0002 , H01L2924/00
摘要： Paper embedded with a semiconductor device capable of communicating wirelessly is realized, whose unevenness of a portion including the semiconductor device does not stand out and the paper is thin with a thickness of less than or equal to 130 μm. A semiconductor device is provided with a circuit portion and an antenna, and the circuit portion includes a thin film transistor. The circuit portion and the antenna are separated from a substrate used during manufacturing, and are interposed between a flexible base and a sealing layer and protected. The semiconductor device can be bent, and the thickness of the semiconductor device itself is less than or equal to 30 μm. The semiconductor device is embedded in a paper in a papermaking process.
摘要翻译：实现了能够无线地进行通信的半导体装置的纸，其中包含半导体装置的部分的不均匀性不突出，并且纸薄而厚度小于或等于130μm。半导体器件设置有电路部分和天线，并且电路部分包括薄膜晶体管。电路部分和天线与在制造期间使用的基板分离，并且被插入在柔性基底和密封层之间并被保护。半导体器件可以弯曲，并且半导体器件本身的厚度小于或等于30μm。半导体器件以造纸工艺嵌入纸中。

5. 发明申请

US20120001181A1 LAYER HAVING FUNCTIONALITY, METHOD FOR FORMING FLEXIBLE SUBSTRATE HAVING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
标题翻译：具有功能的层，用于形成具有该功能的柔性基板的方法以及制造半导体器件的方法
公开(公告)号：US20120001181A1
公开(公告)日：2012-01-05
申请号：US13232011
申请日：2011-09-14
申请人： Tomoyuki AOKI , Takuya TSURUME
发明人： Tomoyuki AOKI , Takuya TSURUME
IPC分类号： H01L29/786
CPC分类号： H01Q7/00 , G02F1/133305 , G02F1/1362 , G02F2001/13613 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/0106 , H01L2924/01067 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H01Q1/38 , H05K3/207 , H05K3/28 , H05K2203/016 , H05K2203/0531 , H01L2224/81 , H01L2924/00
摘要： It is an object of the present invention to provide a method for forming a layer having functionality including a conductive layer and a colored layer and a flexible substrate having a layer having functionality with a high yield. Further, it is an object of the present invention to provide a method for manufacturing a semiconductor device that is small-sized, thin, and lightweight. After coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, after attaching an adhesive to the layer having functionality, the layer having functionality is peeled from the substrate. Further, after coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, an adhesive is attached to the layer having functionality. Thereafter, the layer having functionality is peeled from the substrate, and a flexible substrate is attached to the layer having functionality.
摘要翻译：本发明的目的是提供一种形成具有包括导电层和着色层的功能的层的方法和具有具有高产率功能的层的柔性基板。此外，本发明的目的是提供一种小型，薄型和轻量化的半导体器件的制造方法。用硅烷偶联剂涂布具有耐热性的基材后，形成具有官能团的层。然后，在将粘合剂粘贴到具有官能团的层上之后，将具有官能团的层从基材上剥离。此外，在用硅烷偶联剂涂布具有耐热性的基材之后，形成具有官能团的层。然后，将粘合剂附着到具有功能性的层上。此后，具有功能性的层从基板剥离，并且柔性基板附着到具有功能的层。

6. 发明申请

US20110309904A1 ANTENNA, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING ANTENNA 有权
标题翻译：天线，半导体器件和制造天线的方法
公开(公告)号：US20110309904A1
公开(公告)日：2011-12-22
申请号：US13157645
申请日：2011-06-10
申请人： Tomoyuki AOKI , Susumu SEKIGUCHI , Shingo EGUCHI
发明人： Tomoyuki AOKI , Susumu SEKIGUCHI , Shingo EGUCHI
IPC分类号： H01F17/00 , H01P11/00
CPC分类号： G06K19/07794 , G06K19/077 , G06K19/07773 , H01F5/003 , H01F41/041 , H01Q1/2225 , H01Q7/00 , Y10T29/49016 , Y10T29/49018
摘要： In an antenna and a semiconductor device including the antenna, an object is to reduce the distance between electrodes of a capacitor as much as possible, reduce the area of the electrode of the capacitor as much as possible, and prevent the suppression of response sensitivity and a response range of the semiconductor device. The present invention relates to an antenna including an antenna coil provided over a first region of a base and a capacitor which uses a second region of the base as a dielectric body and which has electrodes provided for opposite planes of the second region of the base, wherein the second region of the base is thinner than the first region of the base, and also relates to a semiconductor device including the antenna.
摘要翻译：在包括天线的天线和半导体装置中，目的是尽可能地减小电容器的电极之间的距离，尽可能地减小电容器的电极的面积，并且防止响应灵敏度的抑制，半导体器件的响应范围。本发明涉及一种天线，包括设置在基座的第一区域上的天线线圈和使用基座的第二区域作为电介质体的电容器，并且具有设置在基座的第二区域的相对平面的电极，其中所述基座的所述第二区域比所述基底的所述第一区域薄，并且还涉及包括所述天线的半导体器件。

