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1. 发明申请

US20110304059A1 CIRCUIT BOARD, CIRCUIT BOARD ASSEMBLY, AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：电路板，电路板组件和半导体器件
公开(公告)号：US20110304059A1
公开(公告)日：2011-12-15
申请号：US13044608
申请日：2011-03-10
申请人： Hiroshi KOBAYASHI , Toru OKADA , Satoshi EMOTO , Masayuki KITAJIMA
发明人： Hiroshi KOBAYASHI , Toru OKADA , Satoshi EMOTO , Masayuki KITAJIMA
IPC分类号： H01L23/498 , H05K1/00
CPC分类号： H05K3/3436 , H01L2224/16225 , H05K1/0271 , H05K2201/09036 , H05K2201/10734 , H05K2203/041 , Y02P70/613
摘要： A disclosed circuit board includes a substrate, a plurality of electrode pads formed on the substrate, and a groove formed between adjacent electrode pads on the substrate. Further, the electrode pads are surrounded by the groove to have an air space between the adjacent electrode pads.
摘要翻译：所公开的电路板包括衬底，形成在衬底上的多个电极焊盘以及形成在衬底上的相邻电极焊盘之间的凹槽。此外，电极焊盘被沟槽包围，以在相邻的电极焊盘之间具有空气空间。

2. 发明申请

US20110303443A1 MOUNT STRUCTURE, ELECTRONIC APPARATUS, STRESS RELIEVING UNIT, AND METHOD OF MANUFACTURING STRESS RELIEVING UNIT 审中-公开
标题翻译：安装结构，电子设备，应力消除单元和制造应力消除单元的方法
公开(公告)号：US20110303443A1
公开(公告)日：2011-12-15
申请号：US13046821
申请日：2011-03-14
申请人： Masayuki KITAJIMA , Toru OKADA , Hiroshi KOBAYASHI , Satoshi EMOTO
发明人： Masayuki KITAJIMA , Toru OKADA , Hiroshi KOBAYASHI , Satoshi EMOTO
IPC分类号： H05K1/09 , H05K1/16 , H05K3/30 , H02G15/08
CPC分类号： H05K3/3436 , H01L24/10 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/1012 , H01L2224/13 , H01L2224/131 , H01L2224/16225 , H01L2224/81815 , H01L2924/01029 , H01L2924/351 , H05K1/0271 , H05K2201/10242 , H05K2201/1031 , H05K2201/10674 , Y02P70/611 , Y02P70/613 , Y10T29/49124 , H01L2924/014 , H01L2924/00
摘要： A mount structure for mounting an electronic component on a circuit board includes a stress relieving unit including a center portion having a smaller cross section than a cross section of ends of the stress relieving unit; a first joint portion configured to join one end of the stress relieving unit onto an electrode pad of the electronic component; a second joint portion configured to join the other end of the stress relieving unit onto a connecting pad of the circuit board. Hollow spaces are provided between plural joint structures each of which includes the first joint portion, the stress relieving unit, and the second joint portion.
摘要翻译：用于将电子部件安装在电路板上的安装结构包括：应力消除单元，包括具有比所述应力消除单元的端部的横截面小的横截面的中心部分; 第一接合部，其构造成将所述应力消除单元的一端接合到所述电子部件的电极焊盘上; 第二接合部，其构造成将所述应力消除单元的另一端接合到所述电路板的连接焊盘上。在多个接头结构之间设置有空心空间，每个接头结构包括第一接头部分，应力消除单元和第二接头部分。

3. 发明申请

US20110303450A1 MOUNTING STRUCTURE, ELECTRONIC COMPONENT, CIRCUIT BOARD, BOARD ASSEMBLY, ELECTRONIC DEVICE, AND STRESS RELAXATION MEMBER 审中-公开
标题翻译：安装结构，电子元件，电路板，板组件，电子设备和应力松弛元件
公开(公告)号：US20110303450A1
公开(公告)日：2011-12-15
申请号：US13071641
申请日：2011-03-25
申请人： Toru OKADA , Hiroshi KOBAYASHI , Satoshi EMOTO , Masayuki KITAJIMA
发明人： Toru OKADA , Hiroshi KOBAYASHI , Satoshi EMOTO , Masayuki KITAJIMA
IPC分类号： H05K1/16 , H02G15/00 , H02G3/00
CPC分类号： H05K3/3436 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L23/562 , H01L24/05 , H01L24/13 , H01L24/16 , H01L2224/0401 , H01L2224/05647 , H01L2224/05655 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2924/3512 , H05K1/0271 , H05K1/111 , H05K1/113 , H05K2201/09436 , H05K2201/10378 , H05K2201/10674 , H05K2201/10734 , Y02P70/611 , Y02P70/613 , H01L2924/014
摘要： Disclosed is a mounting structure for mounting an electronic component on a circuit board. The mounting structure includes an interposer provided between the electronic component and the circuit board; and a plurality of spiral conductors formed in the interposer. The plurality of spiral conductors have one end thereof bonded to corresponding one of external connection terminals of the electronic component and the other end thereof bonded to corresponding one of electrodes of the electronic component.
摘要翻译：公开了一种用于将电子部件安装在电路板上的安装结构。安装结构包括设置在电子部件和电路板之间的插入器; 以及形成在插入件中的多个螺旋形导体。多个螺旋导体的一端接合到电子部件的对应的一个外部连接端子，另一端接合到电子部件的对应的一个电极。

