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    • 71. 发明申请
    • Method and system for providing interactive testing of integrated circuits
    • 提供集成电路交互式测试的方法和系统
    • US20050204237A1
    • 2005-09-15
    • US10789710
    • 2004-02-27
    • Todd BurdineFranco MotikaPeilin Song
    • Todd BurdineFranco MotikaPeilin Song
    • G01R31/28G06F11/00
    • G06F11/261G01R31/31703G01R31/318371G06F11/263
    • A method for providing interactive and iterative testing of integrated circuits including the receiving of a first failing region. The first failing region corresponds to one or more circuits on the integrated circuit. The method generates a set of adaptive algorithmic test patterns for the one or more circuits in response to the first failing region and to a logic model of the integrated circuit. Expected results for the test patterns are determined. The method includes applying the test patterns to the first failing region on the integrated circuit resulting in actual results for the test patterns. The expected results to the actual results are compared. The method also transmits mismatches between the expected results and the actual results to a fault simulator. The method includes receiving a second failing region from the fault simulator, the second failing region created in response to the mismatches and the logic model, and the second failing region corresponding to a subset of the one or more circuits on the integrated circuit.
    • 一种用于提供集成电路的交互式和迭代测试的方法,包括接收第一故障区域。 第一故障区域对应于集成电路上的一个或多个电路。 该方法响应于第一故障区域和集成电路的逻辑模型生成针对一个或多个电路的一组自适应算法测试模式。 确定测试模式的预期结果。 该方法包括将测试图案应用于集成电路上的第一故障区域,从而得到测试图案的实际结果。 对实际结果的预期结果进行比较。 该方法还将预期结果与实际结果之间的错配传输到故障模拟器。 该方法包括从故障模拟器接收第二故障区域,响应于不匹配和逻辑模型而创建的第二故障区域,以及对应于集成电路上的一个或多个电路的子集的第二故障区域。
    • 74. 发明授权
    • Angular spectrum tailoring in solid immersion microscopy for circuit analysis
    • 用于电路分析的固体浸液显微镜中的角度光谱裁剪
    • US07826045B2
    • 2010-11-02
    • US12020157
    • 2008-01-25
    • Stephen Bradley IppolitoDarrell L. MilesPeilin SongJohn D. Sylvestri
    • Stephen Bradley IppolitoDarrell L. MilesPeilin SongJohn D. Sylvestri
    • G01N21/00
    • G01R31/311
    • A method and structure for locating a fault in a semiconductor chip. The chip includes a substrate on a dielectric interconnect. A first electrical response image of the chip, which includes a spot representing the fault, is overlayed on a first reflection image for monochromatic light in an optical path from an optical microscope through a SIL/NAIL and into the chip. The index of refraction of the substrate exceeds that of the dielectric interconnect and is equal to that of the SIL/NAIL. A second electrical response image of the chip is overlayed on a second reflection image for the monochromatic light in an optical path in which an optical stop prevents all subcritical angular components of the monochromatic light from being incident on the SIL/NAIL. If the second electrical response image includes or does not include the spot, then the fault is in the substrate or the dielectric interconnect, respectively.
    • 一种用于定位半导体芯片中的故障的方法和结构。 芯片包括电介质互连上的衬底。 包括代表故障的点的芯片的第一电响应图像重叠在从光学显微镜通过SIL / NAIL并进入芯片的光路中的单色光的第一反射图像上。 衬底的折射率超过电介质互连的折射率,等于SIL / NAIL的折射率。 芯片的第二电响应图像覆盖在光路中的单色光的第二反射图像上,其中光学停止器防止单色光的所有亚临界角分量入射到SIL / NAIL上。 如果第二电响应图像包括或不包括点,则故障分别在基板或电介质互连中。
    • 75. 发明授权
    • Stuck-at fault scan chain diagnostic method
    • 堵塞故障扫描链诊断方法
    • US07010735B2
    • 2006-03-07
    • US10043486
    • 2002-01-10
    • Franco MotikaPhilip J. NighPeilin Song
    • Franco MotikaPhilip J. NighPeilin Song
    • G01R31/28
    • G11C29/025G01R31/318342G11C29/02G11C29/32
    • While data cannot be transmitted down a scan chain through a stuck-at fault location, data in properly operating latches downstream of the stuck-at fault location can be shifted down the chain. By varying operating parameters, such as power supply and reference voltages, clock timing patterns, temperature and timing sequences, one or more latches down the SRL chain from the stuck-at fault location may be triggered to change state from the stuck-at fault value. The SRL chain is then operated to shift data out the output of the SRL chain. The output is monitored and any change in value from the stuck-at state is noted as identifying all good latch positions to end of the chain. The process is repeated: varying each of the selected operating parameters until the latch position following the stuck-at fault latch is identified.
    • 虽然数据不能通过卡住的故障位置沿扫描链传输,但在卡住故障位置下游的正确操作的锁存器中的数据可以向下移动。 通过改变操作参数,例如电源和参考电压,时钟时序模式,温度和时序,可以触发从链路故障位置向下链接的一个或多个锁存器,以将状态从卡入故障值 。 然后运行SRL链将数据移出SRL链的输出。 输出被监视,并且从卡入状态的值的任何变化被注意为将所有良好的锁定位置识别到链的末端。 重复该过程:改变所选择的每个操作参数,直到识别出卡入故障锁存之后的锁存位置。
    • 77. 发明授权
    • Random path delay testing methodology
    • 随机路径延迟测试方法
    • US06728914B2
    • 2004-04-27
    • US09745603
    • 2000-12-22
    • Kevin William McCauleyWilliam Vincent HuottMary Prilotski KuskoPeilin SongRichard Frank RizzoloUlrich BaurFranco Motika
    • Kevin William McCauleyWilliam Vincent HuottMary Prilotski KuskoPeilin SongRichard Frank RizzoloUlrich BaurFranco Motika
    • G01R3128
    • G01R31/318385G01R31/31858
    • For each logic gate in a logic circuit, all paths containing the gate are determined and the paths are classified by their length between each of the input or launch SRLs and each output or capture SRL. The paths are assigned a single threshold value and then divided into two groups in accordance with their path length classification relative to the threshold value with all paths in each group treated as a single path. Pseudo random LBIST patterns are then simulated using standard LBIST tool. When a fault associated with a logic gate is detected by a capture SRL of a path with a length above the threshold, the fault is viewed as tested and marked off from the fault list. When a fault is detected in any path that is below the threshold, it is not marked off and testing of the fault continues until testing patterns for all the paths of the group falling below the threshold value are simulated. When all the faults paths of the group falling below the threshold have been tested, a separate determined test generation program is activated. In the generated test, the fault is forced to propagate through the longest path above the threshold value.
    • 对于逻辑电路中的每个逻辑门,确定包含门的所有路径,并且通过其每个输入或启动SRL和每个输出或捕获SRL之间的长度对路径进行分类。 路径被分配单个阈值,然后根据它们相对于阈值的路径长度分类被分成两组,每组中的所有路径被视为单个路径。 然后使用标准LBIST工具模拟伪随机LBIST图案。 当与逻辑门相关联的故障由长度高于阈值的路径的捕获​​SRL检测到时,故障被视为测试并从故障列表中标记出来。 当在低于阈值的任何路径中检测到故障时,它不会被标记,并且故障的测试继续进行,直到测试模式为低于阈值的组的所有路径。 当组件的所有故障路径都低于阈值时,已经测试了单独确定的测试生成程序。 在生成的测试中,故障被迫通过超过阈值的最长路径传播。