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1. 发明授权

US4689466A Laser-beam operated machining apparatus 失效
标题翻译：激光束加工装置
公开(公告)号：US4689466A
公开(公告)日：1987-08-25
申请号：US721628
申请日：1985-04-10
申请人： Susumu Hoshinouchi , Masaru Kanaoka , Atsushi Fukada
发明人： Susumu Hoshinouchi , Masaru Kanaoka , Atsushi Fukada
IPC分类号： B23K26/14 , B23K26/00
CPC分类号： B23K26/1429
摘要： A laser-beam operated machining apparatus capable of performing machining operations on a high-reflectivity material such as aluminum or copper. A nozzle is provided for applying a focused laser beam together with an assist gas to a surface of a workpiece to be machined. An annular electrode is provided on the end of the nozzle confronting the workpiece with the electrode being coaxial with the laser beam. An arc discharge is created between the annular electrode and the workpiece by applying a voltage between the annular electrode and the workpiece so as to cause an arc discharge therebetween.
摘要翻译：一种能够对诸如铝或铜的高反射率材料进行加工操作的激光束操作的加工装置。提供喷嘴以将聚焦的激光束与辅助气体一起施加到待加工的工件的表面。环形电极设置在面对工件的喷嘴的端部上，电极与激光束同轴。通过在环形电极和工件之间施加电压以在其间产生电弧放电，在环形电极和工件之间产生电弧放电。

2. 发明授权

US4258247A Method of producing welded joint including non-welded portion 失效
标题翻译：包括非焊接部分的焊接接头的生产方法
公开(公告)号：US4258247A
公开(公告)日：1981-03-24
申请号：US964447
申请日：1978-11-28
申请人： Wataru Shimada , Susumu Hoshinouchi
发明人： Wataru Shimada , Susumu Hoshinouchi
IPC分类号： B23K9/16 , B23K33/00 , B23K9/02
CPC分类号： B23K33/004 , B23K9/162
摘要： One metallic plate is set upright on another metallic plate and a filler fills each corner formed of both plates. A deposit metal is deposited on and adjacent to each filler to weld the plates to form a recess on that portion to the deposit metal facing a non-welded portion located between the welded plates. Alternatively the recess may be formed by supplying an inert gas to a space formed between the two plates and simultaneously depositing a deposit metal on the plates across the space.
摘要翻译：一个金属板直立放置在另一个金属板上，填充物填充由两个板形成的每个角。沉积金属沉积在每个填料上并与其相邻，以焊接板，以在位于焊接板之间的非焊接部分的沉积金属的该部分上形成凹部。或者，可以通过向形成在两个板之间的空间供应惰性气体并且同时在板上横跨空间沉积沉积金而形成凹部。

3. 发明授权

US4879473A Electron-beam exposure apparatus 失效
标题翻译：电子束曝光装置
公开(公告)号：US4879473A
公开(公告)日：1989-11-07
申请号：US248071
申请日：1988-09-23
申请人： Nobuyuki Zumoto , Masahiko Sakamoto , Susumu Hoshinouchi
发明人： Nobuyuki Zumoto , Masahiko Sakamoto , Susumu Hoshinouchi
IPC分类号： H01J37/305 , G01Q30/02 , G01Q30/06 , G01Q90/00 , H01J37/302 , H01J37/317 , H01L21/027 , H01L21/30
CPC分类号： H01J37/302 , B82Y10/00 , B82Y40/00 , H01J37/3174 , H01J2237/1536 , H01J2237/30461
摘要： An electron-beam exposure apparatus having a correction function for correcting deflection distortion. The correction function is carried out by the provision of a correcting device including an analog correction unit 35 and a digital correction unit having a memory unit 10 for storing correction data other than data that can be expressed by a cubic function. The capacity of such a memory unit can be made smaller than that of conventional apparatuses.
摘要翻译：一种具有用于校正偏转失真的校正功能的电子束曝光装置。校正功能通过提供包括模拟校正单元35的校正装置和具有存储单元10的数字校正单元来执行，该存储单元10用于存储除了可以由三次函数表示的数据之外的校正数据。可以使这种存储器单元的容量小于常规设备的容量。

