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61. 发明授权

US07099157B2 Retaining and heat dissipating structure for electronic equipment 失效
标题翻译：电子设备的保温和散热结构
公开(公告)号：US07099157B2
公开(公告)日：2006-08-29
申请号：US10512854
申请日：2003-05-07
申请人： Fabrizio Boer , Mario Biserni
发明人： Fabrizio Boer , Mario Biserni
IPC分类号： H05K7/20
CPC分类号： H05K7/20463
摘要： A retaining and heat dissipating structure for electronic equipments installed aboard space, air or land vehicles comprises a ceramic powder (7), possibly mixed with a lightening material (8), placed with a certain degree of compression inside a container housing the printed circuit boards (1) carrying the equipment components (2).
摘要翻译：安装在太空，空中或陆地车辆上的电子设备的保持和散热结构包括可能与减轻材料（8）混合的陶瓷粉末（7），其以一定程度的压缩放置在容纳印刷电路板的容器内（1）携带设备部件（2）。

62. 发明授权

US06860004B2 Method of manufacturing a thermally conductive circuit board with a ground pattern connected to a heat sink 有权
标题翻译：制造具有连接到散热器的接地图案的导热电路板的方法
公开(公告)号：US06860004B2
公开(公告)日：2005-03-01
申请号：US10309707
申请日：2002-12-03
申请人： Koichi Hirano , Seiichi Nakatani , Mitsuhiro Matsuo , Yoshihisa Yamashita
发明人： Koichi Hirano , Seiichi Nakatani , Mitsuhiro Matsuo , Yoshihisa Yamashita
IPC分类号： C08J5/18 , B29C43/18 , C08K3/00 , C08L101/00 , H01L23/373 , H01L23/433 , H01L23/498 , H01L23/50 , H05K1/02 , H05K1/03 , H05K1/05 , H05K3/20 , H05K3/40 , H05K7/20 , H05K3/30
CPC分类号： H05K7/205 , H01L23/3737 , H01L23/4334 , H01L23/49861 , H01L24/45 , H01L24/48 , H01L2224/451 , H01L2224/48247 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/1305 , H01L2924/13055 , H01L2924/19041 , H05K1/0204 , H05K1/056 , H05K3/0061 , H05K3/202 , H05K3/4084 , H05K7/20463 , H05K2201/0209 , H05K2201/0382 , H05K2201/09054 , H05K2201/0969 , H05K2201/10416 , H05K2203/1189 , Y10T29/49121 , Y10T29/4913 , Y10T29/49146 , Y10T29/49158 , Y10T29/49171 , Y10T29/49172 , H01L2924/00 , H01L2224/05599
摘要： In a method of manufacturing a thermally conductive circuit board with high heat dissipation, high conductivity and high ground-connection, a sheet-like thermally conductive resin composition containing 70 to 95 wt. % inorganic filler and 5 to 30 wt. % thermosetting resin composition, a lead frame as a wiring pattern, and an electrically conductive heat sink with a metal pole placed therein are superposed, heated and compressed, and thus are combined to form one body. Consequently, a thermally conductive circuit board with a flat surface is obtained in which a grounding pattern is grounded to the heat sink inside the insulating layer. Thus, the grounding pattern and the heat sink can be connected electrically with each other in an arbitrary position inside the insulating layer of the thermally conductive circuit board. The method provides that a part of a lead frame and heat sink are connected not only mechanically, but also electrically, and allows an associated power module size to be reduced and its density to be increased.
摘要翻译：在具有高散热，高导电性和高接地连接的导热电路板的制造方法中，含有70〜95重量份的片状导热性树脂组合物，％无机填料和5〜30wt。热固性树脂组合物，作为布线图案的引线框架和放置有金属极的导电散热器叠加，加热和压缩，从而组合形成一体。因此，获得了具有平坦表面的导热电路板，其中接地图被接地到绝缘层内的散热片。因此，接地图案和散热器可以在导热电路板的绝缘层内的任意位置彼此电连接。该方法提供引线框架和散热器的一部分不仅机械地而且电连接，并且允许相关联的功率模块尺寸减小并且其密度增加。

