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71. 发明申请

US20050059889A1 Clad composite stent 审中-公开
标题翻译：包层复合支架
公开(公告)号：US20050059889A1
公开(公告)日：2005-03-17
申请号：US10971742
申请日：2004-10-22
申请人： David Mayer
发明人： David Mayer
IPC分类号： A61F2/90 , A61F2/06
CPC分类号： A61F2/90 , A61F2220/0008 , A61F2220/0016 , Y10T428/12333
摘要： A body compatible stent is formed of multiple filaments arranged in at least two sets of oppositely directed helical windings interwoven with one another in a braided configuration. Each of the filaments is a composite including a central core and a case surrounding the core. In the more preferred version, the core is formed of a radiopaque and relatively ductile material, e.g. tantalum or platinum. The outer case is formed of a relatively resilient material, e.g. a cobalt/chromium based alloy. Favorable mechanical characteristics of the stent are determined by the case, while the core enables in vivo imaging of the stent. The composite filaments are formed by a drawn filled tubing process in which the core is inserted into a tubular case of a diameter substantially more than the intended final filament diameter. The composite filament is cold-worked in several steps to reduce its diameter, and annealed between successive cold working steps. After the final cold working step, the composite filament is formed into the desired shape and age hardened. Alternative composite filaments employ an intermediate barrier layer between the case and core, a biocompatible cover layer surrounding the case, and a radiopaque case surrounding a structural core.
摘要翻译：身体相容的支架由布置在至少两组相互指向的螺旋形绕组中的多根细丝形成，所述螺旋形绕组在编织结构中彼此交织。每个长丝是包括中心芯和围绕芯的壳体的复合材料。在更优选的版本中，芯由不透射线的和相对延性的材料形成，例如。钽或铂。外壳由相对弹性的材料形成，例如，钴/铬基合金。通过这种情况确定支架的有利的机械特性，而核心能够进行支架的体内成像。复合长丝通过拉伸的填充管道方法形成，其中芯被插入直径基本上大于预期的最终丝直径的管状壳体中。复合长丝在几个步骤中冷加工以减小其直径，并在连续的冷加工步骤之间退火。在最后的冷加工步骤之后，将复合长丝形成为期望的形状并且老化硬化。替代的复合细丝在外壳和芯之间采用中间阻挡层，围绕外壳的生物相容的覆盖层和围绕结构芯的不透射线的外壳。

72. 发明申请

US20050037658A1 System and method for guidingly mounting a power module to a processor 有权
标题翻译：将功率模块引导到处理器的系统和方法
公开(公告)号：US20050037658A1
公开(公告)日：2005-02-17
申请号：US10639276
申请日：2003-08-12
申请人： David Mayer , Michael Thornton
发明人： David Mayer , Michael Thornton
IPC分类号： G06F1/18 , H05K7/14 , H01R13/64
CPC分类号： G06F1/185 , G06F1/184 , G06F1/186 , G06F1/188 , H01R12/7005 , H01R12/721 , H05K7/1431
摘要： A system having a power module mount adapted to support a power module side-by-side with a card-based processor, and a connectivity guide adapted to guide the power module along a direct path between electrically connected and disconnected relationships with the card-based processor. A method for mounting a power module to a processor involving engaging the power module with a connectivity guide disposed adjacent the processor, moving the power module toward the processor via the connectivity guide, and mating edge connectors of the power module and the processor.
摘要翻译：一种具有功率模块安装座的系统，其适于与基于卡的处理器并排地支撑功率模块，以及连接引导件，适于沿着与基于卡的处理器的电连接和断开的关系之间的直接路径引导功率模块处理器。一种用于将功率模块安装到处理器的方法，所述方法包括使所述功率模块与邻近所述处理器设置的连接引导件接合，通过所述连接引导件将所述功率模块朝向所述处理器以及所述功率模块和所述处理器的配合边缘连接器移动。