4. 发明授权

US5118983A Thermionic electron source 失效
标题翻译： THERMIONIC电子源
公开(公告)号：US5118983A
公开(公告)日：1992-06-02
申请号：US495127
申请日：1990-03-19
申请人： Noriko Morita , Susumu Hoshinouchi , Yoshihiko Kusakabe
发明人： Noriko Morita , Susumu Hoshinouchi , Yoshihiko Kusakabe
IPC分类号： H01J1/13 , H01J9/04
CPC分类号： H01J9/04 , H01J1/13
摘要： A high temperature low density operating element includes a porous high temperature operating element film formed into a predetermined configuration and disposed on one surface of an insulating member with good heat conductivity, a resistive film with a high melting point and good heat conductivity having a higher density than the high temperature operating element film, formed into a predetermined configuration on a second surface of the insulating member with good heat conductivity, a lead wire connected to the resistive film, an insulating protective film disposed on the insulating member covering the resistive film.

5. 发明授权

US4638145A Laser machining apparatus 失效
标题翻译：激光加工设备
公开(公告)号：US4638145A
公开(公告)日：1987-01-20
申请号：US799686
申请日：1985-11-19
申请人： Hisayuki Sakuma , Susumu Hoshinouchi
发明人： Hisayuki Sakuma , Susumu Hoshinouchi
IPC分类号： B23K26/00 , B23K26/08 , B23K26/02
CPC分类号： B23K26/0853
摘要： A laser machining apparatus capable of performing high-quality and precise cuts on sharply angled or complexly configured portions of a plate-type workpiece with minimum burn-through loss of material due to thermal saturation. In accordance with the invention, values are prestored representing optimum laser output with respect to the speed of the laser beam relative to the workpiece for various types of workpiece material and thickness of the workpiece. These values are read out and the laser beam controlled in accordance therewith during cutting operations. Some of the values represent a continuous output and are applied for higher speed cutting, while others represent a pulsed output and are applied for lower speed cutting.
摘要翻译：激光加工设备，能够对板式工件的锐角或复杂配置的部分进行高质量和精确的切割，同时由于热饱和而具有最小的材料烧穿损失。根据本发明，预先存储的值表示针对各种工件材料和工件厚度相对于激光束相对于工件的速度的最佳激光输出。在切割操作期间读出这些值并根据激光束进行控制。一些值表示连续输出，适用于更高速度切割，而其他值代表脉冲输出，并用于较低速度切割。

6. 发明授权

US4162389A Welding apparatus 失效
标题翻译：焊接设备
公开(公告)号：US4162389A
公开(公告)日：1979-07-24
申请号：US792342
申请日：1977-04-29
申请人： Wataru Shimdada , Kazumichi Machida , Susumu Hoshinouchi , Seigo Hiramoto , Masaru Okada
发明人： Wataru Shimdada , Kazumichi Machida , Susumu Hoshinouchi , Seigo Hiramoto , Masaru Okada
IPC分类号： B23K9/16 , B23K9/04 , B23K9/12 , B23K10/02
CPC分类号： B23K10/02 , B23K9/04 , B23K9/124
摘要： In a welding apparatus for overlaying on a base metal, a reverse polarity soft plasma arc is formed between an electrode and the base metal and a welding rod is fed into the arc to weld the base metal by melting the welding rod and the feeding speed of the welding rod is controlled corresponding to the arc current to form a bead having low penetration.The electrode is oscillated and an active gas such as CO.sub.2 or O.sub.2 is incorporated in a shield gas at a rate controlled corresponding to the oscillation of the electrode.
摘要翻译：在用于覆盖在母材上的焊接装置中，在电极和母材之间形成反极性的软等离子体电弧，并且通过熔化焊条将焊条送入电弧以焊接基体金属，根据电弧电流来控制焊条，形成低穿透度的焊道。