63. 发明授权

US06704202B1 Power controller and compressor for refrigeration system 有权
标题翻译：用于制冷系统的功率控制器和压缩机
公开(公告)号：US06704202B1
公开(公告)日：2004-03-09
申请号：US10009448
申请日：2002-04-09
申请人： Koji Hamaoka , Keiji Ogawa , Tomonori Nakano
发明人： Koji Hamaoka , Keiji Ogawa , Tomonori Nakano
IPC分类号： H05K720
CPC分类号： H05K5/064 , F25B2600/021 , F25D23/006 , F25D2400/40 , H05K7/20463 , H05K7/209 , Y02B30/741
摘要： The present invention solves a problem that a power controller be large in a refrigerating system, and provides a compact-size as well as an inexpensive power controller. Highly heat-dissipating first board 1 including an inverter circuit mounted thereon and second board including a control circuit mounted thereon are placed in parallel with each other and accommodated by case 9. Case 9 has slits through which heat sink 2 and connector 6 can extend outside case 9, and further has fixing section 11 for fixing case 9 to a compressor. This structure allows the power controller to dissipate heat in an optimum manner and to be downsized, and also allows the compressor to integrate the controller thereinto. A capacity that the controller occupies in the refrigerating system can be substantially reduced.
摘要翻译：本发明解决了在制冷系统中功率控制器大的问题，并且提供了紧凑型以及廉价的功率控制器。包括安装在其上的逆变器电路和包括安装在其上的控制电路的第二板的高度散热的第一板1彼此平行地放置并由壳体9容纳。壳体9具有狭缝，散热器2和连接器6可以通过该狭缝延伸到外部壳体9，并且还具有用于将壳体9固定到压缩机的固定部分11。这种结构允许功率控制器以最佳方式散热并且被小型化，并且还允许压缩机将控制器集成到其中。控制器在制冷系统中占据的容量可以大大降低。

64. 发明授权

US5663869A Packaging electrical components 失效
标题翻译：包装电气元件
公开(公告)号：US5663869A
公开(公告)日：1997-09-02
申请号：US588015
申请日：1996-01-17
申请人： Patrizio Vinciarelli , Fred Finnemore , John S. Balog , Brant T. Johnson
发明人： Patrizio Vinciarelli , Fred Finnemore , John S. Balog , Brant T. Johnson
IPC分类号： H05K1/14 , H01L25/07 , H01L25/16 , H05K3/34 , H05K5/00 , H05K7/20
CPC分类号： H05K7/20463 , H01L24/49 , H01L25/072 , H01L25/162 , H05K5/0091 , H01L2224/05553 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/49 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/1306 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011
摘要： A package for electrical components in which a circuit board holds the components. The package includes an enclosure having generally parallel, spaced apart upper and lower internal surfaces. The circuit board lies generally parallel to the lower internal surface with the electrical components held in an internal space between the circuit board and the upper internal surface. Conductive terminal pins extend from outside the enclosure into the internal space. The terminal pins are connected to the circuit board by conductive links, each link having an end attached to the periphery of the circuit board and another end projecting into the internal space. In other aspects, a resilient non-compressive encapsulant is used to fill a space within the package; an electronic component is mounted with a power-dissipating device sitting in the aperture of a circuit board, a power-dissipating surface in contact with a baseplate, and contact pads electrically connected to the circuit board; terminal pins are connected to a circuit board using a fence connected at the periphery of the circuit board, the fence extending substantially perpendicularly to the circuit board, the fence comprising at least two conductive links joined by a severable junction.
摘要翻译：用于电路元件的封装，其中电路板保持元件。该包装包括具有大致平行的间隔开的上下内表面的外壳。电路板大致平行于下部内部表面，电气部件保持在电路板和上部内部表面之间的内部空间中。导电端子引脚从外壳外部延伸到内部空间。端子引脚通过导电连接器连接到电路板，每个连接件的端部连接到电路板的外围，另一端伸入内部空间。在其他方面，弹性非压缩密封剂用于填充包装内的空间; 电子部件安装有位于电路板的孔中的功率消耗装置，与基板接触的功率耗散表面和电连接到电路板的接触垫; 端子引脚使用连接在电路板周围的栅栏连接到电路板，栅栏基本上垂直于电路板延伸，栅栏包括由可分断的连接点连接的至少两个导电链路。

