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61. 发明授权

US09089072B2 Heat radiating substrate and method for manufacturing the same 有权
标题翻译：散热基板及其制造方法
公开(公告)号：US09089072B2
公开(公告)日：2015-07-21
申请号：US13753824
申请日：2013-01-30
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Young Ki Lee , Kwang Soo Kim , Bum Seok Suh , Chang Seob Hong , Joon Seok Chae
IPC分类号： H05K7/20 , B23P15/26 , H05K1/02
CPC分类号： H05K7/20 , B23P15/26 , H01L2224/48091 , H01L2224/73265 , H05K1/0201 , H05K1/0204 , H05K1/0271 , H05K1/05 , H05K3/44 , H05K2201/0187 , H05K2201/09909 , H05K2201/09972 , H05K2203/0207 , Y10T29/4935 , H01L2924/00014
摘要： Disclosed herein is a heat radiating substrate including: a heat radiating plate including a plurality of holes having a predetermined depth and formed in a lower portion of one side thereof; a conductor pattern layer formed on the heat radiating plate and including a mounting pad on which a control device and a power device are mounted and a circuit pattern; and an insulating layer formed between the heat radiating plate and the conductor pattern layer.
摘要翻译：本发明公开了一种散热基板，其特征在于，包括：散热板，具有规定深度的多个孔，形成在其一侧的下部; 导体图案层，其形成在所述散热板上并且包括其上安装有控制装置和功率器件的安装焊盘和电路图案; 以及形成在散热板和导体图案层之间的绝缘层。

62. 发明申请

US20150195956A1 DOUBLE INSULATED HEAT SPREADER 有权
标题翻译：双重绝热散热器
公开(公告)号：US20150195956A1
公开(公告)日：2015-07-09
申请号：US14591355
申请日：2015-01-07
申请人： Enphase Energy, Inc.
发明人： Ryan Linderman
IPC分类号： H05K7/20 , H05K1/02
CPC分类号： H05K7/20409 , H01F27/022 , H01F27/08 , H01F2027/065 , H01L33/483 , H01L33/642 , H02M7/003 , H02S40/42 , H05K1/0203 , H05K1/0204 , H05K1/0206 , H05K1/0209 , H05K1/181 , H05K5/064 , H05K7/2039 , H05K7/20418 , H05K7/20436 , H05K7/20463 , H05K7/20472 , H05K7/2049 , H05K7/205 , H05K7/209 , H05K2201/066
摘要： An apparatus for thermal management for an electric device. In one embodiment the apparatus comprises a primary heat spreader disposed within an enclosure that contains a printed circuit board (PCB) populated with at least one electrical component, wherein the primary heat spreader is thermally conductive and wherein the interior of the enclosure is at least partially filled with an encapsulating material; a secondary heat spreader coupled to an exterior face of a first wall of the enclosure, wherein the secondary heat spreader is thermally conductive; and a thermal interface coupled between the primary head spreader and the PCB, wherein the thermal interface is thermally conductive and electrically insulating.
摘要翻译：一种用于电气设备的热管理装置。在一个实施例中，该装置包括设置在外壳内的主要散热器，其包含填充有至少一个电气部件的印刷电路板（PCB），其中所述主散热器是导热的，并且其中所述外壳的内部至少部分地填充有封装材料; 耦合到所述外壳的第一壁的外表面的二次散热器，其中所述二次散热器是导热的; 以及耦合在主头扩展器和PCB之间的热界面，其中该热界面是导热的并且是电绝缘的。

63. 发明申请

US20150195948A1 THERMAL CONNECTOR 审中-公开
标题翻译：热连接器
公开(公告)号：US20150195948A1
公开(公告)日：2015-07-09
申请号：US14589363
申请日：2015-01-05
申请人： TEM Products Incorporated
发明人： Dean Gouramanis
IPC分类号： H05K7/20
CPC分类号： H05K7/205 , H05K1/0204 , H05K1/0209 , H05K3/0061 , H05K2201/10106 , H05K2201/10409 , H05K2201/10416 , H05K2201/10969
摘要： A thermal connector for use with a printed circuit board assembly is disclosed. The thermal connector includes a top segment configured for thermal engagement with a heat source disposed on a top surface of a printed circuit board and for insertion through an opening of the printed circuit board to thermally engage the heat source. A middle segment of the thermal connector extends from the top segment and includes a flanged portion configured to engage a bottom surface of the printed circuit board when the top segment is inserted through the opening of the printed circuit board. A bottom segment of the thermal connector extends from the middle segment and is configured for thermal engagement to a heat dissipating element.
摘要翻译：公开了一种用于印刷电路板组件的热连接器。热连接器包括顶部部分，其被配置为与设置在印刷电路板的顶表面上的热源热接合，并且用于插入穿过印刷电路板的开口以热接合热源。热连接器的中间部分从顶部部分延伸并且包括凸缘部分，该凸缘部分构造成当顶部部分穿过印刷电路板的开口插入时接合印刷电路板的底部表面。热连接器的底部段从中间段延伸并且被配置成与散热元件热接合。