7. 发明授权

US5821762A Semiconductor device, production method therefor, method for testing semiconductor elements, test substrate for the method and method for producing the test substrate 失效
标题翻译：半导体装置及其制造方法，半导体元件的测试方法，测试基板的制造方法和测试基板的制造方法
公开(公告)号：US5821762A
公开(公告)日：1998-10-13
申请号：US753882
申请日：1996-12-02
申请人： Tsuneo Hamaguchi , Kenji Kagata , Goro Izuta , Mitsunori Ishizaki , Osamu Hayashi , Susumu Hoshinouchi
发明人： Tsuneo Hamaguchi , Kenji Kagata , Goro Izuta , Mitsunori Ishizaki , Osamu Hayashi , Susumu Hoshinouchi
IPC分类号： H01L21/66 , G01R1/04 , G01R31/28 , H01L21/60 , H01L23/367 , H01L23/538 , H01L23/544 , H01L25/04 , H01L25/065 , H01L25/07 , H01L25/18 , G01R31/02
CPC分类号： G01R31/2863 , G01R1/04 , H01L22/34 , H01L23/3677 , H01L24/11 , H01L24/81 , H01L25/0652 , H01L25/0657 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2224/81801 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/06572 , H01L2225/06582 , H01L2225/06586 , H01L2225/06589 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/15311 , H01L2924/15312 , H01L2924/15787 , H01L2924/16152 , H01L2924/1627 , H01L2924/3025 , H01L2924/351
摘要： A high-speed, high-density, small-sized, low-cost semiconductor device wherein the feeder substrate 2 for supplying power to the semiconductor elements 3 as a bare chip has the containers 2a for containing the semiconductor elements 3, the semiconductor elements 3 are bonded to the wiring layer 1b of the signal transmission substrate 1 for transmitting signals to the semiconductor elements 3 and contained in the containers 2a, the containers 2a are covered with the signal transmission substrate 1, and the signal transmission substrate 1 is superposed upon and bonded to the feeder substrate 2.
摘要翻译：一种高速，高密度，小尺寸，低成本的半导体器件，其中用于向作为裸芯片的半导体元件3供电的馈电基板2具有用于容纳半导体元件3的容器2a，半导体元件3 接合到信号传输基板1的布线层1b，用于将信号传输到半导体元件3并容纳在容器2a中，容器2a被信号传输基板1覆盖，并且信号传输基板1叠加在结合到馈电基板2。

8. 发明授权

US5587627A Planar display apparatus having exposed insulated substrate portion 失效
标题翻译：具有露出的绝缘基板部分的平面显示装置
公开(公告)号：US5587627A
公开(公告)日：1996-12-24
申请号：US395703
申请日：1995-02-28
申请人： Masato Saito , Ryo Suzuki , Keiji Fukuyama , Takuya Ohira , Keiji Watanabe , Minoru Kobayashi , Susumu Hoshinouchi , Yoshinori Hatanaka
发明人： Masato Saito , Ryo Suzuki , Keiji Fukuyama , Takuya Ohira , Keiji Watanabe , Minoru Kobayashi , Susumu Hoshinouchi , Yoshinori Hatanaka
IPC分类号： H01J31/12 , H05B37/02
CPC分类号： H01J31/126
摘要： A control electrode portion for passing electrons through a given electron-passing hole selected from a plurality of electron-passing holes provided on an insulating substrate is formed by coating the insulating substrate with a conductive film and dividing the into a plurality of conductive films as control electrodes. This structure obviates the mesh structure of electrons which are necessary in the case of arranging control electrodes on the insulating substrate, thereby realizing high-definition display devices with improved luminance. In addition, planar display devices provided with a surface insulated substrate produced by forming an insulating film on a conductive substrate having electron-passing holes and a plurality of separate control electrodes arranged on the surface insulated substrate, it is possible to prevent the charge-up effect which obstructs the passage of electron beams and, hence, to enhance the luminance at least by (1) providing a voltage applying circuit for applying a predetermined voltage to the conductive substrate, (2) providing a portion at which the conductive substrate is exposed between the adjacent control electrodes.
摘要翻译：通过用导电膜涂覆绝缘基板并将其分成多个导电膜作为对照，形成用于使电子通过选自设置在绝缘基板上的多个电子通过孔中的给定电子通过孔的控制电极部分电极。这种结构消除了在绝缘基板上布置控制电极的情况下必需的电子的网格结构，从而实现了具有改善的亮度的高清晰度显示装置。另外，具有通过在具有电子通过孔的导电性基板上形成绝缘膜而形成的表面绝缘基板的平面显示装置和配置在表面绝缘基板上的多个分立控制电极，能够防止充电至少通过（1）提供用于向导电衬底施加预定电压的电压施加电路，（2）提供导电衬底露出的部分，从而阻止电子束通过，并因此提高亮度在相邻的控制电极之间。