7. 发明授权

US08030178B2 Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device 有权
标题翻译：具有功能的层，具有该层的柔性基板的形成方法以及半导体装置的制造方法
公开(公告)号：US08030178B2
公开(公告)日：2011-10-04
申请号：US12618956
申请日：2009-11-16
申请人： Tomoyuki Aoki , Takuya Tsurume
发明人： Tomoyuki Aoki , Takuya Tsurume
IPC分类号： H01L21/46 , H01L21/469 , H01L21/31 , H01L21/84 , H01L21/205 , H01L21/331 , H01L21/336
CPC分类号： H01Q7/00 , G02F1/133305 , G02F1/1362 , G02F2001/13613 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/0106 , H01L2924/01067 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H01Q1/38 , H05K3/207 , H05K3/28 , H05K2203/016 , H05K2203/0531 , H01L2224/81 , H01L2924/00
摘要： It is an object of the present invention to provide a method for forming a layer having functionality including a conductive layer and a colored layer and a flexible substrate having a layer having functionality with a high yield. Further, it is an object of the present invention to provide a method for manufacturing a semiconductor device that is small-sized, thin, and lightweight. After coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, after attaching an adhesive to the layer having functionality, the layer having functionality is peeled from the substrate. Further, after coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, an adhesive is attached to the layer having functionality. Thereafter, the layer having functionality is peeled from the substrate, and a flexible substrate is attached to the layer having functionality.
摘要翻译：本发明的目的是提供一种形成具有包括导电层和着色层的功能的层的方法和具有具有高产率功能的层的柔性基板。此外，本发明的目的是提供一种小型，薄型和轻量化的半导体器件的制造方法。用硅烷偶联剂涂布具有耐热性的基材后，形成具有官能团的层。然后，在将粘合剂粘贴到具有官能团的层上之后，将具有官能团的层从基材上剥离。此外，在用硅烷偶联剂涂布具有耐热性的基材之后，形成具有官能团的层。然后，将粘合剂附着到具有功能性的层上。此后，具有功能性的层从基板剥离，并且柔性基板附着到具有功能的层。

8. 发明授权

US07915058B2 Substrate having pattern and method for manufacturing the same, and semiconductor device and method for manufacturing the same 有权
标题翻译：具有图案的基板及其制造方法，以及半导体装置及其制造方法
公开(公告)号：US07915058B2
公开(公告)日：2011-03-29
申请号：US11334474
申请日：2006-01-19
申请人： Tomoyuki Aoki , Koji Dairiki
发明人： Tomoyuki Aoki , Koji Dairiki
IPC分类号： H01L21/00
CPC分类号： H01L23/49894 , C03C17/3649 , G02F1/13439 , H01L21/4867 , H01L21/6835 , H01L27/3244 , H01L27/3281 , H01L27/3297 , H01L51/0021 , H01L51/524 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H01L2924/00
摘要： The present invention provides a method for manufacturing a substrate having a pattern that is capable of controlling the distance between adjacent film patterns, and also provides a method for manufacturing a substrate, particularly, having a pattern with a narrow width and a thickness that is capable of controlling the width between the film patterns. The present invention provides a method for manufacturing a substrate having a conductive film that serves as an antenna with a little variation in inductance and has a large electromotive force, and provides a method for manufacturing a semiconductor device with high yield. After forming a film in which silicon and oxygen are combined and an inactive group is combined with the silicon over a substrate, an insulating film, or a conductive film, a composition is printed by the printing method thereover, and is baked to form a film pattern.
摘要翻译：本发明提供了一种制造具有能够控制相邻膜图案之间的距离的图案的基板的制造方法，并且还提供了一种制造基板的方法，特别是具有窄的宽度和厚度的图案控制胶片图案之间的宽度。本发明提供一种制造具有导电膜的基板的方法，该导电膜用作具有小的电感变化的天线，并且具有大的电动势，并且提供了一种以高产率制造半导体器件的方法。在其中组合硅和氧并且非活性基团与硅在基底，绝缘膜或导电膜上组合的膜之后，通过其上的印刷方法印刷组合物，并且被烘烤以形成膜模式。

