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71. 发明授权

US07608160B2 Laminated microfluidic structures and method for making 有权
标题翻译：层压微流体结构及其制造方法
公开(公告)号：US07608160B2
公开(公告)日：2009-10-27
申请号：US10964216
申请日：2004-10-13
申请人： Peng Zhou , Lincoln C. Young
发明人： Peng Zhou , Lincoln C. Young
IPC分类号： B32B38/04
CPC分类号： B32B37/0038 , B01F5/0683 , B01F5/0688 , B01F11/0071 , B01F13/0059 , B01L3/502707 , B01L2200/12 , B01L2300/0816 , B01L2300/0861 , B01L2300/0867 , B01L2300/0887 , B01L2400/0481 , B01L2400/0655 , B01L2400/084 , B29C65/4895 , B29C66/1122 , B29C66/54 , B29C66/543 , B29C66/71 , B29C66/83411 , B29C66/8362 , B29L2031/756 , F04B43/043 , F04B43/06 , F16K99/0001 , F16K99/0015 , F16K99/0021 , F16K99/0034 , F16K99/0055 , F16K99/0057 , F16K2099/0074 , F16K2099/0078 , F16K2099/0084 , F16K2099/0094 , Y10T156/1002 , B29K2069/00 , B29K2033/08 , B29K2025/06
摘要： A method for making a polymeric microfluidic structure in which two or more components (layers) of the microfluidic structure are fixedly bonded or laminated with a weak solvent bonding agent, particularly acetonitrile or a mixture of acetonitrile and alcohol. In an aspect, acetonitrile can be used as a weak solvent bonding agent to enclose a microstructure fabricated in or on a non-elastomeric polymer such as polystyrene, polycarbonate, acrylic or other linear polymer to form a three-dimensional microfluidic network. The method involves the steps of wetting at least one of the opposing surfaces of the polymeric substrate components with the weak solvent bonding agent in a given, lower temperature range, adjacently contacting the opposing surfaces, and thermally activating the bonding agent at a higher temperature than the lower temperature range for a given period of time. The contacted polymeric substrates may also be aligned prior to thermal activation and compressed during thermal activation. A laminated, polymeric microfluidic structure is also disclosed.
摘要翻译：一种制备聚合微流体结构的方法，其中微流体结构的两个或多个组分（层）用弱溶剂粘合剂，特别是乙腈或乙腈和醇的混合物固定粘合或层压。在一个方面，乙腈可以用作弱溶剂粘合剂以包围在非弹性聚合物如聚苯乙烯，聚碳酸酯，丙烯酸或其它线性聚合物中或其上制造的微结构，以形成三维微流体网络。该方法包括以下步骤：在给定的较低温度范围内用弱溶剂粘合剂润湿聚合物基材组分的至少一个相对表面，相邻接触相对表面，并在比给定时间段的较低温度范围。接触的聚合物基材还可以在热活化之前对准，并在热活化期间被压缩。还公开了层压聚合物微流体结构。

72. 发明授权

US07497549B2 Printer with cap mechanism 失效
标题翻译：带盖机构的打印机
公开(公告)号：US07497549B2
公开(公告)日：2009-03-03
申请号：US11400213
申请日：2006-04-10
申请人： Peng Zhou
发明人： Peng Zhou
IPC分类号： B41J2/165
CPC分类号： B41J2/16508
摘要： A printer with a cap mechanism. The printer comprises a print head comprising a nozzle, a cap module comprising a cap and a hole, and a positioning module comprising a pin. When the print head moves in a first direction to push the positioning module, the pin escapes from the hole, whereby the cap module moving in a second direction enables the cap to cover the nozzle. When the print head moves in a direction opposite to the first direction, the pin enters the hole enabling the cap module to maintain a predetermined distance from the print head.
摘要翻译：具有盖机构的打印机。该打印机包括一个打印头，该打印头包括一个喷嘴，一个包括一个盖子和一个孔的盖子模块，以及一个包括销子的定位模块。当打印头沿第一方向移动以推动定位模块时，销从孔中逸出，由此盖模块沿第二方向移动使盖能够覆盖喷嘴。当打印头沿与第一方向相反的方向移动时，销进入孔，使盖模块能够保持与打印头的预定距离。