65. 发明授权

US5373418A Electrical device for mounting electrical components with enhanced thermal radiating properties 失效
标题翻译：用于安装具有增强散热性能的电气元件的电气设备
公开(公告)号：US5373418A
公开(公告)日：1994-12-13
申请号：US675202
申请日：1991-03-26
申请人： Satoru Hayasi
发明人： Satoru Hayasi
IPC分类号： H01L23/40 , H02M7/00 , H05K1/02 , H05K1/18 , H05K3/32 , H05K7/06 , H05K7/20
CPC分类号： H05K1/0203 , H01L23/4006 , H01L24/01 , H02M7/003 , H05K7/20436 , H05K7/20463 , H01L2023/4031 , H01L2023/4062 , H01L2924/181 , H05K2201/062 , H05K2201/09745 , H05K2201/10015 , H05K2201/10409 , H05K2201/1056 , H05K3/325
摘要： An electrical device for mounting electrical components includes an integrally die-cast aluminum base 20 having at an upper side thereof recesses 20a for receiving the electrical components and at the bottom side thereof radiator fins 20b for radiating heat generated by the electrical components. The terminals 31 of the electrical components accommodated in the recesses of the metal base 20 are substantially at the same height and electrical interconnection among them is secured via the conductors 21a carried on a printed circuit board 21. A high heat conductivity resin material 29 is interposed between the recesses and components 22, 23, and 27 that generate a large amount of heat. On the other hand, a heat insulating resin material 30 is interposed between the recess and the component 26 that generates a small or negligible amount of heat.
摘要翻译：用于安装电气部件的电气装置包括：整体压铸铝基座20，其具有在其上侧的用于接收电气部件的凹部20a和用于散发由电气部件产生的热量的散热片20b的散热片20b的底侧。容纳在金属基座20的凹部中的电气部件的端子31基本上处于相同的高度，并且通过承载在印刷电路板21上的导体21a来确保它们之间的电气互连。插入高导热性树脂材料29 在产生大量热量的凹部和部件22,23和27之间。另一方面，绝热树脂材料30插入在凹部和产生小的或可忽略的热量的部件26之间。

66. 发明授权

US5365403A Packaging electrical components 失效
标题翻译：包装电气元件
公开(公告)号：US5365403A
公开(公告)日：1994-11-15
申请号：US177797
申请日：1994-01-06
申请人： Patrizio Vinciarelli , Fred Finnemore , John S. Balog , Brant T. Johnson
发明人： Patrizio Vinciarelli , Fred Finnemore , John S. Balog , Brant T. Johnson
IPC分类号： H05K1/14 , H01L25/07 , H01L25/16 , H05K3/34 , H05K5/00 , H05K7/20
CPC分类号： H05K7/20463 , H01L24/49 , H01L25/072 , H01L25/162 , H05K5/0091 , H01L2224/05553 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/49 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/1306 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011
摘要： A package for electrical components in which a circuit board holds the components. The package includes an enclosure having generally parallel, spaced apart upper and lower internal surfaces. The circuit board lies generally parallel to the lower internal surface with the electrical components held in an internal space between the circuit board and the upper internal surface. Conductive terminal pins extend from outside the enclosure into the internal space. The terminal pins are connected to the circuit board by conductive links, each link having an end attached to the periphery of the circuit board and another end projecting into the internal space. In other aspects, a resilient non-compressive encapsulant is used to fill a space within the package; an electronic component is mounted with a power-dissipating device sitting in the aperture of a circuit board, a power-dissipating surface in contact with a baseplate, and contact pads electrically connected to the circuit board; terminal pins are connected to a circuit board using a fence connected at the periphery of the circuit board, the fence extending substantially perpendicularly to the circuit board, the fence comprising at least two conductive links joined by a severable junction.
摘要翻译：用于电路元件的封装，其中电路板保持元件。该包装包括具有大致平行的间隔开的上下内表面的外壳。电路板大致平行于下部内部表面，电气部件保持在电路板和上部内部表面之间的内部空间中。导电端子引脚从外壳外部延伸到内部空间。端子引脚通过导电连接器连接到电路板，每个连接件的端部连接到电路板的外围，另一端伸入内部空间。在其他方面，弹性非压缩密封剂用于填充包装内的空间; 电子部件安装有位于电路板的孔中的功率消耗装置，与基板接触的功率耗散表面和电连接到电路板的接触垫; 端子引脚使用连接在电路板周围的栅栏连接到电路板，栅栏基本上垂直于电路板延伸，栅栏包括由可分断的连接点连接的至少两个导电链路。

