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71. 发明申请

US20110140144A1 PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：用于光学元件的封装基板及其制造方法
公开(公告)号：US20110140144A1
公开(公告)日：2011-06-16
申请号：US12721539
申请日：2010-03-10
申请人： Chang Hyun Lim , Seog Moon Choi , Sang Hyun Shin , Sung Keun Park , Young Ki Lee
发明人： Chang Hyun Lim , Seog Moon Choi , Sang Hyun Shin , Sung Keun Park , Young Ki Lee
IPC分类号： H01L33/00 , H01L31/00
CPC分类号： H01L33/54 , H01L33/505 , H01L33/62 , H01L2224/32225 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014
摘要： Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided.
摘要翻译：公开了一种用于光学元件的封装基板，其包括基底基板，形成在基底基板上并包括安装部分的第一电路层，安装在安装部分上的光学元件，形成为预定图案的一个或多个沟槽通过去除第一电路层的部分使得第一电路层和光学元件彼此电连接的安装部分和施加在由沟槽限定的区域以覆盖光学元件的荧光树脂材料，以及其中这种沟槽形成在第一电路层上，使得光学元件和第一电路层彼此电连接，从而保持荧光树脂材料的形状，并且消除了在光学元件下形成通孔的需要。还提供了一种制造用于光学元件的封装衬底的方法。

72. 发明申请

US20110101392A1 PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：用于光学元件的封装基板及其制造方法
公开(公告)号：US20110101392A1
公开(公告)日：2011-05-05
申请号：US12642326
申请日：2009-12-18
申请人： Sung Keun Park , Seog Moon Choi , Young Ki Lee , Chang Hyun Lim
发明人： Sung Keun Park , Seog Moon Choi , Young Ki Lee , Chang Hyun Lim
IPC分类号： H01L33/00 , H01L21/56
CPC分类号： H01L33/50 , H01L33/486 , H01L33/64 , H01L2224/48091 , H01L2224/48227 , H01L2224/8592 , H01L2924/01322 , H01L2924/181 , H01L2933/0041 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Disclosed is a package substrate for an optical element, which includes a metal core having a hole formed therein, an insulating layer formed on the surface of the metal core, a first metal layer formed to a predetermined thickness on the surface of the insulating layer so as to include therein the metal core insulated by the insulating layer, an optical element mounted on the first metal layer, and a fluorescent resin material applied on the optical element in order to protect the optical element, thereby simplifying a package substrate process and improving light uniformity, light reflectivity and heat dissipating properties compared to a conventional configuration. A method of manufacturing the package substrate is also provided.
摘要翻译：公开了一种用于光学元件的封装基板，其包括其中形成有孔的金属芯，形成在金属芯的表面上的绝缘层，在绝缘层的表面上形成为预定厚度的第一金属层，在其中包括由绝缘层绝缘的金属芯，安装在第一金属层上的光学元件和施加在光学元件上的荧光树脂材料，以保护光学元件，从而简化了封装衬底处理和改善光均匀性，光反射率和散热特性。还提供了制造封装基板的方法。