73. 外观设计

USD574003S1 Front bezel for a computer enclosure 有权
公开(公告)号：USD574003S1
公开(公告)日：2008-07-29
申请号：US29281701
申请日：2007-06-29
申请人： Chang-Sheng Zhou , Chun-Chi Liang , Jiing-Renn Yu , Peng Zhou
设计人： Chang-Sheng Zhou , Chun-Chi Liang , Jiing-Renn Yu , Peng Zhou

74. 外观设计

USD560667S1 Side panel for computer enclosure 有权
标题翻译：电脑机箱侧面板
公开(公告)号：USD560667S1
公开(公告)日：2008-01-29
申请号：US29255607
申请日：2006-03-10
申请人： Peng Zhou
设计人： Peng Zhou

75. 发明申请

US20080013278A1 Reservoir for liquid cooling systems used to provide make-up fluid and trap gas bubbles 审中-公开
标题翻译：用于液体冷却系统的水箱用于提供补充液和捕集气泡
公开(公告)号：US20080013278A1
公开(公告)日：2008-01-17
申请号：US11823525
申请日：2007-06-27
申请人： Fredric Landry , Bruce Conway , Richard Brewer , Norman Chow , Peng Zhou , Tien-Chih (Eric) Lin
发明人： Fredric Landry , Bruce Conway , Richard Brewer , Norman Chow , Peng Zhou , Tien-Chih (Eric) Lin
IPC分类号： H05K7/20
CPC分类号： H05K7/20272 , F28D15/00 , G06F1/20 , G06F2200/201
摘要： A fluid compensation apparatus is configured to provide replacement fluid to a fluid-based cooling loop, while removing dissolved gas or gas in gross bubbles from the cooling loop. Removal or reduction of gas from the cooling loop reduces or prevents pump vapor lock. The removed gas is retained within the fluid compensation apparatus. The fluid compensation apparatus is configured to prevent the trapped gas from being re-introduced to the fluid-based cooling loop, regardless of the orientation of the fluid compensation apparatus. Additionally, the fluid compensation apparatus is configured to remove gas from and add fluid to the cooling loop with limited or no pressure drop between the inlet port and the outlet port of the fluid compensation apparatus. As a result, the pump does not require additional power to compensate for such a pressure differential.
摘要翻译：液体补偿装置被配置为向基于流体的冷却回路提供更换流体，同时从冷却回路中除去大气泡中的溶解气体或气体。从冷却回路中去除或还原气体会降低或防止泵蒸气锁定。去除的气体保留在流体补偿装置内。流体补偿装置被配置为防止被捕获的气体被重新引入基于流体的冷却回路，而与流体补偿装置的取向无关。此外，流体补偿装置构造成在流体补偿装置的入口和出口之间有限或没有压力降，从而从流体中除去气体并向流体补充流体。因此，泵不需要额外的功率来补偿这种压力差。

