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61. 发明申请

US20170259403A1 ABRASIVE MATERIAL WITH DIFFERENT SETS OF PLURALITY OF ABRASIVE ELEMENTS 审中-公开
公开(公告)号：US20170259403A1
公开(公告)日：2017-09-14
申请号：US15310288
申请日：2015-05-19
申请人： 3M INNOVATIVE PROPERTIES COMPANY
发明人： Christopher J. Carter , Michael J. Annen , Gordon A. Kuhnley
IPC分类号： B24D11/04 , B24D11/00
CPC分类号： B24D11/04 , B24D11/005 , B24D2203/00
摘要： Described herein is an improved abrasive material (300) in which the cutting performance is orientation-independent. The abrasive material (300) comprises an abrasive structure (310) including a plurality of elongate abrasive elements (320, 330) aligned to be define a first open square. A plurality of pyramidal abrasive elements (340, 350) arranged in a second open square are located within the first open square defined by the elongate elements (320, 330).

62. 发明授权

US09616551B2 Method to provide an abrasive product surface and abrasive products thereof 有权
公开(公告)号：US09616551B2
公开(公告)日：2017-04-11
申请号：US14770689
申请日：2013-02-26
申请人： KWH MIRKA LTD
发明人： Beatriz Meana-Esteban , Göran Höglund , Hans Hede , Markus Kass , Mats Sundell
IPC分类号： B24D3/28 , B24D11/04 , B24B37/24 , B24B37/26 , B24D11/00 , B24D11/02 , B24D3/00
CPC分类号： B24D11/04 , B24B37/245 , B24B37/26 , B24D3/002 , B24D3/28 , B24D11/00 , B24D11/005 , B24D11/02
摘要： The invention relates to obtaining an abrasive product comprising a surface with multiple abrasive zones supported by a backing layer. The abrasive zone are surrounded by interconnected channel portions comprising first channel portions with a first transverse dimension td1 and second channel portions with a second transverse dimension td2 larger than the first transverse dimension td1.

63. 发明授权

US09278424B2 Customized polishing pads for CMP and methods of fabrication and use thereof 有权
公开(公告)号：US09278424B2
公开(公告)日：2016-03-08
申请号：US14489177
申请日：2014-09-17
申请人： NexPlanar Corporation
发明人： Pradip K Roy , Manish Deopura , Sudhanshu Misra
IPC分类号： B24D3/02 , B24D3/00 , B24D11/00 , B24D18/00 , C09K3/14 , B24B37/26 , B24D7/14 , B24D11/04
CPC分类号： B24B37/26 , B24D7/14 , B24D11/04
摘要： The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior themo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads. In addition, these pads can be designed to tune the coefficient of friction by surface engineering, through the addition of solid lubricants, and creating low shear integral pads having multiple layers of polymeric material which form an interface parallel to the polishing surface. The pads can also have controlled porosity, embedded abrasive, novel grooves on the polishing surface, for slurry transport, which are produced in situ, and a transparent region for endpoint detection.

64. 发明申请

US20150004889A1 COATED ABRASIVE ARTICLE BASED ON A SUNFLOWER PATTERN 审中-公开
标题翻译：基于太阳能图案的涂层磨砂制品
公开(公告)号：US20150004889A1
公开(公告)日：2015-01-01
申请号：US14317632
申请日：2014-06-27
申请人： Saint-Gobain Abrasives, Inc. , Saint-Gobain Abrasifs
发明人： Anuj SETH
IPC分类号： B24D11/04 , B24D18/00 , B24D5/14
摘要： An abrasive article having a plurality of abrasive areas arranged in a non-uniform distribution pattern, wherein the pattern is spiral or phyllotactic, such as a spiral lattice, and in particular those patterns described by the Vogel model, such as a sunflower pattern.
摘要翻译：具有以非均匀分布图案布置的多个研磨区域的磨料制品，其中所述图案是螺旋状或门状的，例如螺旋格子，特别是由Vogel模型描述的那些图案，例如向日葵图案。