9. 发明授权

US5292418A Local laser plating apparatus 失效
标题翻译：本地激光电镀设备
公开(公告)号：US5292418A
公开(公告)日：1994-03-08
申请号：US845950
申请日：1992-03-04
申请人： Takeshi Morita , Minoru Fujita , Masatoshi Sunamoto , Osamu Hayashi , Susumu Hoshinouchi
发明人： Takeshi Morita , Minoru Fujita , Masatoshi Sunamoto , Osamu Hayashi , Susumu Hoshinouchi
IPC分类号： B23K26/14 , C25D5/02 , C25D17/00 , B05B5/00 , B05D3/06
CPC分类号： C25D5/024 , B23K26/146
摘要： A local plating apparatus includes a fiber, a laser beam penetrating nozzle or a laser beam penetrating mask through which a laser beam can be directly irradiated on a portion to be plated when plating is conducted on the portion to be plated using a jet of plating solution. The apparatus enables a laser beam to reach the portion to be plated in a stable state, and ensures a high plating speed and uniform plating quality.
摘要翻译：局部电镀装置包括光纤，激光束穿透喷嘴或激光束穿透掩模，当使用电镀溶液喷射电镀进行镀覆时，激光束可直接照射在被镀部分上。该装置能够使激光束以稳定的状态到达要被镀覆的部分，并且确保高的电镀速度和均匀的电镀质量。

10. 发明授权

US5246813A Method of exposing printed wiring boards having through holes 失效
标题翻译：曝光具有通孔的印刷电路板的方法
公开(公告)号：US5246813A
公开(公告)日：1993-09-21
申请号：US881489
申请日：1992-05-11
申请人： Susumu Hoshinouchi , Akio Yoshida , Akinobu Kawazu
发明人： Susumu Hoshinouchi , Akio Yoshida , Akinobu Kawazu
IPC分类号： G03F7/20 , H05K3/00 , H05K3/06
CPC分类号： H05K3/0082 , G03F7/2059 , H05K3/0094 , H05K2201/09581 , H05K2203/0759 , H05K2203/092 , H05K2203/135 , H05K3/064 , Y10S430/143 , Y10S430/146
摘要： A method of exposing the resist on a printed wiring board having through holes for connecting planar circuit patterns on the plane surfaces of the substrate is disclosed, wherein an electron beam direct writing system is utilized for scanning a converging electron beam as the exposure energy. The electron beam produced by the system enters the opening of the through hole, forming an inclination angle different from 0 degrees and up to 7 degrees with respect to the normal to the opening area of the through hole, such that the resist on the wall surface of the through hole is exposed simultaneously both by the direct and the reflected electron beam. The amount of exposure per unit area of the opening of the through hole may be controlled to 2 h/r times the amount of exposure per unit area over the planar surface of the substrate, wherein h and r are the depth and the radius of the through holes, respectively. A reflector plate may be disposed at the bottom opening of the through holes to further enhance the utilization efficiency of the electron beam during through-hole wall surface exposure.
摘要翻译：公开了一种将抗蚀剂曝光在具有用于连接平面电路图形的通孔的印刷线路板上的方法，该平面电路图案用于在基板的平面上连接平面电路图案，其中使用电子束直接写入系统来扫描会聚电子束作为曝光能量。由系统产生的电子束进入通孔的开口，形成相对于通孔的开口面积的法线0度和至多7度的倾斜角度，使得壁表面上的抗蚀剂通过直接和反射的电子束同时暴露通孔。可以将通孔开口单位面积的曝光量控制在基板的平面表面上每单位面积曝光量的2h / r倍，其中h和r是深度和半径通孔。反射板可以设置在通孔的底部开口处，以进一步提高通孔壁表面暴露期间电子束的利用效率。

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