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61. 发明申请

US20160334088A1 Solder-Less Electrical Assembly 审中-公开
标题翻译：无焊接电气组件
公开(公告)号：US20160334088A1
公开(公告)日：2016-11-17
申请号：US14709319
申请日：2015-05-11
申请人： Carmen Rapisarda
发明人： Carmen Rapisarda
IPC分类号： F21V23/06 , H05K5/00 , H01R13/41 , H05K1/18 , H01R12/79 , H01R25/00
CPC分类号： F21V23/06 , F21Y2115/10 , H01M2/1044 , H01M2/20 , H01M2220/30 , H01R4/2404 , H01R4/26 , H01R12/592 , H01R12/79 , H01R13/41 , H01R13/506 , H01R13/665 , H01R25/003 , H05K1/184 , H05K3/325 , H05K5/0026 , H05K5/0091 , H05K2201/10037 , H05K2201/10106 , H05K2201/10363 , H05K2201/10393 , H05K2203/0173
摘要： An electrical component with two conductive leads and two conductive wires are held within a housing. Each lead is inserted into a housing hole to make electrical contact with a wire conductor. Multiple additional electrical components (which may or may not be LEDs) can be held in similar housings attached their own pairs of wires. A PCB assembly can be attached to hold one or more such assemblies. A resilient PCB housing holds a PCB by an interference fit while conductive wires are inserted into its wire cavity so that exposed portions of conductive wires make electrical contact with electrical traces of the PCB which is biased by wire insulation. Two conductors can be held by the PCB housing which are forced into electrical contact with the PCB when it is inserted into the resilient PCB housing which then biases such contacts. Insertion of a battery into the PCB housing creates an interference fit and causes each of the conductors (which can have a u shape before assembly and then have one or more leads bend over during assembly) to make mechanical and electrical contact with the battery. A switch can also be held by a switch interference fit with the resilient PCB housing such that its leads are biased against the PCB by the resilient PCB housing. The entire assembly is solder-less and can have multiple strings of two or more LEDs, and other electrical components, energized by the battery.
摘要翻译：具有两个导电引线和两根导线的电气部件被保持在壳体内。每个引线插入到壳体孔中以与导线电接触。可以将多个额外的电气部件（其可以是或可以不是LED）保持在连接其自己的电线对的类似壳体中。可以连接PCB组件以保持一个或多个这样的组件。弹性PCB外壳通过过盈配合来保持PCB，同时将导线插入其导线腔中，使得导线的暴露部分与由电线绝缘偏压的PCB的电迹线电接触。两个导线可以被PCB外壳固定，当PCB插入到弹性PCB外壳中时，PCB外壳将被强制与PCB电接触，然后偏置这些触点。将电池插入到PCB外壳中会产生干涉配合，并使每个导体（组装前可以具有u形，然后在组装期间具有一个或多个引线弯曲），以使其与电池机械和电接触。也可以通过与弹性PCB外壳的过盈配合来保持开关，使得其引线被弹性PCB外壳偏置在PCB上。整个组件是无焊料的，并且可以具有多个串联的两个或更多个LED以及由电池供电的其它电气部件。

62. 发明授权

US09244232B2 Circuit module 有权
标题翻译：电路模块
公开(公告)号：US09244232B2
公开(公告)日：2016-01-26
申请号：US14727040
申请日：2015-06-01
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
发明人： Terrel Morris
IPC分类号： H05K7/20 , H01L23/40 , H01L25/16 , H04N5/225 , G02B6/42 , H04N5/335 , H05K3/32 , H05K3/34 , H01L23/42 , H01L23/00 , H01L27/146
CPC分类号： G02B6/4269 , G02B6/4261 , G02B6/428 , G02B6/4285 , H01L23/4006 , H01L23/4093 , H01L23/42 , H01L24/16 , H01L25/167 , H01L27/14618 , H01L2224/16225 , H01L2924/14 , H01L2924/1433 , H01L2924/1434 , H01L2924/15192 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H04N5/2253 , H04N5/335 , H05K3/325 , H05K3/34 , H05K2201/10121 , H05K2201/10393 , Y10T29/49126 , Y10T29/49144
摘要： A circuit module can include a substrate, a photonic conversion unit placed on the substrate; and a retention assembly. The retention assembly can include a heat sink in thermal contact with the photonic conversion unit and a fastener. The fastener can be mechanically coupled to both the substrate and the heat sink, and configured to press the heat sink against the photonic conversion unit. The photonic conversion unit is removably secured to the substrate by the retention assembly without the use of a bonding material.
摘要翻译：电路模块可以包括衬底，放置在衬底上的光子转换单元; 和保持组件。保持组件可以包括与光子转换单元和紧固件热接触的散热器。紧固件可以机械地耦合到基板和散热器两者，并且被配置为将散热器压靠光子转换单元。光子转换单元通过保持组件可移除地固定到基板上，而不使用粘结材料。