67. 再颁专利

USRE29683E Encapsulation housing for electronic circuit boards or the like and method of encapsulating 失效
标题翻译：用于电子电路板等的封装外壳和封装方法
公开(公告)号：USRE29683E
公开(公告)日：1978-06-27
申请号：US773081
申请日：1977-02-28
申请人： Alfred Ocken, Jr.
发明人： Alfred Ocken, Jr.
IPC分类号： H05K5/00 , H01L23/28 , H05K3/28 , H05K5/06 , H05K7/20
CPC分类号： H05K5/064 , H05K7/20463 , H05K3/284
摘要： A control device assembled on a circuit board is suitably encapsulated within a protective housing on a multiple unit basis especially suited for automation. A plurality of housings are arranged in an upright, side-by-side relation so that the associated circuit board may be inserted from a vertical direction and correctly positioned within the housing by a pair of guide rails and the action of gravity. The housings may then be suitably encapsulated utilizing a continuous and uninterrupted flow of encapsulating material. The housing itself is fabricated of a non-metallic, thermosetting material unaffected during subsequent operation in elevated ambient temperatures. The housing further includes a laterally extending lip or ledge which overlies a top portion of the next adjacent housing during assembly and encapsulation. Mounting holes are provided of a configuration to permit a wide variety of mounting locations.

68. 发明授权

US3257621A Transistor amplifiers and thermal enclosure therefor 失效
标题翻译：晶体管放大器及其热封
公开(公告)号：US3257621A
公开(公告)日：1966-06-21
申请号：US26242463
申请日：1963-03-04
申请人： ANCIENS ETS SUPLI
发明人： ERNEST JADOUL
IPC分类号： H03F1/30 , H05K7/20
CPC分类号： H03F1/302 , H03F1/30 , H05K7/20463

69. 发明授权

US3121188A Electronic component packaging 失效
标题翻译：电子元件包装
公开(公告)号：US3121188A
公开(公告)日：1964-02-11
申请号：US16951362
申请日：1962-01-29
申请人： GOODYEAR AEROSPACE CORP
发明人： FOSTER ROBERT J
IPC分类号： H05K7/20
CPC分类号： H05K7/20463

70. 发明申请

US20190045665A1 THERMAL COOLING SYSTEM 审中-公开
公开(公告)号：US20190045665A1
公开(公告)日：2019-02-07
申请号：US16146927
申请日：2018-09-28
申请人： Intel Corporation
发明人： Bijendra Singh , Sachin Bedare
IPC分类号： H05K7/20 , C09K5/06
CPC分类号： H01L23/4275 , G06F1/20 , H05K1/02 , H05K7/2029 , H05K7/20463 , H05K7/205
摘要： Particular embodiments described herein provide for a thermal cooling system that is part of a device that includes a hole-in-motherboard configuration. The device can include a substrate, one or more dies on a top portion of the substrate, one or more printed circuit boards below the substrate, where the printed circuit boards are coupled to the substrate with solder balls, and one or more land side capacitors below the substrate. A thermal conducting plate, phase change material, and one or more sponge walls to help insulate the solder balls from the thermal conductive layer can be located in the hole of the hole-in-motherboard configuration and help transfer heat and thermal energy away from the device.

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