65. 发明授权

US08840447B2 Method and apparatus for polishing with abrasive charged polymer substrates 有权
标题翻译：用研磨带电聚合物基材抛光的方法和设备
公开(公告)号：US08840447B2
公开(公告)日：2014-09-23
申请号：US13430297
申请日：2012-03-26
申请人： Karl Schwappach , Zine-Eddine Boutaghou
发明人： Karl Schwappach , Zine-Eddine Boutaghou
IPC分类号： B24B41/02 , B24D11/04 , B24D11/00
CPC分类号： B24D11/00 , Y10T29/5397
摘要： An abrasive article for polishing a surface of a workpiece. The abrasive article includes a plurality of polishing islands arranged to interact with a workpiece to maintain a substantially constant contact area. Abrasive features are associated with at least some of the plurality of polishing islands. The abrasive features apply cutting forces to the work piece during motion of the abrasive article relative to the workpiece.
摘要翻译：用于抛光工件表面的磨料制品。研磨制品包括多个抛光岛，其布置成与工件相互作用以保持基本上恒定的接触面积。研磨特征与多个抛光岛中的至少一些相关联。磨料特征在磨料制品相对于工件的运动期间将切削力施加到工件上。

66. 发明申请

US20130005229A1 METHOD AND APPARATUS FOR POLISHING WITH ABRASIVE CHARGED POLYMER SUBSTRATES 有权
标题翻译：用抛光电荷聚合物基板抛光的方法和装置
公开(公告)号：US20130005229A1
公开(公告)日：2013-01-03
申请号：US13430297
申请日：2012-03-26
申请人： Karl Schwappach , Zine-Eddine Boutaghou
发明人： Karl Schwappach , Zine-Eddine Boutaghou
IPC分类号： B24D11/04
CPC分类号： B24D11/00 , Y10T29/5397
摘要： An abrasive article for polishing a surface of a workpiece. The abrasive article includes a plurality of polishing islands arranged to interact with a workpiece to maintain a substantially constant contact area. Abrasive features are associated with at least some of the plurality of polishing islands. The abrasive features apply cutting forces to the work piece during motion of the abrasive article relative to the workpiece.
摘要翻译：用于抛光工件表面的磨料制品。研磨制品包括多个抛光岛，其布置成与工件相互作用以保持基本上恒定的接触面积。研磨特征与多个抛光岛中的至少一些相关联。磨料特征在磨料制品相对于工件的运动期间将切削力施加到工件上。

67. 发明授权

US07520796B2 Polishing pad with grooves to reduce slurry consumption 有权
公开(公告)号：US07520796B2
公开(公告)日：2009-04-21
申请号：US12005241
申请日：2007-12-26
申请人： Gregory P. Muldowney
发明人： Gregory P. Muldowney
IPC分类号： B24B1/00 , B24B7/10 , B24B7/30 , B24B5/00 , B24B29/00 , B24D11/04
CPC分类号： B24D11/04 , B24B37/26
摘要： A chemical mechanical polishing pad having an annular polishing track and a concentric center O. The polishing pad includes a polishing layer having a plurality of pad grooves formed therein. The polishing pad is designed for use with a carrier, e.g., a wafer carrier, that includes a polishing ring having a plurality of carrier grooves. Each of the plurality of pad grooves has a carrier-compatible groove shape configured to enhance the transport of a polishing medium beneath the carrier ring on the leading edge of the carrier ring during polishing.

