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61. 发明授权

US5416278A Feedthrough via connection 失效
标题翻译：通过连接通过
公开(公告)号：US5416278A
公开(公告)日：1995-05-16
申请号：US024046
申请日：1993-03-01
申请人： Fred E. Ostrem , Alfred G. Ocken
发明人： Fred E. Ostrem , Alfred G. Ocken
IPC分类号： H05K1/00 , H05K1/02 , H05K1/05 , H05K1/11 , H05K3/00 , H05K3/30 , H05K3/34 , H05K3/36 , H05K3/40 , H05K3/44
CPC分类号： H05K3/44 , H05K3/363 , H05K1/0206 , H05K1/0393 , H05K1/05 , H05K1/111 , H05K2201/0195 , H05K2201/0305 , H05K2201/0347 , H05K2201/09554 , H05K2201/10666 , H05K2201/10977 , H05K3/0061 , H05K3/305 , H05K3/3452 , H05K3/4038
摘要： A method for constructing a feedthrough via connection and a corresponding apparatus includes a metallic plate (101), or rigidizer, preferably composed of an aluminum material. A solderable contact area (103), is located on the plate (101). This contact area (103) is preferable comprised of a copper material selectively disposed by a plasma spraying process. Next, an electrically insulating adhesive layer (105) is disposed onto the plate (101). This adhesive layer (105) has a feedthrough via (106) disposed therethrough aligned with the contact area (103). Then, a substrate (109), preferably composed of a flexible composite polyimide material, is disposed onto the adhesive layer (105). This flexible substrate (109) has a via (110) disposed therethrough with a solderable area (111) disposed thereon. Then, a quantity of solder (113) is disposed onto the solderable area (111), and the assembly (100) is heated so that the solder (113) flows into the vias (106) and (110), thereby providing an electrical connection including the solderable area (111) of the via (110), the solder (113), and the contact area (103). During this reflow step, the structure of the adhesive layer (105) acts as a soldermask preventing the solder (113) from flowing outside of an area defined by the via (106).
摘要翻译：通过连接构造馈通方法和相应的装置包括优选由铝材料组成的金属板（101）或刚性机构。可焊接接触区域（103）位于板（101）上。该接触区域（103）优选由通过等离子体喷涂工艺选择性地设置的铜材料构成。接下来，将电绝缘性粘合剂层（105）设置在板（101）上。该粘合剂层（105）具有穿过通孔（106），其穿过与接触区域（103）对齐。然后，将优选由柔性复合聚酰亚胺材料构成的基板（109）设置在粘合剂层（105）上。该柔性基板（109）具有穿过其中设置有可焊接区域（111）的通孔（110）。然后，将一定量的焊料（113）设置在可焊接区域（111）上，并且组装（100）被加热，使得焊料（113）流入通孔（106）和（110），从而提供电气包括通孔（110）的可焊接区域（111），焊料（113）和接触区域（103）的连接。在该回流步骤期间，粘合剂层（105）的结构用作焊接掩模，防止焊料（113）流过由通孔（106）限定的区域的外部。