73. 发明授权

US6023415A Apparatus for electro-magnetic interference (EMI) and radio frequency interference (RFI) containment with in a chassis 失效
标题翻译：在机箱中用于电磁干扰（EMI）和射频干扰（RFI）的装置
公开(公告)号：US6023415A
公开(公告)日：2000-02-08
申请号：US940414
申请日：1997-09-30
申请人： David Mayer , Ronald P. Dean , John P. Hoppal , Rex Seader
发明人： David Mayer , Ronald P. Dean , John P. Hoppal , Rex Seader
IPC分类号： G06F1/18 , H05K9/00 , H05K5/00
CPC分类号： H05K9/0018 , G06F1/182 , G06F1/184
摘要： A printed circuit board and bulkhead assembly with I/O connectors that may be slidingly mated with a rear panel bulkhead frame of a computer chassis without removing the rear panel and without having to remove any mounting hardware. The I/O connectors are attached to the bulkhead assembly in such a manner that the I/O connectors clear the rear panel bulkhead frame when the bulkhead assembly is being slidingly mated with the rear panel bulkhead frame. The I/O connectors extend through the rear panel bulkhead frame once the bulkhead assembly is mated with the rear panel bulkhead frame. When fully installed, the bulkhead assembly and the rear panel bulkhead frame create a barrier against EMI/RFI radiation emissions escaping the computer chassis.
摘要翻译：具有I / O连接器的印刷电路板和隔板组件，其可以与计算机机箱的后面板隔板框架滑动配合，而不需要移除后面板，而不必卸下任何安装硬件。 I / O连接器以这样的方式附接到隔板组件，使得当隔板组件与后面板隔板框架滑动配合时，I / O连接器清洁后面板隔板框架。一旦舱壁组件与后面板隔板框架配合，I / O连接器将延伸穿过后面板隔板框架。当完全安装后，隔板组件和后面板隔板框架可以防止EMI / RFI辐射排放物逃离计算机机箱。

74. 发明授权

US5959244A Front and rear contacting EMI gasket 失效
标题翻译：前后接触EMI垫片
公开(公告)号：US5959244A
公开(公告)日：1999-09-28
申请号：US924713
申请日：1997-08-29
申请人： David Mayer
发明人： David Mayer
IPC分类号： G06F1/18 , H05K9/00
CPC分类号： H05K9/0018 , G06F1/182
摘要： An EMI gasket formed from a conductive sheet having a hole therein. A first set of conductive fingers is disposed along the periphery of the hole protruding away from the conductive sheet on the front side. A second set of conductive fingers is disposed along the periphery of the hole protruding away from the conductive sheet on the back side. The first conductive fingers are alternately interleaved with the second conductive fingers. Each of the first conductive fingers includes a first and a second portion defined by a bend. The first portion is disposed in the plane of the sheet. The second portion is disposed in a plane orthogonal to the plane of the sheet. The first conductive fingers operate to engage a conductive portion of a panel. The second conductive fingers operate to engage a conductive portion of a component. The conductive sheet and the first and second sets of conductive fingers are made of spring steel. A third set of conductive fingers similar to the first fingers may be included, disposed on the outer periphery of the conductive sheet. In an electronic component assembly having EMI reduction properties, the EMI gasket is interposed between the component and the conductive exterior panel. An intermediate panel may be interposed between the gasket and the exterior panel. Holes in the intermediate panel allow the first conductive fingers to engage the exterior panel.
摘要翻译：由其中具有孔的导电片形成的EMI垫片。第一组导电指状物沿着远离导电片在前侧突出的孔的周边设置。第二组导电指状物沿着远离导电片的背面侧突出的孔的周边设置。第一导电指状物与第二导电指状物交替地交错。每个第一导电指状物包括由弯曲部限定的第一和第二部分。第一部分设置在片材的平面中。第二部分设置在与片材的平面正交的平面中。第一导电指状物操作以接合面板的导电部分。第二导电指状物操作以接合部件的导电部分。导电片和第一和第二组导电指状物由弹簧钢制成。可以包括类似于第一指状物的第三组导电指状物，设置在导电片的外周上。在具有EMI降低特性的电子部件组件中，EMI垫片插入在部件和导电外部面板之间。中间板可以插入在垫圈和外部面板之间。中间面板中的孔允许第一导电指状物接合外部面板。

75. 外观设计

USD347287S Molded roof tile 失效
公开(公告)号：USD347287S
公开(公告)日：1994-05-24
申请号：US887853
申请日：1992-05-26
申请人： David Mayer
设计人： David Mayer

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