76. 发明申请

US20070256825A1 Methodology for the liquid cooling of heat generating components mounted on a daughter card/expansion card in a personal computer through the use of a remote drive bay heat exchanger with a flexible fluid interconnect 审中-公开
标题翻译：通过使用具有柔性流体互连的远程驱动室热交换器来安装在个人计算机的子卡/扩展卡上的发热部件的液体冷却的方法
公开(公告)号：US20070256825A1
公开(公告)日：2007-11-08
申请号：US11800303
申请日：2007-05-03
申请人： Bruce Conway , Richard Brewer , Paul Tsao , James Hom , Douglas Werner , Peng Zhou , Girish Upadhya , Madhav Datta , Ali Firouzi , Fredric Landry
发明人： Bruce Conway , Richard Brewer , Paul Tsao , James Hom , Douglas Werner , Peng Zhou , Girish Upadhya , Madhav Datta , Ali Firouzi , Fredric Landry
IPC分类号： G05D23/00 , H01L23/467
CPC分类号： G06F1/20 , G06F2200/201 , H01L2924/0002 , H01L2924/00
摘要： A cooling system includes a cooling unit configured to fit within a single drive bay of a personal computer. The cooling unit includes a fluid-to-air heat exchanger, an air mover, a pump, fluid lines, and control circuitry. The cooling system also includes a cooling loop configured to be coupled to one or more heat generating devices. The cooling loop includes the pump and the fluid-to-air heat exchanger from the cooling unit, and at least one heat exchanger coupled together via flexible fluid lines. The heat exchanger is thermally coupled to the heat generating device. The cooling unit is configured to maintain noise below a specified acoustical specification. To meet this acoustical specification, the size, position, and type of the components within the cooling unit are specifically configured.
摘要翻译：冷却系统包括被配置为装配在个人计算机的单个驱动器托架内的冷却单元。冷却单元包括流体对空气热交换器，鼓风机，泵，流体管线和控制电路。冷却系统还包括被配置为联接到一个或多个发热装置的冷却回路。冷却回路包括来自冷却单元的泵和流体对空气热交换器，以及通过柔性流体管线连接在一起的至少一个热交换器。热交换器热耦合到发热装置。冷却单元被配置为将噪声保持在低于规定声学规范的范围内。为了达到这种声学规格，冷却装置内的部件的尺寸，位置和类型被特别地配置。

77. 发明申请

US20070034356A1 Cooling systems incorporating heat exchangers and thermoelectric layers 有权
标题翻译：包括热交换器和热电层的冷却系统
公开(公告)号：US20070034356A1
公开(公告)日：2007-02-15
申请号：US11582657
申请日：2006-10-17
申请人： Thomas Kenny , Mark Munch , Peng Zhou , James Shook , Kenneth Goodson , Dave Corbin , Mark McMaster , James Lovette
发明人： Thomas Kenny , Mark Munch , Peng Zhou , James Shook , Kenneth Goodson , Dave Corbin , Mark McMaster , James Lovette
IPC分类号： H05K7/20
CPC分类号： F04B17/00 , F04B19/006 , F25B21/02 , F25B2321/0252 , F28D15/00 , F28D15/0266 , F28D21/0015 , F28D2021/0029 , F28F3/02 , F28F3/086 , F28F3/12 , F28F13/06 , F28F13/185 , F28F2210/10 , F28F2245/02 , F28F2260/02 , G06F1/20 , G06F2200/201 , G06Q20/20 , H01L23/38 , H01L23/473 , H01L23/4735 , H01L35/30 , H01L2924/0002 , H01L2924/00
摘要： A method and system for cooling a heat source are presented. The system includes a fluid heat exchanger, a pump, a thermoelectric device having a cooling portion and a heating portion, and a heat rejector configured to be in thermal contact with at least a portion of the heating portion of the thermoelectric device. The pump is coupled with the fluid heat exchanger and configured to pass a fluid therethrough. The thermoelectric device is configured along with the heat exchanger in a cooling system to enhance the cooling efficiency of the system.
摘要翻译：提出了一种用于冷却热源的方法和系统。该系统包括流体热交换器，泵，具有冷却部分和加热部分的热电装置，以及配置为与热电装置的加热部分的至少一部分热接触的散热器。泵与流体热交换器联接并且构造成使流体通过其中。热电装置与冷却系统中的热交换器一起配置，以提高系统的冷却效率。

