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61. 发明授权

US06933099B2 Method of forming a patterned metal layer 有权
标题翻译：形成图案化金属层的方法
公开(公告)号：US06933099B2
公开(公告)日：2005-08-23
申请号：US10290283
申请日：2002-11-08
申请人： James Francis O'Sullivan , Stephen Robert Burgess
发明人： James Francis O'Sullivan , Stephen Robert Burgess
IPC分类号： H01L21/02 , H01L21/027 , H01L21/285 , H05K3/04 , G03C5/00 , C23C14/34
CPC分类号： H01L21/0272 , H01L21/2855 , H05K3/048
摘要： A method of forming a patterned layer on a substrate including depositing a notched or undercut resist pattern to define at least one recess in the photoresist, with the notch or undercut circumjacent the base of the recess, sputtering a material into the recess and removing the resist and the material deposited on the resist characterised in that the aspect ratio of the recess and height of the mouth of the notch or undercut are such that the notch or undercut lies substantially in the shadow beneath the resist, the layer deposited upon it and the layer at the base of the recess in respect of any sputtered particle travelling in a straight line through the mouth of the recess such that material deposited on the walls of the recesses is not continuous with material deposited on the base of the recess.
摘要翻译：一种在衬底上形成图案层的方法，包括沉积缺口或底切抗蚀剂图案以限定光致抗蚀剂中的至少一个凹部，其中凹口或底切围绕凹部的底部，将材料溅射到凹部中并去除抗蚀剂并且沉积在抗蚀剂上的材料的特征在于，凹口的纵横比和凹口或底切口的高度使得凹口或底切基本上位于抗蚀剂下面的阴影中，沉积在其上的层和层相对于通过凹部的口直线行进的任何溅射的颗粒在凹部的底部，使得沉积在凹槽的壁上的材料与沉积在凹部的底部上的材料不连续。

62. 发明申请

US20050163919A1 Fast production method for printed board 审中-公开
标题翻译：印刷板快速生产方法
公开(公告)号：US20050163919A1
公开(公告)日：2005-07-28
申请号：US10511153
申请日：2003-04-11
申请人： Kazuhiro Murata
发明人： Kazuhiro Murata
IPC分类号： H05K3/02 , H05K3/04 , H05K3/18 , B05D5/12
CPC分类号： H05K3/048
摘要： A high-speed production method of a printed circuit board comprising the steps of, melting and jet-spraying a solid ink on an insulating substrate to be patterned, leaving portions corresponding to an image part unsprayed, coating a side of the insulating substrate patterned with a conductive layer, and removing solid ink portions by solving, wherein the solid ink comprises a wax as a main component, and wherein the melted solid ink is jet-sprayed for patterning in accordance with data from a computer.
摘要翻译：一种印刷电路板的高速生产方法，包括以下步骤：在待图案化的绝缘基底上熔融喷射固体油墨，留下与未被喷射的图像部分对应的部分，涂覆图案化的绝缘基板的一面导电层，并通过求解去除固体油墨部分，其中固体油墨包括蜡作为主要成分，并且其中根据来自计算机的数据喷射喷射熔融的固体油墨以进行图案化。

63. 发明授权

US06898846B2 Method and components for manufacturing multi-layer modular electrical circuits 失效
标题翻译：制造多层模块化电路的方法和组件
公开(公告)号：US06898846B2
公开(公告)日：2005-05-31
申请号：US10224639
申请日：2002-08-21
申请人： David Liu , Chengping Zhang , Michael T. Duignan
发明人： David Liu , Chengping Zhang , Michael T. Duignan
IPC分类号： H03H3/007 , H03H7/01 , H05K1/16 , H05K3/04 , H05K3/40 , H05K3/46 , H05K3/30
CPC分类号： H05K3/4614 , H03H3/00 , H03H7/0115 , H03H7/06 , H03H7/1775 , H03H2001/0078 , H05K1/16 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/046 , H05K3/4069 , H05K3/4638 , H05K2201/0108 , H05K2201/09881 , H05K2201/09918 , H05K2201/10378 , H05K2203/0528 , H05K2203/107 , Y10T29/49126 , Y10T29/4913 , Y10T29/49131 , Y10T29/49165
摘要： A method for manufacturing a modular electrical circuit includes the steps of pre-manufacturing a plurality of components having fine features such as resistors, capacitors, inductances, and conductors formed on a dielectric substrate. The pre-manufactured components are laminated each to the other in a predetermined order. Each pre-manufactured component includes one or more electrical elements of the same type coupled each to the other by conducting lines. Each dielectric substrate includes through vias filled with the conductive material which serve for cross-coupling of the elements of neighboring components. Position of the passive elements, as well as conductive lines and through vias, are pre-designed to allow precise coordination between the elements of different components in the multi-layered modular electrical circuit.
摘要翻译：一种用于制造模块化电路的方法包括以下步骤：预先制造具有精细特征的部件，例如电阻器，电容器，电感和形成在电介质基片上的导体。预先制造的部件按预定的顺序彼此分层。每个预制的部件包括一个或多个相同类型的电气元件，每个通过导线彼此连接。每个电介质基片包括填充有导电材料的通孔，其用于交叉耦合相邻元件的元件。无源元件以及导线和通孔的位置被预先设计成允许多层模块化电路中的不同元件的元件之间的精确协调。