4. 发明申请

US20110303441A1 BOARD REINFORCING STRUCTURE, BOARD ASSEMBLY, AND ELECTRONIC DEVICE 有权
标题翻译：板材加固结构，板组件和电子设备
公开(公告)号：US20110303441A1
公开(公告)日：2011-12-15
申请号：US13075895
申请日：2011-03-30
申请人： Hiroshi KOBAYASHI , Satoshi EMOTO , Masayuki KITAJIMA , Toru OKADA
发明人： Hiroshi KOBAYASHI , Satoshi EMOTO , Masayuki KITAJIMA , Toru OKADA
IPC分类号： H05K1/03
CPC分类号： H05K3/3436 , H01L23/562 , H01L2224/16225 , H01L2924/19105 , H05K1/0271 , H05K2201/10674 , H05K2201/10734 , H05K2201/2009 , Y02P70/613
摘要： Disclosed is a board reinforcing structure for reinforcing a circuit board in which an electronic component is mounted on a first surface, the electronic component having an electrode arranged in a rectangular-shaped region on the first surface. The board reinforcing structure includes a reinforcing member bonded to positions corresponding to corner parts of four corners of the rectangular-shaped region on a second surface provided on a side opposite to the first surface of the circuit board. In the board reinforcing structure, corresponding one of notches is formed in the reinforcing member at a position corresponding to one of the corner parts of the four corners of the rectangular-shaped region, and at least two apexes of the reinforcing member directed to an outside are formed to shape a contour thereof with the one of the notches.
摘要翻译：公开了一种用于加强其中电子部件安装在第一表面上的电路板的电路板加强结构，该电子部件具有布置在第一表面上的矩形区域中的电极。板加强结构包括加强构件，该加强构件在设置在与电路板的第一表面相对的一侧上的第二表面上接合到与矩形区域的四个角的角部相对应的位置。在板加强结构中，在加强构件中，在与矩形区域的四个角的一个角部相对应的位置处形成相应的一个切口，并且加强构件的至少两个顶点指向外部形成为与其中一个凹口成形其轮廓。

5. 发明申请

US20110303449A1 PACKAGING STRUCTURE, PRINTED CIRCUIT BOARD ASSEMBLY AND FIXING METHOD 审中-公开
标题翻译：包装结构，印刷电路板组件和固定方法
公开(公告)号：US20110303449A1
公开(公告)日：2011-12-15
申请号：US13044876
申请日：2011-03-10
申请人： Hiroshi KOBAYASHI , Toru OKADA , Satoshi EMOTO , Masayuki KITAJIMA
发明人： Hiroshi KOBAYASHI , Toru OKADA , Satoshi EMOTO , Masayuki KITAJIMA
IPC分类号： H05K1/18 , H05K3/30
CPC分类号： H05K3/3436 , H01L2224/16225 , H05K2201/09063 , H05K2201/10393 , H05K2201/10734 , Y02P70/613 , Y10T29/4913
摘要： A packaging structure for mounting an electronic component on a printed circuit board is provided, which includes an external connecting terminal of the electronic component connected to an electrode pad of the printed circuit board; a through-hole penetrating through the printed circuit board, the through-hole formed in a periphery of an electronic component mounting area; and a clamping member including a middle portion extending through the through-hole, and a first end portion and a second end portion extending from the middle portion. The first end portion and the second end portion are bent such that the electronic component and the printed circuit board are sandwiched and clamped by the first end portion and the second end portion.
摘要翻译：提供了一种用于将电子部件安装在印刷电路板上的封装结构，其包括连接到印刷电路板的电极焊盘的电子部件的外部连接端子; 穿过印刷电路板的通孔，形成在电子部件安装区域的周边的通孔; 以及夹持构件，其包括延伸穿过所述通孔的中间部分，以及从所述中间部分延伸的第一端部部分和第二端部部分。第一端部和第二端部弯曲，使得电子部件和印刷电路板被第一端部和第二端部夹持并夹持。