62. 发明授权

US5259436A Fabrication of metal matrix composites by vacuum die casting 失效
标题翻译：通过真空压铸制备金属基复合材料
公开(公告)号：US5259436A
公开(公告)日：1993-11-09
申请号：US682513
申请日：1991-04-08
申请人： David I. Yun , Ralph R. Sawtell , Warren H. Hunt , H. Robert Baumgartner , Eric T. Streicher , Michael F. Ehman
发明人： David I. Yun , Ralph R. Sawtell , Warren H. Hunt , H. Robert Baumgartner , Eric T. Streicher , Michael F. Ehman
IPC分类号： B22D17/00 , B22D17/14 , B22D19/00 , B22D19/14 , C04B41/51 , C04B41/88 , C22C1/10 , H01L21/48 , H01L23/373 , H05K1/03 , H05K1/05 , H05K3/44
CPC分类号： C22C47/06 , B22D17/14 , B22D19/14 , C04B41/009 , C04B41/51 , C04B41/5155 , C04B41/88 , C22C1/1036 , H01L21/4803 , H01L21/4821 , H01L21/4871 , H01L23/3733 , C04B2111/00844 , C22C2001/1021 , C22C2204/00 , H01L2224/16 , H01L2224/32188 , H01L2224/48247 , H01L2224/73253 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/01004 , H01L2924/01012 , H01L2924/01014 , H01L2924/01019 , H01L2924/01078 , H01L2924/12042 , H01L2924/14 , H01L2924/15312 , H01L2924/16152 , H01L2924/1616 , H01L2924/16195 , H05K1/0306 , H05K1/053 , H05K2201/0116 , H05K2203/128 , H05K3/44
摘要： Metal matrix composites are manufactured in a vacuum die casting machine. Solid aggregate material, at least 65 volume percent, is placed in a die, the die is evacuated and heated, and molten metal is driven by a piston to infiltrate the solid aggregate material where it subsequently solidifies to form a metal matrix composite.
摘要翻译：金属基复合材料在真空压铸机中制造。将至少65体积％的固体骨料材料放置在模具中，将模具抽真空并加热，并且通过活塞驱动熔融金属以渗透固体骨料材料，随后其固化以形成金属基质复合材料。

63. 发明授权

US5153986A Method for fabricating metal core layers for a multi-layer circuit board 失效
标题翻译：多层电路板制作金属芯层的方法
公开(公告)号：US5153986A
公开(公告)日：1992-10-13
申请号：US731598
申请日：1991-07-17
申请人： John M. Brauer , Frederick R. Christie , William H. Lawrence , Ashit A. Mehta , Jonathan D. Reid , William J. Summa
发明人： John M. Brauer , Frederick R. Christie , William H. Lawrence , Ashit A. Mehta , Jonathan D. Reid , William J. Summa
IPC分类号： C08G61/02 , C23C14/12 , H01L23/14 , H05K1/05 , H05K3/38 , H05K3/40 , H05K3/42 , H05K3/44
CPC分类号： H05K3/445 , H01L23/142 , H05K1/056 , H01L2924/0002 , H05K2201/0179 , H05K2201/068 , H05K2201/09536 , H05K2203/135 , H05K3/388 , H05K3/389 , H05K3/4076 , H05K3/426 , Y10S428/901 , Y10T156/10 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： Disclosed is a method of fabricating a multilayer electronic circuit package. The multilayer circuit package has at least one layer that is a circuitized, polymer encapsulated metal core. According to the method of the invention a metal foil is provided for the metal core of the layer. This metal core foil may be provided as a single unit or in a continuous, roll to roll, process. The vias and through holes are drilled, etched, or punched through the metal foil. An adhesion promoter is then applied to the perforate metal foil for subsequent adhesion of polymer to the foil. The dielectric polymer is then applied to the perforate metal foil core by vapor depositing, chemical vapor depositing, spraying or electrophoretically depositing, a thermally processable dielectric polymer or precursor thereof onto exposed surfaces of the perforate metal foil including the walls of the through holes and vias. The dielectric polymer or precursor thereof is then thermally processed to form a conformal dielectric, polymeric coating on surfaces of the perforate metal foil, including the interior surfaces of the vias and through holes. This dielectric, polymeric coating may then be circuitized, and coated with an adhesive for lamination to the next adjacent layer. After lamination, one or more chips are attached to the completed package.

64. 发明授权

US5142775A Bondable via 失效
标题翻译：可通过连接
公开(公告)号：US5142775A
公开(公告)日：1992-09-01
申请号：US605594
申请日：1990-10-30
申请人： John P. Wiley
发明人： John P. Wiley
IPC分类号： H05K3/00 , H05K3/42 , H05K3/44 , H05K3/46
CPC分类号： H05K3/462 , H05K3/445 , H05K1/0272 , H05K2201/015 , H05K2201/09436 , H05K2201/09536 , H05K2201/096 , H05K2203/1383 , H05K2203/1394 , H05K3/0094 , H05K3/429 , H05K3/4644 , Y10T29/49126 , Y10T29/49165
摘要： A method is disclosed for providing less critical alignment of vias and through holes and lower bonding stresses in the manufacture of high density circuit boards. In the invention, a via is drilled through a land which is in a plane separate from that of the signal plane.
摘要翻译：公开了一种用于在高密度电路板的制造中提供通孔和通孔的较不重要的对准以及较低的结合应力的方法。在本发明中，通过在与信号平面分开的平面中的平台上钻孔。