68. 发明申请

US20080182492A1 Chemical mechanical polishing pad 有权
标题翻译：化学机械抛光垫
公开(公告)号：US20080182492A1
公开(公告)日：2008-07-31
申请号：US11699775
申请日：2007-01-29
申请人： T. Todd Crkvenac , Clyde A. Fawcett , Mary Jo Kulp , Andrew Scott Lawing , Kenneth A. Prygon
发明人： T. Todd Crkvenac , Clyde A. Fawcett , Mary Jo Kulp , Andrew Scott Lawing , Kenneth A. Prygon
IPC分类号： B24D11/04
CPC分类号： B24D11/04 , B24B37/24 , Y10T428/249977 , Y10T428/249978 , Y10T428/249979 , Y10T428/249986
摘要： The polishing pad is suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad has an ultimate tensile strength of at least 3,000 psi (20.7 MPa) and polymeric matrix containing closed cell pores. The closed cell pores have an average diameter of 1 to 50 μm and represent 1 to 40 volume percent of the polishing pad. The pad texture has an exponential decay constant, τ, of 1 to 10 μm as a result of the natural porosity of the polymeric matrix and a surface texture developed by implementing periodic or continuous conditioning with an abrasive. The surface texture has a characteristic half height half width, W1/2 that is less than or equal to the value of τ.
摘要翻译：抛光垫适用于平面化半导体，光学和磁性基板中的至少一个。抛光垫具有至少3,000psi（20.7MPa）的极限拉伸强度和含有闭孔细孔的聚合物基体。闭孔细孔的平均直径为1〜50μm，为抛光垫的1〜40体积％。由于聚合物基体的天然孔隙率和通过用研磨剂实施周期性或连续调节而形成的表面纹理，衬垫纹理具有1-10μm的指数衰减常数τ，为1-10μm。表面纹理具有小于或等于tau值的特征半高度半宽度W 1/2 1/2。

69. 发明授权

US07235114B1 Flexible abrasive article 有权
标题翻译：柔性磨料制品
公开(公告)号：US07235114B1
公开(公告)日：2007-06-26
申请号：US11376899
申请日：2006-03-16
申请人： Chris A. Minick , Ian R. Owen
发明人： Chris A. Minick , Ian R. Owen
IPC分类号： B24D3/00 , B24D11/00 , B24D11/04
CPC分类号： B24D3/004 , B24D11/00 , B24D11/04
摘要： A resilient flexible abrasive article includes a continuous backing layer including a support layer coated with foam, the continuous backing layer having opposed major surfaces, at least one of the major surfaces including a three dimensional surface topography including raised and recessed regions, and wherein the raised and recess regions are at least partially coated with abrasive particles, thereby defining an abrasive surface.
摘要翻译：弹性柔性磨料制品包括连续背衬层，其包括涂覆有泡沫的支撑层，所述连续背衬层具有相对的主表面，所述主表面中的至少一个包括包括凸起和凹陷区域的三维表面形貌，并且其中所述凸起并且凹陷区域至少部分地涂覆有磨料颗粒，从而限定研磨表面。

70. 发明授权

US06960123B2 Cleaning sheet for probe needles 失效
标题翻译：探针针清洁片
公开(公告)号：US06960123B2
公开(公告)日：2005-11-01
申请号：US10968991
申请日：2004-10-21
申请人： Kenji Mitarai
发明人： Kenji Mitarai
IPC分类号： G01R31/26 , B08B1/00 , B24D3/00 , B24D11/00 , B24D11/04 , G01R1/06 , H01L21/66 , B24B19/00
CPC分类号： B08B1/00 , B08B1/008 , B24D11/04
摘要： A cleaning sheet has a disc-shaped substrate. First and second polishing layers are disposed over the substrate. The first polishing layer has a surface formed in a surface-roughened fashion to polish a tip section of each probe needle and has the function of removing adherents leading to inhibition of electrical conduction, which have been adhered to the tip of the needle in a coating or film form. The second polishing layer is a layer in which a large number of polishing grains are mixed into an elastic member and has the function of sticking the tip of the probe needle into the elastic member to remove foreign substances. The height of the surface of the second polishing layer is set so as to become identical to or slightly higher than that of the surface of the first polishing layer.
摘要翻译：清洁片具有盘状基板。第一和第二抛光层设置在基板上。第一抛光层具有以表面粗糙的方式形成的表面以抛光每个探针的尖端部分，并且具有去除粘附剂的功能，其导致抑制电传导，这已经粘附到针的涂层中或电影形式。第二抛光层是将大量的研磨粒子混合到弹性部件中的层，并且具有将探针的尖端粘贴到弹性部件中以去除异物的功能。将第二研磨层的表面的高度设定为与第一研磨层的表面相同或略高。

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