6. 发明申请

US20110240720A1 REPAIR APPARATUS AND METHOD FOR ELECTRONIC COMPONENT AND HEAT-TRANSFER CAP 审中-公开
标题翻译：电子部件和传热帽的修理装置和方法
公开(公告)号：US20110240720A1
公开(公告)日：2011-10-06
申请号：US13037777
申请日：2011-03-01
申请人： Toru OKADA , Hiroshi KOBAYASHI
发明人： Toru OKADA , Hiroshi KOBAYASHI
IPC分类号： B23K1/018 , B23K3/04 , B23K3/08
CPC分类号： H05K13/0486 , B23K1/018 , H01L24/799 , H01L2924/01322 , H01L2924/12042 , H01L2924/00
摘要： A repair apparatus is provided which is configured to melt a solder section of an electronic component to remove the electronic component from a printed wiring board. The repair apparatus includes a light source configured to irradiate light, and a heat-transfer cap including a light-receiving section and a heat-transfer section. The heat-transfer section is configured to contact the electronic component, and transfer a heat generated from the light in the light-receiving section to the electronic component.
摘要翻译：提供了一种修复装置，其被配置为熔化电子部件的焊接部分以从印刷线路板移除电子部件。修复装置包括被配置为照射光的光源和包括光接收部和传热部的传热帽。传热部被配置为与电子部件接触，并且将从光接收部中的光产生的热量传递到电子部件。

7. 发明申请

US20170264441A1 DATA PROCESSING SYSTEM, DATA PROCESSING APPARATUS, AND DATA PROCESSING METHOD 审中-公开
公开(公告)号：US20170264441A1
公开(公告)日：2017-09-14
申请号：US15433112
申请日：2017-02-15
申请人： Hitoshi NAMIKI , Hiroshi KOBAYASHI , Ryouji YAMAMOTO , Eiichiro YOSHIDA , Masuyoshi YACHIDA , Yuki TAKAYA
发明人： Hitoshi NAMIKI , Hiroshi KOBAYASHI , Ryouji YAMAMOTO , Eiichiro YOSHIDA , Masuyoshi YACHIDA , Yuki TAKAYA
IPC分类号： H04L9/32 , H04L9/08
CPC分类号： H04L9/3247 , H04L9/085
摘要： A data processing apparatus includes a memory storing a program and a processor configured to execute the program to implement a process of reading signed data including a predetermined number (n) of secret sharing data sets generated for each section of time series data and a signature value calculated for the each section of time series data based on a secret sharing protocol. The n secret sharing data sets include n units of data acquired from each section of time series data and parameter information for a polynomial of a predetermined degree calculated based on the acquired n units of data. The processor further implements processes of acquiring the predetermined degree, and editing the signed data by extracting a specific number of the secret sharing data sets from the n secret sharing data sets for the each section of time series data according to the acquired predetermined degree.

8. 发明申请

US20170076074A1 DATA MANAGEMENT SYSTEM, DATA MANAGEMENT METHOD, AND RECORDING MEDIUM STORING DATA MANAGEMENT PROGRAM 审中-公开
标题翻译：数据管理系统，数据管理方法和记录存储数据管理程序
公开(公告)号：US20170076074A1
公开(公告)日：2017-03-16
申请号：US15249907
申请日：2016-08-29
申请人： Ryouji YAMAMOTO , Hiroshi KOBAYASHI , Atsushi KOKUBO , Hidekazu SEGAWA , Yuki TAKAYA
发明人： Ryouji YAMAMOTO , Hiroshi KOBAYASHI , Atsushi KOKUBO , Hidekazu SEGAWA , Yuki TAKAYA
IPC分类号： G06F21/16 , H04W12/06 , H04L29/06
CPC分类号： G06F21/16 , H04L63/10 , H04L63/107 , H04L67/18 , H04W4/02 , H04W12/06 , H04W12/08
摘要： A data management system includes a detecting apparatus that detects an information processing apparatus and a server apparatus that controls access to data by the information processing apparatus. The detecting apparatus detects the information processing apparatus located within a predetermined area. The server apparatus includes a transmitter that transfers data to the detected information processing apparatus, the data being associated with access authority indicating whether or not the information processing apparatus is allowed to access the data, and circuitry that controls an access to the data from the detected information processing apparatus in accordance with the access authority associated with the data.
摘要翻译：数据管理系统包括检测信息处理装置的检测装置和控制信息处理装置对数据的访问的服务器装置。检测装置检测位于预定区域内的信息处理装置。服务器装置包括：将数据传送到所检测的信息处理装置的发送机，该数据与访问权限相关联，该访问权限指示信息处理装置是否被允许访问数据;以及电路，其控制对来自检测到的数据的数据的访问信息处理装置根据与数据相关的访问权限。