73. 发明授权

US07895188B2 Processing method of data stream using border monitoring query 有权
标题翻译：使用边界监控查询的数据流处理方法
公开(公告)号：US07895188B2
公开(公告)日：2011-02-22
申请号：US11741923
申请日：2007-04-30
申请人： Jin Won Lee , Young Ki Lee , Seung Woo Kang , Sang Jeong Lee , Hyun Ju Jin , Byung Jip Kim , June Hwa Song
发明人： Jin Won Lee , Young Ki Lee , Seung Woo Kang , Sang Jeong Lee , Hyun Ju Jin , Byung Jip Kim , June Hwa Song
IPC分类号： G06F7/00 , G06F17/30
CPC分类号： G06F17/30675
摘要： The present invention relates to a processing method of data stream using Border Monitoring Query, and more particularly a monitoring method and a system for data streams which are a large volume of data and continuously generated such as financial ticker, GPS data or a ubiquitous sensor network (USN).The objectives of the present invention are to process a large number of BMQs over data streams in high-performance and scalable manner. For this purpose, the invention presents BMQ-Index, a scalable and high performance data stream monitoring framework. The main idea of BMQ-Index is shared and incremental processing. For shared processing, BMQ-Index adopts a query indexing approach, thereby achieving a high level of scalability. Once BMQ-Index is built on registered queries, only relevant queries are quickly searched for upon an incoming data. For incremental processing, BMQ-Index employs an incremental access method, i.e., an index structure to store delta query information and an incremental search algorithm. Thus, successive BMQ evaluations are greatly accelerated.
摘要翻译：本发明涉及使用边界监视查询的数据流的处理方法，更具体地说，涉及一种数据流的监视方法和系统，该数据流是大量的数据并连续生成的，例如金融报价单，GPS数据或普遍存在的传感器网络（USN）。本发明的目标是以高性能和可扩展的方式处理数据流上的大量BMQ。为此，本发明提出了可扩展和高性能的数据流监测框架BMQ-Index。 BMQ-Index的主要思想是共享和增量处理。对于共享处理，BMQ-Index采用查询索引方式，从而实现了高度的可扩展性。一旦BMQ-Index建立在注册查询上，只有在输入数据时快速搜索相关查询。对于增量处理，BMQ-Index使用增量访问方法，即用于存储增量查询信息和增量搜索算法的索引结构。因此，连续的BMQ评估大大加快。

74. 发明授权

US07547923B2 Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof 有权
标题翻译：具有多级反射面结构的发光二极管封装及其制造方法
公开(公告)号：US07547923B2
公开(公告)日：2009-06-16
申请号：US11783948
申请日：2007-04-13
申请人： Sang Hyun Shin , Seog Moon Choi , Young Ki Lee
发明人： Sang Hyun Shin , Seog Moon Choi , Young Ki Lee
IPC分类号： H01L29/207
CPC分类号： H01L33/483 , H01L33/60 , H01L33/641 , H01L2224/48091 , H01L2924/00014
摘要： A high luminance and high output LED package using an LED as a light source and a fabrication method thereof. The LED package includes an Al substrate with a recessed multi-stepped reflecting surface formed therein and a light source composed of LEDs mounted on the reflecting surface and electrically connected to patterned electrodes. The LED package also includes anodized insulation layers formed between the patterned electrodes and the substrate, and an encapsulant covering over the light source of the substrate. The LED package further includes an Al heat radiator formed under the LEDs to enhance heat radiation capacity. According to the present invention, the substrate is made of Al material and anodized to form insulation layers thereon, allowing superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED package.
摘要翻译：使用LED作为光源的高亮度和高输出LED封装及其制造方法。 LED封装包括Al基板，其中形成有凹入的多阶反射表面，以及由安装在反射表面上并与图案化电极电连接的LED组成的光源。 LED封装还包括形成在图案化电极和衬底之间的阳极氧化绝缘层，以及覆盖在衬底的光源上的密封剂。 LED封装还包括形成在LED下面的Al散热器，以增强散热能力。根据本发明，基板由Al材料制成并阳极氧化以在其上形成绝缘层，从而允许LED的良好的散热效果，从而显着提高LED封装的寿命和发光效率。

75. 发明授权

US11976912B1 Arrowhead having expanding blades 有权
公开(公告)号：US11976912B1
公开(公告)日：2024-05-07
申请号：US18148434
申请日：2022-12-30
申请人： Young Ki Lee
发明人： Young Ki Lee
IPC分类号： F42B6/08
CPC分类号： F42B6/08
摘要： The present disclosure relates to an arrowhead having expanding blades, the arrowhead including: a main body having a fitting slot longitudinally formed and having two expanding blade coupling portions on an outer surface thereof; a blade assembly having a rear end fitted in the fitting slot of the main body, having leading edges on both sides of the front thereof, having a guide pin seat hole on a plate surface in which a guide pin is seated, and having a guide hole extending from the guide pin seat hole; and expanding blades each having a hinge shaft coupling hole at one end to be coupled to be hinge-rotatable to the expanding blade coupling portion by a hinge shaft, further having a protrusion at the one end, and having a blade at the front, wherein when the blade assembly is moved rearward, the guide pin pushes the protrusions of the expanding blades so that the expanding blades are unfolded.