63. 发明授权

US08842952B2 Optical module 有权
标题翻译：光模块
公开(公告)号：US08842952B2
公开(公告)日：2014-09-23
申请号：US13974232
申请日：2013-08-23
申请人： Fujikura Ltd.
发明人： Takayuki Tanaka , Sawako Yamai , Osamu Kikuchi , Susumu Okabe
IPC分类号： G02B6/42 , G02B6/43 , G02B6/36 , H05K1/18
CPC分类号： G02B6/4292 , G02B6/42 , G02B6/4206 , G02B6/4214 , G02B6/423 , G02B6/4244 , G02B6/4245 , G02B6/4246 , G02B6/4259 , G02B6/4269 , G02B6/4284 , G02B6/43 , H05K1/0274 , H05K1/141 , H05K2201/09063 , H05K2201/10121 , H05K2201/10189 , H05K2201/10393 , H05K2201/10598
摘要： An optical module includes: a transparent substrate through which light can pass; a photoelectric conversion element mounted on the transparent substrate and emitting light toward the transparent substrate or receiving light having passed through the transparent substrate; and a support member supporting an optical fiber for transmitting light, the support member and the transparent substrate forming an optical path between the photoelectric conversion element and the optical fiber. A positioning hole is formed in the transparent substrate. A positioning pin having a tapered surface is formed on the support member. The transparent substrate and the support member are positioned with respect to one another by inserting the positioning pin into the positioning hole along the optical axis direction of light between the transparent substrate and the support member and by making the tapered surface of the positioning pin contact the edge of the positioning hole without leaving any space therebetween.
摘要翻译：光学模块包括：光可通过的透明基板; 安装在透明基板上的光电转换元件，朝向透明基板发射光，或接收透过透明基板的光; 以及支撑部件，其支撑用于透光的光纤，所述支撑部件和所述透明基板在所述光电转换元件与所述光纤之间形成光路。在透明基板中形成定位孔。具有锥形表面的定位销形成在支撑构件上。通过将透明基板和支撑部件之间的光轴方向的定位销插入定位孔，并且通过使定位销的锥形表面接触定位销，透明基板和支撑部件相对于彼此定位定位孔的边缘，而不在其间留下任何空间。

64. 发明申请

US20140211415A1 CONSOLIDATED THERMAL MODULE 审中-公开
标题翻译：综合热模块
公开(公告)号：US20140211415A1
公开(公告)日：2014-07-31
申请号：US14145584
申请日：2013-12-31
申请人： Apple Inc.
发明人： Brett W. Degner , Gregory Tice
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： G06F1/20 , H01L23/4006 , H01L23/427 , H01L23/473 , H01L2924/0002 , H05K3/301 , H05K7/12 , H05K7/20 , H05K7/20254 , H05K2201/064 , H05K2201/10265 , H05K2201/10325 , H05K2201/10393 , H05K2201/10704 , H05K2203/0278 , Y10T29/49124 , Y10T29/49826 , Y10T29/53113 , H01L2924/00
摘要： A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.
摘要翻译：公开了一种适用于去除在紧凑的计算环境中工作的集成电路产生的多余热量的低轮廓散热系统。

65. 发明授权

US08785783B2 Protective cover for a flexible printed circuit board 有权
标题翻译：柔性印刷电路板的保护盖
公开(公告)号：US08785783B2
公开(公告)日：2014-07-22
申请号：US13124710
申请日：2009-10-09
申请人： Klaus Scharrer , Tilo Liebl , Matthias Wieczorek , Alexander Wenk , Juergen Henniger , Karl-Heinz Baumann , Barbara Haering
发明人： Klaus Scharrer , Tilo Liebl , Matthias Wieczorek , Alexander Wenk , Hans-Juergen Haering , Juergen Henniger , Karl-Heinz Baumann
IPC分类号： H05K1/03
CPC分类号： H05K3/00 , H05K1/118 , H05K3/0058 , H05K2201/10393 , H05K2201/2009 , H05K2203/0165 , H05K2203/0169
摘要： A protective cover for mounting a flexible printed circuit board in a protected manner, includes a protective unit for covering a surface of the flexible printed circuit board and a connecting unit for securely connecting a reinforcing plate to the protective cover.
摘要翻译：用于以受保护的方式安装柔性印刷电路板的保护盖包括用于覆盖柔性印刷电路板的表面的保护单元和用于将加强板牢固地连接到保护盖的连接单元。