64. 发明授权

US09028092B2 LED light bar and backlight module using the LED light bar 有权
标题翻译： LED灯条和背光模组采用LED灯条
公开(公告)号：US09028092B2
公开(公告)日：2015-05-12
申请号：US13806751
申请日：2012-11-08
申请人： Shenzhen China Star Optoelectronics Technology Co., Ltd.
发明人： Tian Zhang , Yuchun Hsiao
IPC分类号： F21V29/00 , F21V21/005
CPC分类号： F21V29/70 , F21V21/005 , G02B6/0083 , G02B6/0085 , H05K1/0204 , H05K3/0061 , H05K2201/09054 , H05K2201/10106 , H05K2201/10522
摘要： The present invention provides an LED light bar and a backlight module using the LED light bar. The LED light bar includes a heat dissipation strip, a PCB mounted on the heat dissipation strip, LED chips mounted on the heat dissipation strip and electrically connected to the PCB, and a thermal interface material layer arranged between the LED chips and the heat dissipation strip. The LED light bar and the backlight module using the LED light bar according to the present invention arrange LED chips to be mounted to a heat dissipation strip that is of bettered thermal conduction performance to thereby avoid the conventional process of transferring terminal energy through a PCB that is of poor heat dissipation. The art is simple and the entire heat dissipation path is shortened to achieve excellent heat dissipation performance and thus ensure the quality of backlighting.
摘要翻译：本发明提供一种LED灯条和使用该LED灯条的背光模组。 LED灯条包括散热条，安装在散热条上的PCB，安装在散热条上并电连接到PCB的LED芯片，以及布置在LED芯片和散热条之间的热界面材料层。根据本发明的LED灯条和使用LED灯条的背光模块将LED芯片安排在具有更好的导热性能的散热条上，从而避免了将终端能量传递到PCB的传统工艺散热差。艺术简单，整个散热路径缩短，达到优异的散热性能，从而保证了背光的质量。

65. 发明申请

US20150116947A1 ADVANCED GROUNDING SCHEME 有权
标题翻译：高级接地方案
公开(公告)号：US20150116947A1
公开(公告)日：2015-04-30
申请号：US14062494
申请日：2013-10-24
申请人： TriQuint Semiconductor, Inc.
发明人： Thomas R. Landon, Jr. , Paul D. Bantz , Tarak A. Railkar
IPC分类号： H05K1/02 , H05K3/44
CPC分类号： H05K1/0204 , H05K1/0207 , H05K1/0215 , H05K1/0216 , H05K3/4602 , H05K2201/0187 , H05K2201/10416 , H05K2203/0191 , Y10T29/49155
摘要： A laminate substrate may include a slug positioned within a cavity of a laminate core. The laminate substrate may have routing layers on either side of the laminate core, at least one of which is coplanar with an outer side of the slug. A capping layer may then be applied to the laminate substrate which is directly coupled with the slug and the routing layer. In embodiments, a dielectric layer may be coupled with the capping layer, and an additional routing layer may be coupled with the dielectric layer. Therefore, the routing layer may be an “inner” routing layer that is coplanar with, and coupled with, the slug.
摘要翻译：层压基板可以包括位于层叠芯的空腔内的块状物。层压基板可以在层叠芯的任一侧上具有路由层，其中至少一个与块的外侧共面。然后可以将覆盖层施加到与块和路由层直接耦合的层压基板。在实施例中，电介质层可以与覆盖层耦合，并且附加布线层可以与电介质层耦合。因此，路由层可以是与块状体共面并与其结合的“内部”路由层。