76. 外观设计

USD958286S1 Arrowhead for hunting 有权
公开(公告)号：USD958286S1
公开(公告)日：2022-07-19
申请号：US29676326
申请日：2019-01-10
申请人： Young Ki Lee
设计人： Young Ki Lee

77. 发明申请

US20140087420A1 NOVEL MICROORGANISM RHIZOBIUM SP. KB10 HAVING PROPERTIES OF PROMOTING GROWH OF BOTRYOCOCCUS BRAUNII AND INCREASING FATTY ACID CONTENT 有权
标题翻译：新型微生物RHIZOBIUM SP。 KB10具有促进白僵菌生长和增加脂肪酸含量的特性
公开(公告)号：US20140087420A1
公开(公告)日：2014-03-27
申请号：US13816735
申请日：2013-01-11
申请人： Hee Mock Oh , Chi Yong Ahn , Young Ki Lee , So Ra Ko , Hee Sik Kim
发明人： Hee Mock Oh , Chi Yong Ahn , Young Ki Lee , So Ra Ko , Hee Sik Kim
IPC分类号： C12P39/00 , C10L1/18
CPC分类号： C12P39/00 , C10L1/026 , C10L1/1802 , C10L2200/0476 , C10L2290/26 , C12N1/12 , C12N1/38 , C12P7/64 , C12P7/6409 , C12P7/6427 , C12R1/41 , Y02E50/13
摘要： The present invention relates to Rhizobium sp. KB10 strain having properties of promoting growth of Botryococcus braunii, which is an alga capable of producing biodiesel, and also enhancing production performance of biodiesel. Mores specifically, it relates to novel Rhizobium sp. KB10 strain which has properties of promoting growth of Botryococcus braunii used for biodiesel production and also enhancing content of C18 (i.e., oleate) corresponding to high quality biodiesel component as much as 900%. By using root colonizing bacteria like Rhizobium, it is possible to promote effectively the slow cell growth of Botryococcus braunii and increase as much as possible the oleate amount, which is a high quality biodiesel component. Further, by carrying out mixture culture using such bacteria, problems associated with contamination by other microorganisms during a process of producing biodiesel by culture in an outside environment can be dramatically solved.
摘要翻译：本发明涉及根瘤菌属具有促进生产生物柴油的藻类Botryococcus braunii生长的特性的KB10菌株，以及提高生物柴油的生产性能。具体来说，它涉及新根瘤菌属 KB10菌株具有促进用于生物柴油生产的Botryococcus braunii生长的性质，并且还提高了对应于高质量生物柴油成分高达900％的C18（即油酸酯）含量。通过使用根瘤菌等细菌根瘤菌，可以有效地促进布鲁氏菌（Botryococcus braunii）的缓慢细胞生长，并尽可能地增加油酸盐量，这是高品质的生物柴油成分。此外，通过使用这种细菌进行混合培养，可以显着地解决与在外部环境下通过培养生产生物柴油的过程中由其他微生物污染相关的问题。