65. 发明授权

US5045642A Printed wiring boards with superposed copper foils cores 失效
标题翻译：带叠加铜箔芯的印刷电路板
公开(公告)号：US5045642A
公开(公告)日：1991-09-03
申请号：US509833
申请日：1990-04-17
申请人： Hideo Ohta , Kenji Miyamoto , Wilson O. W. San , Alfred M. Martini
发明人： Hideo Ohta , Kenji Miyamoto , Wilson O. W. San , Alfred M. Martini
IPC分类号： H01L23/367 , H01L23/498 , H05K1/02 , H05K1/18 , H05K3/44
CPC分类号： H05K1/021 , H01L23/3672 , H01L23/49822 , H01L23/49827 , H05K1/0206 , H01L2924/0002 , H01L2924/15312 , H05K1/183 , H05K2201/0919 , H05K2201/09309 , H05K2201/09536 , H05K2201/10303 , H05K3/445
摘要： The invention provides a printed wiring board having a plurality of copper foil cores superposed over one another and spaced away from one another. The portions of the cores are exposed at the end surfaces of the board. A plurality of holes extend vertically through the copper foil cores and have hole-defining internal surfaces so plated as to connect the cores to one another. Another printed wiring board has a plurality of copper foil cores superposed over one another and spaced away from one another. The end portions of the cores are exposed at the end surfaces of the board. A plurality of holes extend vertically through the copper foil cores and have hole-defining internal surfaces so plated as to connect the cores to one another. The underside of the copper foil core at the lowermost position is exposed at a recess formed on the rear side of the board. Plating is formed which extends from the lowermost copper foil core to the rear side of the board.
摘要翻译：本发明提供了一种印刷线路板，其具有彼此叠置并彼此分开的多个铜箔芯。芯的部分在板的端面处露出。多个孔垂直延伸穿过铜箔芯，并且具有孔定义的内表面，如此电镀以将芯彼此连接。另一印刷布线板具有彼此叠置并彼此分开的多个铜箔芯。芯的端部在板的端面处露出。多个孔垂直延伸穿过铜箔芯，并且具有孔定义的内表面，如此电镀以将芯彼此连接。在最下位置的铜箔芯的下侧露出在形成在板背面的凹部。形成从最下面的铜箔芯延伸到板的后侧的电镀。

66. 发明授权

US4959116A Production of metal base laminate plate including applying an insulator film by powder coating 失效
标题翻译：金属基层压板的制造，包括通过粉末涂覆施加绝缘膜
公开(公告)号：US4959116A
公开(公告)日：1990-09-25
申请号：US307862
申请日：1989-02-07
申请人： Masato Tsuji
发明人： Masato Tsuji
IPC分类号： B32B15/08 , B32B15/092 , B32B37/00 , B32B37/02 , B32B37/24 , H05K1/00 , H05K1/05 , H05K3/00 , H05K3/38 , H05K3/42 , H05K3/44
CPC分类号： B32B37/02 , B32B37/24 , H05K3/0061 , H05K3/445 , H05K1/0393 , H05K1/056 , H05K2201/0355 , H05K2201/096 , H05K2203/068 , H05K2203/105 , H05K2203/1105 , H05K2203/1355 , H05K3/386 , H05K3/427 , Y10T29/49158
摘要： A process of producing a metal base laminate plate wherein the productivity and the yield are high. The process comprises the steps of applying an insulator film by powder coating to a metal plate having a through-hole formed therein to form a metal base plate, placing a film base plate having a heat resisting property in position on the metal base plate with a thermosetting adhering sheet interposed therebetween, pressurizing and heating part of a layered body consisting of the metal base plate, adhering sheet and film base plate to temporarily adhere the metal base plate and the film base plate to each other, and introducing the layered body in a predetermined orientation into a pair of pressuring and heating rollers to finally adhere the metal base plate and the film base plate to each other. When a layered body of a metal base plate and a film base plate passes the pressurizing and heating rollers, air is driven out of them. Consequently, little air bubbles remain in a metal base laminate plate produced by the process.
摘要翻译：一种制造金属基底层压板的方法，其中生产率和产率高。该方法包括以下步骤：通过粉末涂覆将绝缘膜施加到其中形成有通孔的金属板上，以形成金属基板，将具有耐热性的薄膜基板放置在金属基板上的位置上，热固性粘合片之间，加压部分由金属基板，粘合片和薄膜基板组成的层叠体，以将金属基板和薄膜基板临时粘接在一起，并将层叠体引入预定取向成一对加压辊和加热辊，以最终将金属基板和薄膜基板彼此粘合。当金属基板和薄膜基板的层叠体通过加压和加热辊时，空气被驱出。因此，通过该方法制造的金属基底层压板中残留少量气泡。