66. 发明申请

US20150070872A1 METHOD AND SYSTEM FOR FORMING LED LIGHT EMITTERS 有权
标题翻译：用于形成LED发光体的方法和系统
公开(公告)号：US20150070872A1
公开(公告)日：2015-03-12
申请号：US14539863
申请日：2014-11-12
申请人： LedEngin, Inc.
发明人： XIANTAO YAN
IPC分类号： H05K1/02 , F21V23/00 , F21V5/00 , H05K1/03 , F21K99/00
CPC分类号： F21V19/003 , F21K9/90 , F21V5/007 , F21V5/04 , F21V9/30 , F21V21/14 , F21V23/005 , F21V29/70 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/08 , H01L33/48 , H01L33/58 , H01L33/647 , H01L2924/0002 , H05K1/0204 , H05K1/0278 , H05K1/0283 , H05K1/0306 , H05K1/144 , H05K1/189 , H05K3/0061 , H05K3/0097 , H05K3/4626 , H05K3/4688 , H05K2201/042 , H05K2201/0909 , H05K2201/09127 , H05K2201/09263 , H05K2201/10106 , H05K2201/10121 , H05K2203/0143 , H05K2203/171 , H01L2924/00
摘要： A flexible sheet of light-emitting diode (LED) light emitters includes a support substrate having a thermally conductive material. The flexible sheet of LED light emitters also has a ceramic substrate sheet overlying support substrate, and the ceramic substrate sheet including a plurality of LED light emitters. The flexible sheet of LED light emitters also has a flexible circuit sheet overlying the ceramic substrate sheet, and a phosphor sheet overlying the flexible circuit sheet. The phosphor sheet includes a wave-length converting material. The flexible sheet of LED light emitters also has a lens sheet overlying the phosphor sheet. The lens sheet includes a plurality of lenses.
摘要翻译：发光二极管（LED）发光体的柔性片包括具有导热材料的支撑基板。 LED发光体的柔性片也具有覆盖在支撑基板上的陶瓷基板，陶瓷基板具有多个LED发光体。 LED发光体的柔性片也具有覆盖在陶瓷基片上的柔性电路片和覆盖柔性电路片的荧光体片。荧光体片包括波长转换材料。 LED发光体的柔性片也具有覆盖荧光体片的透镜片。透镜片包括多个透镜。

67. 发明授权

US08975659B2 Chip on board light emitting diode device having dissipation unit array 有权
标题翻译：具有散热单元阵列的板上发光二极管器件
公开(公告)号：US08975659B2
公开(公告)日：2015-03-10
申请号：US13917325
申请日：2013-06-13
申请人： Cofan USA, Inc.
发明人： Pao Chen
IPC分类号： H01L29/22 , H01L33/00 , H01L29/227 , H01L33/64 , H01L33/60
CPC分类号： H01L33/647 , H01L24/14 , H01L33/0095 , H01L33/382 , H01L33/60 , H01L33/642 , H01L2924/12041 , H01L2933/0016 , H01L2933/0075 , H05K1/0204 , H05K1/0306 , H05K2201/10106 , H01L2924/00
摘要： A chip on board light emitting diode (LED) device includes a LED device, a printed circuit board (PCB) and a dissipation unit array. The LED device includes a LED substrate, a first contact pad and a second contact pad above the LED substrate and a thermal layer formed on top surface of the LED device. The thermal layer includes a thermal conductive material. A printed circuit board (PCB) includes a PCB substrate with a thermal projection extending from surface of the PCB substrate, and a first and a second electrode pads above the PCB substrate. The thermal projection and the PCB substrate include the thermal conductive material. The dissipation unit array includes a plurality of dissipation units each disposed between the LED device and the PCB. The thermal layer is thermally coupled to the thermal projection via at least one dissipation unit. Each of the first and second contact pads is electrically coupled to the corresponding electrode pad via at least one dissipation unit.
摘要翻译：芯片上的发光二极管（LED）器件包括LED器件，印刷电路板（PCB）和耗散单元阵列。 LED装置包括LED基板，第一接触焊盘和LED基板上方的第二接触焊盘以及形成在LED器件的顶表面上的热层。热层包括导热材料。印刷电路板（PCB）包括具有从PCB衬底的表面延伸的热突起的PCB衬底，以及PCB衬底上方的第一和第二电极焊盘。热投影和PCB基板包括导热材料。散热单元阵列包括多个散热单元，每个散热单元设置在LED器件和PCB之间。热层通过至少一个耗散单元热耦合到热突起。第一和第二接触焊盘中的每一个经由至少一个耗散单元电耦合到对应的电极焊盘。