66. 发明申请

US20140104791A1 MOUNTING APPARATUS FOR BRACKET OF HEAT SINK 审中-公开
标题翻译：安装支架的安装装置
公开(公告)号：US20140104791A1
公开(公告)日：2014-04-17
申请号：US13930163
申请日：2013-06-28
申请人： HON HAI PRECISION INDUSTRY CO., LTD. , HONG FU JIN PRECISION INDUSTRY (ShenZhen) Co., Ltd
发明人： CHIH-HAO YANG , XIANG-KUN ZENG , RONG YANG , CHENG HAO
IPC分类号： H05K1/02
CPC分类号： H05K1/021 , H01L23/4093 , H01L2924/0002 , H05K1/0203 , H05K3/301 , H05K2201/09063 , H05K2201/10393 , H01L2924/00
摘要： A circuit board assembly includes a circuit board and a bracket of a heat sink. The bracket of the heat sink includes a pair of first securing feet and a pair of second securing feet opposite to the pair of first securing feet. A pair of first securing members is secured to the circuit board. A pair of second securing members is secured to the circuit board facing the pair of first securing members. The pair of first securing members includes a pair of elastic pieces which faces the pair of second securing members. The pair of first securing feet abuts against the pair of elastic pieces to elastically deform the pair of elastic pieces. The pair of elastic pieces exerts force on the bracket to push the pair of second securing feet to abut against the pair of second securing members.
摘要翻译：电路板组件包括电路板和散热器的支架。散热器的支架包括一对第一固定支脚和与该对第一固定支脚相对的一对第二固定支脚。一对第一固定构件固定到电路板上。一对第二固定构件被固定到面对该对第一固定构件的电路板上。所述一对第一固定构件包括面对所述一对第二固定构件的一对弹性片。一对第一固定脚抵靠在一对弹性片上，使弹性片弹性变形。一对弹性片在支架上施加力以推动该对第二固定脚抵靠该对第二固定构件。

67. 发明授权

US08697265B2 Protection circuit module for secondary battery and battery pack having the same 有权
标题翻译：具有相同功能的二次电池和电池组的保护电路模块
公开(公告)号：US08697265B2
公开(公告)日：2014-04-15
申请号：US12851450
申请日：2010-08-05
申请人： Young-Cheol Jang
发明人： Young-Cheol Jang
IPC分类号： H01M2/22 , H01M2/34
CPC分类号： H01M10/42 , H01M2/34 , H01M10/425 , H01M2200/00 , H05K3/32 , H05K2201/10037 , H05K2201/10393 , H05K2201/10962
摘要： There are provided a protection circuit module for a secondary battery and a battery pack having the same. In one embodiment, a protection circuit module includes a mounting substrate and at least one connecting member positioned at one side of the mounting substrate. The connecting member is provided with a first layer having a first surface, a second layer having a second surface opposite to the first surface, and at least one spacer that allows the first and second surfaces to be spaced apart from each other.
摘要翻译：提供了一种用于二次电池的保护电路模块和具有该保护电路模块的电池组。在一个实施例中，保护电路模块包括安装基板和位于安装基板的一侧的至少一个连接构件。连接构件设置有具有第一表面的第一层，具有与第一表面相对的第二表面的第二层和允许第一表面和第二表面彼此间隔开的至少一个间隔件。