67. 发明授权

US4924590A Method for making metal core printed circuit board 失效
标题翻译：制作金属芯印刷电路板的方法
公开(公告)号：US4924590A
公开(公告)日：1990-05-15
申请号：US291119
申请日：1988-12-28
申请人： Helmut Hadwiger , Hans Schmidt
发明人： Helmut Hadwiger , Hans Schmidt
IPC分类号： B32B15/08 , H05K1/00 , H05K1/05 , H05K3/38 , H05K3/44
CPC分类号： H05K3/445 , B32B15/08 , H05K1/056 , H05K1/0393 , H05K2201/0195 , H05K2201/09118 , H05K2201/09581 , H05K2203/1327 , H05K2203/1438 , H05K3/386 , Y10T29/49158 , Y10T428/31681 , Y10T428/31692 , Y10T428/31721
摘要： A method for the manufacturing of a metal core pc board which provides for manufacturing of two or three dimensional metal core pc boards of any form with or without throughplating. The manufacturing of such pc boards can occur by injection molding, injection/compressing molding or by a pressing method. High-heat resistant thermoplastics, as well as duroplastics are preferably employed as pc board materials. A metal with good thermal conductibility is used for the core. The material is selected such that the thermal expansion coefficients of the metal core and the pc board material are optimally equal. The manufacturing contains the following steps: lamination of the metal plate with a plastic foil on one or both sides; introduction of the desired hole pattern with a corresponding over dimension into the laminated metal plate; placing of such prepared metal core in an injection molding tool; and thermoforming the plastic on the laminated core over the plastic foil and simultaneously filling out the holes to a final dimension with the plastic.
摘要翻译：一种用于制造具有或不具有通孔的任何形式的二维或三维金属芯片印刷电路板的金属芯片印刷电路板的制造方法。这种印刷电路板的制造可以通过注射成型，注射/压缩成型或压制方法进行。优选使用高耐热性热塑性塑料以及硬质塑料作为印刷电路板材料。核心使用具有良好导热性的金属。选择材料使得金属芯和印刷电路板材料的热膨胀系数最佳相等。该制造包括以下步骤：金属板与塑料箔在一侧或两侧上的层叠; 将所需的具有相应尺寸的孔图案引入到层压金属板中; 将这种制备的金属芯放置在注射成型工具中; 并在塑料箔上将叠层芯上的塑料热成型，同时用塑料填充孔至最终尺寸。