64. 发明申请

US20050064652A1 Circuit forming system and method 有权
标题翻译：电路成型系统及方法
公开(公告)号：US20050064652A1
公开(公告)日：2005-03-24
申请号：US10912849
申请日：2004-08-06
申请人： Shmuel Shapira
发明人： Shmuel Shapira
IPC分类号： A61F13/15 , A61F13/42 , H05K1/16 , H05K3/04 , H05K3/10 , H05K3/28 , H05K3/38 , A61C13/00
CPC分类号： H05K3/041 , H05K1/165 , H05K3/107 , H05K3/28 , H05K3/386 , H05K2201/0382 , H05K2201/09036 , H05K2201/091 , H05K2203/0108 , H05K2203/1476 , Y10T29/49117 , Y10T29/49155 , Y10T29/49156
摘要： A system and method of forming a circuit. The system and method includes layering an impressionable material and a conductive material, defining adjacent charge paths on the conductive material, and shaping the impressionable material to increase a gap between adjacent charge paths.
摘要翻译：一种形成电路的系统和方法。该系统和方法包括对可印模材料和导电材料进行分层，在导电材料上限定相邻的电荷路径，以及使可印模材料成形以增加相邻电荷路径之间的间隙。

65. 发明授权

US06849294B2 Method for fabricating circuit pattern of printed circuit board 失效
标题翻译：制造印刷电路板电路图案的方法
公开(公告)号：US06849294B2
公开(公告)日：2005-02-01
申请号：US10456565
申请日：2003-06-09
申请人： Sung-Gue Lee
发明人： Sung-Gue Lee
IPC分类号： H05K3/02 , C25D5/02 , C25D7/12 , H05K3/04 , H05K3/10 , H05K3/24 , H05K3/28 , H05K3/42 , B05D5/12
CPC分类号： H05K3/243 , C25D5/022 , C25D7/12 , H05K3/045 , H05K3/107 , H05K3/28 , H05K3/426 , H05K2201/0376 , H05K2201/09036
摘要： A circuit pattern fabrication method of a printed circuit board includes: a first step of forming a resin layer at a surface of an insulation material; a second step of selectively removing the resin layer; a third step of forming a metal plated layer at the surface of the resin layer-removed portion of the insulation material to form circuit patterns and a connection pad; and a fourth step of forming a gold plated layer on the connection pad. By doing that, a fine circuit pattern can be easily formed.
摘要翻译：印刷电路板的电路图案制造方法包括：在绝缘材料的表面形成树脂层的第一步骤; 选择性地除去树脂层的第二步骤; 在绝缘材料的树脂层去除部分的表面上形成金属镀层以形成电路图案和连接焊盘的第三步骤; 以及在连接焊盘上形成镀金层的第四步骤。通过这样做，可以容易地形成精细的电路图案。

