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    • 80. 发明授权
    • Method of exposing printed wiring boards having through holes
    • 曝光具有通孔的印刷电路板的方法
    • US5246813A
    • 1993-09-21
    • US881489
    • 1992-05-11
    • Susumu HoshinouchiAkio YoshidaAkinobu Kawazu
    • Susumu HoshinouchiAkio YoshidaAkinobu Kawazu
    • G03F7/20H05K3/00H05K3/06
    • H05K3/0082G03F7/2059H05K3/0094H05K2201/09581H05K2203/0759H05K2203/092H05K2203/135H05K3/064Y10S430/143Y10S430/146
    • A method of exposing the resist on a printed wiring board having through holes for connecting planar circuit patterns on the plane surfaces of the substrate is disclosed, wherein an electron beam direct writing system is utilized for scanning a converging electron beam as the exposure energy. The electron beam produced by the system enters the opening of the through hole, forming an inclination angle different from 0 degrees and up to 7 degrees with respect to the normal to the opening area of the through hole, such that the resist on the wall surface of the through hole is exposed simultaneously both by the direct and the reflected electron beam. The amount of exposure per unit area of the opening of the through hole may be controlled to 2 h/r times the amount of exposure per unit area over the planar surface of the substrate, wherein h and r are the depth and the radius of the through holes, respectively. A reflector plate may be disposed at the bottom opening of the through holes to further enhance the utilization efficiency of the electron beam during through-hole wall surface exposure.
    • 公开了一种将抗蚀剂曝光在具有用于连接平面电路图形的通孔的印刷线路板上的方法,该平面电路图案用于在基板的平面上连接平面电路图案,其中使用电子束直接写入系统来扫描会聚电子束作为曝光能量。 由系统产生的电子束进入通孔的开口,形成相对于通孔的开口面积的法线0度和至多7度的倾斜角度,使得壁表面上的抗蚀剂 通过直接和反射的电子束同时暴露通孔。 可以将通孔开口单位面积的曝光量控制在基板的平面表面上每单位面积曝光量的2h / r倍,其中h和r是深度和半径 通孔。 反射板可以设置在通孔的底部开口处,以进一步提高通孔壁表面暴露期间电子束的利用效率。