78. 发明申请

US20130316861A1 ARROWHEAD HAVING EXPANDING BLADES CONTROLLED BY GEAR MECHANISM 有权
标题翻译：具有由齿轮机构控制的膨胀叶片的箭头
公开(公告)号：US20130316861A1
公开(公告)日：2013-11-28
申请号：US13900931
申请日：2013-05-23
申请人： Young Ki Lee
发明人： Young Ki Lee
IPC分类号： F42B6/08
CPC分类号： F42B6/08
摘要： Disclosed is an arrowhead in which a plurality of expandable blades can be quickly and reliably retracted or expanded without using an additional means to bundle the expanding blades, thereby enhancing the penetrating capability or killing capability of an arrow. Particularly, a portion of a shaft forming the arrowhead is provided with a rack gear portion installed thereon and a lower end of each of the expanding blades is provided with a pinion gear portion, such that the rack gear portion and the pinion gear portion engage with each other and such a rack-pinion action controls the operation of retracting or expanding the expanding blades.
摘要翻译：公开了一种箭头，其中可以快速且可靠地缩回或扩展多个可扩展叶片，而不需要使用附加装置来捆扎扩张刀片，从而增强箭头的穿透能力或杀伤能力。特别地，形成箭头的轴的一部分设置有安装在其上的齿条部分，并且每个扩展叶片的下端设置有小齿轮部分，使得齿条部分和小齿轮部分与彼此并且这种齿条 - 小齿轮动作控制缩回或扩大扩张刀片的操作。

79. 发明授权

US08558359B2 Semiconductor package having lead frames 失效
标题翻译：具有引线框架的半导体封装
公开(公告)号：US08558359B2
公开(公告)日：2013-10-15
申请号：US13352146
申请日：2012-01-17
申请人： Chang Hyun Lim , Chang Jae Heo , Young Ki Lee , Sung Keun Park
发明人： Chang Hyun Lim , Chang Jae Heo , Young Ki Lee , Sung Keun Park
IPC分类号： H01L23/495 , H01L23/48 , H01L23/52
CPC分类号： H01L23/36 , H01L23/49531 , H01L23/49537 , H01L23/49811 , H01L2224/48091 , H01L2924/1305 , H01L2924/13055 , H01L2924/00 , H01L2924/00014
摘要： Disclosed herein is a semiconductor package, including: a substrate having a first surface and a second surface; at least one semiconductor device formed on the first surface of the substrate; first lead frames respectively formed at both sides of the first surface of the substrate; and second lead frames respectively formed at both sides of the second surface of the substrate, wherein the first lead frame and the second lead frame are spaced apart from each other by an isolation distance base.
摘要翻译：本文公开了一种半导体封装，包括：具有第一表面和第二表面的基板; 形成在所述基板的第一表面上的至少一个半导体器件; 分别形成在基板的第一表面的两侧的第一引线框架; 以及分别形成在所述基板的第二表面的两侧的第二引线框架，其中所述第一引线框架和所述第二引线框架通过隔离距离基座间隔开。

80. 发明授权

US08553417B2 Heat-radiating substrate and method of manufacturing the same 有权
标题翻译：散热基板及其制造方法
公开(公告)号：US08553417B2
公开(公告)日：2013-10-08
申请号：US13007545
申请日：2011-01-14
申请人： Ji Hyun Park , Seog Moon Choi , Young Ki Lee
发明人： Ji Hyun Park , Seog Moon Choi , Young Ki Lee
IPC分类号： H05K7/20
CPC分类号： H05K1/053 , H05K2201/09745
摘要： Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a base substrate with a heat sink, having a groove; an insulating layer formed on the base substrate by performing anodization thereon; and a circuit layer formed on the insulating layer, whereby the heat-radiating substrate with the heat-sink, made of metal material, is manufactured, thereby making it possible to protect devices weak against heat and thus solve the problem in view of reduced life span and degraded reliability.
摘要翻译：这里公开了散热基板及其制造方法。散热基板包括：具有散热器的基底，具有凹槽; 绝缘层，其通过在其上进行阳极氧化而形成在所述基底基板上; 以及形成在绝缘层上的电路层，由此制造具有由金属材料制成的散热器的散热基板，从而可以保护弱热的器件，从而解决了降低寿命的问题跨度和可靠性降低。

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