68. 发明申请

US20150060190A1 REDUCING NOISE AND TEMPERATURE DURING MEASUREMENTS IN CRYOSTATS 有权
标题翻译：降低CRYOSTATS测量过程中的噪音和温度
公开(公告)号：US20150060190A1
公开(公告)日：2015-03-05
申请号：US14011176
申请日：2013-08-27
申请人： President and Fellows of Harvard College
发明人： Ferdinand Kuemmeth , Charles M. Marcus
IPC分类号： H03H7/06 , G10K11/16 , H03H7/01 , H05K1/02
CPC分类号： H05K1/0204 , G10K11/162 , H05K1/0306
摘要： A device is disclosed to reduce noise and temperature during measurements in cryostats comprising, the device comprising any of, or a combination of, the following PC boards, each conditioning a different frequency range: a RC-PC board having a two-stage RC filter in series with a surface-mounted pi-filter; a RF-PC board having a plurality of surface-mounted pi-filters in series, each configured with different low-frequency cutoff frequencies; and a Sapphire-PC board having a sapphire substrate having high heat conductivity at low temperature with thin metal films routed in a meandering fashion.
摘要翻译：公开了一种在低温恒温器测量期间降低噪声和温度的装置，其包括以下PC板中的任何一种或其组合的器件，每个调整不同的频率范围：具有两级RC滤波器的RC-PC板与表面安装的pi滤波器串联; RF-PC板，其具有多个串联的表面安装的pI滤波器，每个配置有不同的低频截止频率; 以及蓝宝石-PC板，其蓝宝石衬底在低温下具有较高的导热性，薄金属薄膜以蜿蜒的方式布线。

69. 发明申请

US20150029669A1 CONTROL DEVICE AND METHOD FOR PRODUCING A CONTROL DEVICE FOR A MOTOR VEHICLE 有权
标题翻译：用于生产用于电动车辆的控制装置的控制装置和方法
公开(公告)号：US20150029669A1
公开(公告)日：2015-01-29
申请号：US14367180
申请日：2012-11-14
申请人： Robert Bosch GmbH
发明人： Uwe Liskow , Peter Klobes , Thomas Meier
IPC分类号： H05K7/20 , H05K3/30
CPC分类号： H05K7/20854 , F16H61/0006 , H01L2224/48091 , H01L2224/48472 , H01L2224/73265 , H05K1/0204 , H05K1/142 , H05K3/301 , H05K5/0082 , H05K7/209 , Y10T29/4913 , H01L2924/00014 , H01L2924/00
摘要： A control device includes a first circuit carrier with electrical components that are electrically conductively connected to one another and a second circuit carrier with electrical components that are electrically conductively connected to one another. The first circuit carrier and the second circuit carrier are electrically conductively connected to one another. The second circuit carrier is fixedly connected in thermally conductive fashion to a fluid-tight thermally conductive carrier element. The second circuit carrier and the carrier element are arranged in a cutout of the first circuit carrier. The carrier element has better thermal conductivity than the first circuit carrier and can be thermally conductively connected to a heat sink. The carrier element is integrated in fluid-tight fashion in an internal region of the first circuit carrier.
摘要翻译：控制装置包括具有彼此导电连接的电气部件的第一电路载体和具有彼此导电连接的电气部件的第二电路载体。第一电路载体和第二电路载体彼此导电连接。第二电路载体以导热方式固定地连接到流体密封的导热载体元件。第二电路载体和载体元件布置在第一电路载体的切口中。载体元件具有比第一电路载体更好的热导率，并且可以热传导地连接到散热器。载体元件以流体密封的方式集成在第一电路载体的内部区域中。

70. 发明授权

US08929077B2 Thermal connector 有权
标题翻译：热连接器
公开(公告)号：US08929077B2
公开(公告)日：2015-01-06
申请号：US13633977
申请日：2012-10-03
申请人： TEM Products Inc.
发明人： Dean Gouramanis
IPC分类号： H05K7/20 , H05K1/02 , G06F1/20 , H05K3/00
CPC分类号： H05K7/205 , H05K1/0204 , H05K1/0209 , H05K3/0061 , H05K2201/10106 , H05K2201/10409 , H05K2201/10416 , H05K2201/10969
摘要： A thermal connector for use with a printed circuit board assembly is disclosed. The thermal connector includes a top segment configured for thermal engagement with a heat source disposed on a top surface of a printed circuit board and for insertion through an opening of the printed circuit board to thermally engage the heat source. A middle segment of the thermal connector extends from the top segment and includes a flanged portion configured to engage a bottom surface of the printed circuit board when the top segment is inserted through the opening of the printed circuit board. A bottom segment of the thermal connector extends from the middle segment and is configured for thermal engagement to a heat dissipating element.
摘要翻译：公开了一种用于印刷电路板组件的热连接器。热连接器包括顶部部分，其被配置为与设置在印刷电路板的顶表面上的热源热接合，并且用于插入穿过印刷电路板的开口以热接合热源。热连接器的中间部分从顶部部分延伸并且包括凸缘部分，该凸缘部分构造成当顶部部分穿过印刷电路板的开口插入时接合印刷电路板的底部表面。热连接器的底部段从中间段延伸并且被配置成与散热元件热接合。

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