9. 发明申请

US20100126681A1 PAPER INCLUDING SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：包括半导体器件的纸张及其制造方法
公开(公告)号：US20100126681A1
公开(公告)日：2010-05-27
申请号：US12694505
申请日：2010-01-27
申请人： Yoshitaka DOZEN , Tomoyuki AOKI , Hidekazu TAKAHASHI , Daiki YAMADA , Kaori OGITA , Naoto KUSUMOTO
发明人： Yoshitaka DOZEN , Tomoyuki AOKI , Hidekazu TAKAHASHI , Daiki YAMADA , Kaori OGITA , Naoto KUSUMOTO
IPC分类号： D21H23/00
CPC分类号： D21H21/48 , B32B29/00 , D21H27/32 , G06K19/07749 , H01L23/49855 , H01L27/1214 , H01L27/1255 , H01L27/1266 , H01L29/78603 , H01L2924/0002 , H01L2924/00
摘要： Paper embedded with a semiconductor device capable of communicating wirelessly is realized, whose unevenness of a portion including the semiconductor device does not stand out and the paper is thin with a thickness of less than or equal to 130 μm. A semiconductor device is provided with a circuit portion and an antenna, and the circuit portion includes a thin film transistor. The circuit portion and the antenna are separated from a substrate used during manufacturing, and are interposed between a flexible base and a sealing layer and protected. The semiconductor device can be bent, and the thickness of the semiconductor device itself is less than or equal to 30 μm. The semiconductor device is embedded in a paper in a papermaking process.
摘要翻译：实现了能够无线地进行通信的半导体装置的纸，其中包含半导体装置的部分的不均匀性不突出，并且纸薄而厚度小于或等于130μm。半导体器件设置有电路部分和天线，并且电路部分包括薄膜晶体管。电路部分和天线与在制造期间使用的基板分离，并且被插入在柔性基底和密封层之间并被保护。半导体器件可以弯曲，并且半导体器件本身的厚度小于或等于30μm。半导体器件以造纸工艺嵌入纸中。

10. 发明申请

US20100062569A1 LAYER HAVING FUNCTIONALITY, METHOD FOR FORMING FLEXIBLE SUBSTRATE HAVING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
标题翻译：具有功能的层，用于形成具有该功能的柔性基板的方法以及制造半导体器件的方法
公开(公告)号：US20100062569A1
公开(公告)日：2010-03-11
申请号：US12618956
申请日：2009-11-16
申请人： Tomoyuki Aoki , Takuya Tsurume
发明人： Tomoyuki Aoki , Takuya Tsurume
IPC分类号： H01L21/60 , C09D5/20 , B05D5/10
CPC分类号： H01Q7/00 , G02F1/133305 , G02F1/1362 , G02F2001/13613 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/0106 , H01L2924/01067 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H01Q1/38 , H05K3/207 , H05K3/28 , H05K2203/016 , H05K2203/0531 , H01L2224/81 , H01L2924/00
摘要： It is an object of the present invention to provide a method for forming a layer having functionality including a conductive layer and a colored layer and a flexible substrate having a layer having functionality with a high yield. Further, it is an object of the present invention to provide a method for manufacturing a semiconductor device that is small-sized, thin, and lightweight. After coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, after attaching an adhesive to the layer having functionality, the layer having functionality is peeled from the substrate. Further, after coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, an adhesive is attached to the layer having functionality. Thereafter, the layer having functionality is peeled from the substrate, and a flexible substrate is attached to the layer having functionality.
摘要翻译：本发明的目的是提供一种形成具有包括导电层和着色层的功能的层的方法和具有具有高产率功能的层的柔性基板。此外，本发明的目的是提供一种小型，薄型和轻量化的半导体器件的制造方法。用硅烷偶联剂涂布具有耐热性的基材后，形成具有官能团的层。然后，在将粘合剂粘贴到具有官能团的层上之后，将具有官能团的层从基材上剥离。此外，在用硅烷偶联剂涂布具有耐热性的基材之后，形成具有官能团的层。然后，将粘合剂附着到具有功能性的层上。此后，具有功能性的层从基板剥离，并且柔性基板附着到具有功能的层。

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