66. 发明申请

US20050005856A1 Method and system for forming RF reflective pathways 审中-公开
标题翻译：用于形成RF反射路径的方法和系统
公开(公告)号：US20050005856A1
公开(公告)日：2005-01-13
申请号：US10913461
申请日：2004-08-09
申请人： John Debraal
发明人： John Debraal
IPC分类号： G06K19/077 , H01Q1/22 , H05K3/04 , G03C5/18 , C23C16/00 , G03C5/26
CPC分类号： H01Q1/2208 , G06K19/07749 , H01Q1/22 , H05K3/046 , Y10T29/49016 , Y10T29/49117 , Y10T29/49155 , Y10T29/49156 , Y10T29/5313
摘要： The present invention provides for a system and two methods for forming RF reflective pathways. These pathways can form a radio frequency identification tag. A first method uses a thermal transfer ribbon, coated with a conductive material that is engaged with a receiver substrate. A thermal print head will heat a composition on the thermal transfer ribbon in order to transfer it to the receiver substrate. This transfer composition forms the RF reflective pathway. In an alternative method, a receiver substrate is heated in order to react conductive material thereon. This receiver substrate is also heated by a thermal print head to form a RF reflective pathway.
摘要翻译：本发明提供了用于形成RF反射路径的系统和两种方法。这些路径可以形成射频识别标签。第一种方法使用涂覆有与接收器基底接合的导电材料的热转印带。热打印头将加热热转印带上的组合物以将其转印到接收器基底。该转移组合物形成RF反射路径。在替代方法中，加热接收器基板以使其上的导电材料反应。该接收器基板也被热打印头加热以形成RF反射路径。

67. 发明授权

US06838377B2 High frequency circuit chip and method of producing the same 有权
标题翻译：高频电路芯片及其制造方法
公开(公告)号：US06838377B2
公开(公告)日：2005-01-04
申请号：US10087915
申请日：2002-03-05
申请人： Yoshiyuki Tonami , Mitsunori Hatada
发明人： Yoshiyuki Tonami , Mitsunori Hatada
IPC分类号： H01L23/12 , H01L21/48 , H01L23/66 , H01P3/08 , H01P11/00 , H05K1/02 , H05K1/03 , H05K1/16 , H05K3/04 , H05K3/40 , H01L21/44
CPC分类号： H05K3/4061 , H01L21/4857 , H01L21/486 , H01L23/66 , H01L2924/0002 , H05K1/0237 , H05K1/0306 , H05K1/16 , H05K1/167 , H05K3/048 , H05K2201/0317 , H05K2203/025 , H05K2203/1461 , H01L2924/00
摘要： In the production of a high frequency circuit chip in which a wiring pattern is disposed on a substrate having a through-hole, a connecting electrode of the through-hole is formed by filling electrically conductive paste into a perforation and firing it, and the wiring pattern is formed by a lift-off method. Moreover, at least the surface of the substrate for the wiring pattern to be formed thereon is mirror-polished, and thereafter, the wiring pattern is formed on the mirror-polished surface by the lift-off method.
摘要翻译：在其中在具有通孔的基板上布置布线图案的高频电路芯片的生产中，通过将导电浆料填充到穿孔中并将其烧结而形成通孔的连接电极，并且布线图案由剥离法形成。此外，至少将要形成其上的布线图案的基板的表面进行镜面抛光，然后通过剥离方法在镜面抛光表面上形成布线图案。

68. 发明授权

US6410201B2 Thermal transfer element and process for forming organic electroluminescent devices 有权
公开(公告)号：US6410201B2
公开(公告)日：2002-06-25
申请号：US91195201
申请日：2001-07-24
申请人： 3M INNOVATIVE PROPERTIES CO
发明人： WOLK MARTIN B , BAUDE PAUL F , FLORCZAK JEFFREY M , MCCORMICK FRED B , HSU YONG
IPC分类号： B05D5/06 , B05D5/12 , B41M3/00 , B41M5/26 , B41M5/382 , B41M5/385 , B41M5/392 , B41M5/395 , B41M5/40 , B41M5/42 , B41M5/46 , G02B6/122 , G02B6/138 , G03F7/00 , G03F7/039 , G03F7/095 , G03F7/34 , H01L27/32 , H01L51/00 , H01L51/30 , H01L51/40 , H01L51/50 , H01L51/56 , H05B33/10 , H05K3/04 , H05K3/20 , B44C1/165 , B05D5/09
CPC分类号： B41M5/38207 , B41M3/006 , B41M5/265 , B41M5/38214 , B41M5/392 , B41M5/395 , B41M5/42 , G02B6/1221 , G02B6/138 , H01L27/3295 , H01L51/0002 , H01L51/0004 , H01L51/0013 , H01L51/0039 , H01L51/5012 , H01L51/56 , H05B33/10 , H05K3/046 , Y10S430/165
摘要： Disclosed are thermal transfer elements and processes for patterning solvent-coated layers and solvent-susceptible layers onto the same receptor substrate. These donor elements and methods are particularly suited for making organic electroluminescent devices and displays. The donor elements can include a substrate, an optional light-to-heat conversion layer, and a single or multicomponent transfer layer that can be imagewise transferred to a receptor to form an organic electroluminescent device, portions thereof, or components therefor. The methods offer advantages over conventional patterning techniques such as photolithography, and make it possible to fabricate new organic electroluminescent device constructions.