68. 发明授权

US4882454A Thermal interface for a printed wiring board 失效
标题翻译：印刷电路板的热界面
公开(公告)号：US4882454A
公开(公告)日：1989-11-21
申请号：US155462
申请日：1988-02-12
申请人： Robert K. Peterson , Larry J. Mowatt , Aaron D. Poteet
发明人： Robert K. Peterson , Larry J. Mowatt , Aaron D. Poteet
IPC分类号： H05K1/02 , H05K1/05 , H05K3/40 , H05K3/44 , H05K3/46
CPC分类号： H05K1/0206 , H05K3/403 , H05K1/056 , H05K2201/0919 , H05K2201/09509 , H05K2201/09536 , H05K2201/09709 , H05K2201/09781 , H05K3/445 , H05K3/4608 , Y10T29/49149 , Y10T29/49155
摘要： A printed wiring board is comprised of a combination of layers providing a good thermal match with surface mount components. The board consists of a core surrounded by multiple layers of dielectric and conductive materials optimized for their thermal expansion qualities. The core is also used as a heat sink for drawing excess heat from the components. An integral thermal interface region is used to dissipate the heat from the core.
摘要翻译：印刷线路板由提供与表面安装部件良好热匹配的层的组合构成。该电路板包含一个被多层电介质和导电材料包围的核心，它们的热膨胀性质优化。核心也用作从组件中抽出多余热量的散热器。使用整体热界面区域来散发来自芯体的热量。

69. 发明授权

US4848646A Method for depositing solder onto aluminum metal material 失效
标题翻译：将焊料沉积到铝金属材料上的方法
公开(公告)号：US4848646A
公开(公告)日：1989-07-18
申请号：US246929
申请日：1988-09-19
申请人： Mitsuharu Morishita , Shiro Iwatani , Mitsuaki Nanba
发明人： Mitsuharu Morishita , Shiro Iwatani , Mitsuaki Nanba
IPC分类号： B23K1/20 , B23K1/00 , B23K1/19 , B23K35/00 , B23K35/14 , H05K3/44
CPC分类号： B23K1/19 , B23K35/002 , H05K3/44
摘要： A method for depositing solder onto aluminum metal material comprises steps of:(a) activating the surface of aluminum metal;(b) substituting zinc for the surface of aluminum as activated;(c) forming a nickel coating film over the surface of the zinc-substituted layer on the aluminum metal material by the non-electrode plating; and(d) attaching soldering material onto the nickel coating film surface.
摘要翻译：一种在铝金属材料上沉积焊料的方法包括以下步骤：（a）活化铝金属表面; （b）用锌代替铝的表面活化; （c）通过非电极电镀在铝金属材料上的锌取代层的表面上形成镍涂膜; 和（d）将焊接材料附着在镍涂膜表面上。

70. 发明授权

US4786381A Process for electrochemically modifying support materials of aluminum or aluminum alloys, which have been grained in a multi-stage process and use of these materials in the manufacture of offset-printing plates 失效
标题翻译：用于电化学改性铝或铝合金的支撑材料的方法，其已经在多阶段工艺中磨粒并且在制造胶版印刷版中使用这些材料
公开(公告)号：US4786381A
公开(公告)日：1988-11-22
申请号：US106646
申请日：1987-10-13
申请人： Dieter Mohr , Engelbert Pliefke
发明人： Dieter Mohr , Engelbert Pliefke
IPC分类号： B41N3/00 , B41N3/03 , C25D11/16 , C25F3/04 , H05K3/38 , H05K3/44
CPC分类号： B41N3/034 , C25D11/16 , C25F3/04 , H05K3/382 , H05K3/44
摘要： A process for electrochemically modifying support materials of aluminum or aluminum alloys, which have been grained in a multi-stage process is disclosed. These support materials can be used in the production of offset printing plates. The support material is mechanically grained in a stage I, subjected to an intermediate treatment in a stage II, electrochemically grained in a stage III, subjected to an intermediate treatment in a stage IV and anodically oxidized in a stage V. The intermediate treatment in stages II and/or IV are carried out by an electrochemical process using a direct current. The anodizing stage may be followed by a hydrophilizing stage VI.
摘要翻译：公开了一种用于电化学改性已经在多级方法中磨粒的铝或铝合金的载体材料的方法。这些支撑材料可用于生产胶版印刷版。将载体材料在阶段I中机械粒化，在阶段II中进行中间处理，电化学粒化在阶段III中，在阶段IV中进行中间处理，并在阶段V中进行阳极氧化。中间处理分阶段 II和/或IV通过使用直流电的电化学过程进行。阳极氧化阶段之后可以是亲水化阶段VI。

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