78. 外观设计

USD517080S1 Front bezel for computer enclosure 有权
公开(公告)号：USD517080S1
公开(公告)日：2006-03-14
申请号：US29220427
申请日：2004-12-29
申请人： Peng Zhou , Chun-Chi Liang , Yun-Dong Xu
设计人： Peng Zhou , Chun-Chi Liang , Yun-Dong Xu

79. 发明授权

US07000684B2 Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device 有权
标题翻译：用于冷却发热装置的有效的垂直流体输送的方法和装置
公开(公告)号：US07000684B2
公开(公告)日：2006-02-21
申请号：US10680584
申请日：2003-10-06
申请人： Thomas W. Kenny , Mark Munch , Peng Zhou , James Gill Shook , Girish Upadhya , Kenneth Goodson , Dave Corbin , Mark McMaster , James Lovette
发明人： Thomas W. Kenny , Mark Munch , Peng Zhou , James Gill Shook , Girish Upadhya , Kenneth Goodson , Dave Corbin , Mark McMaster , James Lovette
IPC分类号： F28F7/00
CPC分类号： F04B17/00 , F04B19/006 , F28D15/00 , F28D15/0266 , F28D21/0015 , F28D2021/0029 , F28F3/02 , F28F3/086 , F28F3/12 , F28F13/06 , F28F13/185 , F28F2210/10 , F28F2245/04 , F28F2260/02 , G06Q20/20 , H01L23/473 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holes are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the first set is positioned a closest optimal distance to an adjacent hole the second set.
摘要翻译：热交换器及其制造方法包括用于冷却热源的界面层。界面层耦合到热源并被配置成使流体从中流过。热交换器还包括耦合到界面层的歧管层。歧管层包括至少一个第一端口，其耦合到第一组个体化的孔，其将流体通过第一组。歧管层包括耦合到第二组个体化孔的至少一个第二端口，其将流体通过第二组。第一组孔和第二组孔布置成在第一和第二端口之间提供最小化的流体路径距离，以充分冷却热源。优选地，第一组中的每个孔定位成与第二组的相邻孔最接近的最佳距离。

80. 发明授权

US09099178B2 Resistive random access memory with electric-field strengthened layer and manufacturing method thereof 有权
标题翻译：具有电场强化层的电阻随机存取存储器及其制造方法
公开(公告)号：US09099178B2
公开(公告)日：2015-08-04
申请号：US13457035
申请日：2012-04-26
申请人： Wei Zhang , Lin Chen , Peng Zhou , Qingqing Sun , Pengfei Wang
发明人： Wei Zhang , Lin Chen , Peng Zhou , Qingqing Sun , Pengfei Wang
IPC分类号： H01L29/86 , H01L27/24 , G11C13/00 , H01L45/00
CPC分类号： G11C13/0007 , G11C2213/55 , H01L27/2436 , H01L45/04 , H01L45/1233 , H01L45/146 , H01L45/1616
摘要： This invention belongs to the technical field of memories and specifically relates to a resistive random access memory structure with an electric-field strengthened layer and a manufacturing method thereof. The resistive random access memory in the present invention can include a top electrode, a bottom electrode and a composite layer which is placed between the top electrode and the bottom electrode and have a first resistive switching layer and a second resistive switching and electric-field strengthened layer; the second resistive switching and electric-field strengthened layer cab be adjacent to the first resistive switching layer and have a dielectric constant lower than that of the first resistive switching layer. The electric-field distribution in the RRAM unit is adjustable.
摘要翻译：本发明属于存储器的技术领域，具体涉及一种具有电场强化层的电阻随机存取存储器结构及其制造方法。本发明的电阻式随机存取存储器可以包括顶电极，底电极和复合层，它放置在顶电极和底电极之间，并具有第一电阻开关层和第二电阻开关和电场强化层; 第二电阻开关和电场强化层驾驶室与第一电阻式开关层相邻，其介电常数低于第一电阻式开关层的介电常数。 RRAM单元中的电场分布是可调的。

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