69. 发明授权

US6291126B2 Thermal transfer element and process for forming organic electroluminescent devices 有权
标题翻译：热转印元件和形成有机电致发光器件的工艺
公开(公告)号：US6291126B2
公开(公告)日：2001-09-18
申请号：US72892400
申请日：2000-12-01
申请人： 3M INNOVATIVE PROPERTIES CO
发明人： WOLK MARTIN B , BAUDE PAUL F , MCCORMICK FRED B , HSU YONG
IPC分类号： B05D5/06 , B05D5/12 , B41M3/00 , B41M5/26 , B41M5/382 , B41M5/385 , B41M5/392 , B41M5/395 , B41M5/40 , B41M5/42 , B41M5/46 , G02B6/122 , G02B6/138 , G03F7/00 , G03F7/039 , G03F7/095 , G03F7/34 , H01L27/32 , H01L51/00 , H01L51/30 , H01L51/40 , H01L51/50 , H01L51/56 , H05B33/10 , H05K3/04 , H05K3/20 , B44C1/165 , B05D5/09
CPC分类号： B41M5/38207 , B41M3/006 , B41M5/265 , B41M5/38214 , B41M5/392 , B41M5/395 , B41M5/42 , G02B6/1221 , G02B6/138 , H01L27/3295 , H01L51/0002 , H01L51/0004 , H01L51/0013 , H01L51/0039 , H01L51/5012 , H01L51/56 , H05B33/10 , H05K3/046 , Y10S430/165
摘要： Disclosed are thermal transfer elements and processes for patterning organic materials for electronic devices onto patterned substrates. These donor elements and methods are particularly suited for making organic electroluminescent devices and displays. The donor elements can include a substrate, and optional light-to-heat conversion layer, and a single or multicomponent transfer layer that can be imagewise transferred to a receptor to form an organic electroluminescent device, portions thereof, or components therefor, The methods offer advantages over conventional patterning techniques such as photolithography, and make it possible to fabricate new organic electroluminescent device constructions.
摘要翻译：公开了用于将电子器件的有机材料图案化成图案化衬底的热转印元件和工艺。这些供体元件和方法特别适于制备有机电致发光器件和显示器。供体元件可以包括基底和任选的光热转换层，以及可以成像转移到受体以形成有机电致发光器件，其部分或组分的单组分转移层或多组分转移层。该方法提供优于诸如光刻的常规图案化技术的优点，并且可以制造新的有机电致发光器件结构。

70. 发明授权

US6156672A Method of forming dielectric thin film pattern and method of forming laminate pattern comprising dielectric thin film and conductive thin film 失效
标题翻译：形成电介质薄膜图案的方法和形成包括电介质薄膜和导电薄膜的叠层图案的方法
公开(公告)号：US6156672A
公开(公告)日：2000-12-05
申请号：US443671
申请日：1999-11-19
申请人： Yoshihiro Koshido , Kei Fujibayashi , Yuji Toyota , Tadayuki Okawa , Ryoichiro Takahashi
发明人： Yoshihiro Koshido , Kei Fujibayashi , Yuji Toyota , Tadayuki Okawa , Ryoichiro Takahashi
IPC分类号： H05K3/46 , H01L21/02 , H01L21/027 , H01L21/302 , H01L21/3065 , H01L21/316 , H01P3/16 , H05K1/02 , H05K3/04 , H01L21/31
CPC分类号： H01L28/40 , H01L21/0272 , H01L21/31604 , H05K1/024 , H05K3/048 , Y10S438/951
摘要： A method of forming a dielectric thin film pattern, comprises the steps of: depositing a dielectric thin film on a substrate having a resist pattern thereon by a vapor deposition method, wherein as a material for the dielectric thin film, at least one of CeO.sub.2, Sm.sub.2 O.sub.3, Dy.sub.2 O.sub.3, Y.sub.2 O.sub.3, TiO.sub.2, Al.sub.2 O.sub.3, and MgO is used; and removing the resist pattern whereby the dielectric thin film is patterned.
摘要翻译：一种形成电介质薄膜图案的方法包括以下步骤：通过气相沉积方法在其上具有抗蚀剂图案的基板上沉积电介质薄膜，其中作为电介质薄膜的材料，CeO 2，使用Sm2O3，Dy2O3，Y2O3，TiO2，Al2O3和MgO; 并去除抗蚀剂图案，由此电介质薄膜被图案化。

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