9. 发明申请

US20160027402A1 WIRELESS COMMUNICATIONS SYSTEM, AND DISPLAY APPARATUS 审中-公开
标题翻译：无线通信系统和显示设备
公开(公告)号：US20160027402A1
公开(公告)日：2016-01-28
申请号：US14809691
申请日：2015-07-27
申请人： Shinsuke YANAZUME , Hiroshi BABA , Hiroshi KOBAYASHI
发明人： Shinsuke YANAZUME , Hiroshi BABA , Hiroshi KOBAYASHI
IPC分类号： G09G5/00 , G06F3/14
CPC分类号： G06F3/1454 , G06F3/14 , G09G2350/00 , G09G2370/025 , G09G2370/20 , H04N7/15 , H04N9/3179 , H04N21/4122 , H04N21/4314 , H04N21/43615 , H04N21/440263 , H04N21/4622
摘要： A wireless communications system includes a display apparatus, and information terminals connected to the display apparatus via a network. The display apparatus includes a first controller to set timings to request screen information of screens displayed on the information terminals, create a screen information request to request the information terminal to transmit the screen information in accordance with the timing, and display a screen based on the transmitted screen information; and a first transmitter-receiver to transmit the screen information request to the information terminal corresponding to the timing, and receive the screen information from the corresponding terminal. Each of the information terminals includes a second controller to capture the displayed screen to create the screen information responding to the screen information request from the display apparatus; and a second transmitter-receiver to receive the screen information request, and transmit the created screen information to the display apparatus.
摘要翻译：无线通信系统包括显示装置和经由网络连接到显示装置的信息终端。显示装置包括第一控制器，用于设置请求在信息终端上显示的屏幕的屏幕信息的定时，创建屏幕信息请求以请求信息终端根据该定时发送屏幕信息，并且基于该显示信息显示屏幕传输屏幕信息; 以及第一发送器 - 接收器，用于将对应于定时的屏幕信息请求发送到信息终端，并且从相应的终端接收屏幕信息。每个信息终端包括第二控制器，用于捕获所显示的屏幕，以响应于来自显示装置的屏幕信息请求创建屏幕信息; 以及第二发送器 - 接收器，用于接收屏幕信息请求，并将所创建的屏幕信息发送到显示装置。

10. 发明申请

US20120075746A1 BASE UNIT FOR USE IN STORAGE DISK DRIVE APPARATUS, SPINDLE MOTOR INCLUDING THE BASE UNIT, AND STORAGE DISK DRIVE APPARATUS INCLUDING THE SPINDLE MOTOR 有权
标题翻译：用于存储盘驱动装置的基座单元，包括基座的主轴电机和包括主轴电机的存储盘驱动装置
公开(公告)号：US20120075746A1
公开(公告)日：2012-03-29
申请号：US13239497
申请日：2011-09-22
申请人： Tomohiro YONEDA , Takatoki SUGI , Hiroshi KOBAYASHI
发明人： Tomohiro YONEDA , Takatoki SUGI , Hiroshi KOBAYASHI
IPC分类号： G11B17/34 , H02K11/00
CPC分类号： H02K3/522 , G11B19/2009 , H02K2203/03
摘要： A base unit for use in a storage disk drive apparatus includes a base portion; a stator core including a plurality of teeth; U-phase, V-phase, and W-phase coils; U-phase, V-phase, and W-phase common wires; and a circuit board. The U-phase, V-phase, and W-phase coils are wound on the teeth and arranged to define a U phase, a V phase, and a W phase, respectively. The U-phase, V-phase, and W-phase common wires are arranged to define the U phase, the V phase, and the W phase, respectively. Each of the U-phase, V-phase, and W-phase common wires is arranged to pass through a separate one of through holes to be drawn out beyond a lower surface of the base portion and electrically connected to the circuit board. Each of the through holes is sealed with a sealant such that the base unit is airtight.
摘要翻译：用于存储盘驱动装置的基本单元包括基部; 定子铁心，包括多个齿; U相，V相和W相线圈; U相，V相和W相共用线; 和电路板。 U相，V相和W相线圈被缠绕在齿上并且被布置成分别限定U相，V相和W相。 U相，V相和W相共用布线分别定义U相，V相和W相。 U相，V相和W相公共线中的每一个布置成穿过单独的一个通孔，以便超出基部的下表面被拉出并电连接到电路板。每个通孔用密封剂密封，使得基座单元是气密的。

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