68. 发明授权

US08568001B2 LED socket assembly 有权
标题翻译： LED插座总成
公开(公告)号：US08568001B2
公开(公告)日：2013-10-29
申请号：US13365801
申请日：2012-02-03
申请人： Christopher George Daily , Matthew Edward Mostoller , Ronald Martin Weber
发明人： Christopher George Daily , Matthew Edward Mostoller , Ronald Martin Weber
IPC分类号： F21V21/00 , F21V21/08
CPC分类号： F21V19/004 , F21V19/0055 , F21Y2115/10 , H05K3/0061 , H05K2201/10393
摘要： A socket assembly includes a light emitting diode (LED) package having an LED printed circuit board (PCB) with an LED mounted thereto. The socket assembly also includes a clamp for holding the LED package to a support structure. The clamp includes a base that is configured to be mounted to the support structure such that the base engages the support structure. The clamp also includes a spring finger that extends from the base such that the base and the spring finger define a unitary body of the clamp. The spring finger is configured to engage the LED PCB of the LED package and apply a clamping force to the LED PCB that acts in a direction toward the support structure.
摘要翻译：插座组件包括具有安装有LED的LED印刷电路板（PCB）的发光二极管（LED）封装。插座组件还包括用于将LED封装保持到支撑结构的夹具。夹具包括被构造成安装到支撑结构的基部，使得基部接合支撑结构。夹具还包括从基部延伸的弹簧指，使得基部和弹簧手指限定夹具的整体。弹簧手指配置成接合LED封装的LED PCB，并向朝向支撑结构的方向作用的LED PCB施加夹紧力。

69. 发明授权

US08125783B2 Printed circuit board and electronic apparatus 有权
标题翻译：印刷电路板和电子设备
公开(公告)号：US08125783B2
公开(公告)日：2012-02-28
申请号：US12560243
申请日：2009-09-15
申请人： Makoto Tanaka
发明人： Makoto Tanaka
IPC分类号： H05K7/20
CPC分类号： H05K1/0271 , G06F1/203 , H01L23/427 , H01L2924/0002 , H05K1/0203 , H05K1/181 , H05K3/0058 , H05K2201/10393 , H05K2201/10409 , H05K2201/2009 , H01L2924/00
摘要： According to one embodiment, a printed circuit board comprises a printed wiring board, circuit component, reinforcing plate and first and second fixing portion. The printed wiring board includes first and second areas. A reinforcing plate secured to the other of the first and second surfaces in said at least one of the first and second areas. The first fixing portion is provided on a border line that defines the first and second areas. The first fixing portion can fix the reinforcing plate to both the first and second areas. The second fixing portion comprises a plurality of apertures arranged symmetrical with respect to the border line.
摘要翻译：根据一个实施例，印刷电路板包括印刷线路板，电路部件，加强板以及第一和第二固定部分。印刷电路板包括第一和第二区域。一个固定在所述第一和第二区域的所述至少一个中的第一和第二表面中的另一个表面上的加强板。第一固定部分设置在限定第一和第二区域的边界线上。第一固定部分可以将加强板固定到第一和第二区域。第二固定部分包括相对于边界线对称布置的多个孔。

70. 发明申请

US20110303449A1 PACKAGING STRUCTURE, PRINTED CIRCUIT BOARD ASSEMBLY AND FIXING METHOD 审中-公开
标题翻译：包装结构，印刷电路板组件和固定方法
公开(公告)号：US20110303449A1
公开(公告)日：2011-12-15
申请号：US13044876
申请日：2011-03-10
申请人： Hiroshi KOBAYASHI , Toru OKADA , Satoshi EMOTO , Masayuki KITAJIMA
发明人： Hiroshi KOBAYASHI , Toru OKADA , Satoshi EMOTO , Masayuki KITAJIMA
IPC分类号： H05K1/18 , H05K3/30
CPC分类号： H05K3/3436 , H01L2224/16225 , H05K2201/09063 , H05K2201/10393 , H05K2201/10734 , Y02P70/613 , Y10T29/4913
摘要： A packaging structure for mounting an electronic component on a printed circuit board is provided, which includes an external connecting terminal of the electronic component connected to an electrode pad of the printed circuit board; a through-hole penetrating through the printed circuit board, the through-hole formed in a periphery of an electronic component mounting area; and a clamping member including a middle portion extending through the through-hole, and a first end portion and a second end portion extending from the middle portion. The first end portion and the second end portion are bent such that the electronic component and the printed circuit board are sandwiched and clamped by the first end portion and the second end portion.
摘要翻译：提供了一种用于将电子部件安装在印刷电路板上的封装结构，其包括连接到印刷电路板的电极焊盘的电子部件的外部连接端子; 穿过印刷电路板的通孔，形成在电子部件安装区域的周边的通孔; 以及夹持构件，其包括延伸穿过所述通孔的中间部分，以及从所述中间部分延伸的第一端部部分和第二端部部分。第一端部和第二端部弯曲，使得电子部件和印刷电路板被第一端部和第二端部夹持并夹持。

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