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61. 发明授权

US07632720B2 Method of manufacturing a semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US07632720B2
公开(公告)日：2009-12-15
申请号：US11495718
申请日：2006-07-31
申请人： Bunshi Kuratomi , Fukumi Shimizu
发明人： Bunshi Kuratomi , Fukumi Shimizu
IPC分类号： H01L21/00
CPC分类号： H01L21/561 , B29C45/02 , B29C45/14065 , B29C45/14647 , B29C45/14655 , B29C45/14836 , B29C45/37 , B29C45/56 , H01L23/3121 , H01L23/49855 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/01079 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： In connection with a memory card of a block molding type there is provided a method able to prevent the occurrence of a chip crack in transfer molding. The method includes a first step wherein a substrate having plural chips constituting plural memory cards and mounted on a surface of the substrate and further having connecting terminals in recesses formed on a substrate surface opposite to the chips-mounted surface is sandwiched between a first die (upper die) installed on the chips-mounted surface side and a second die (lower die) installed on the surface side where the connecting terminal are formed. The method further includes a second step of injecting sealing resin between the first die and the substrate to seal at a time the plural chips mounted on the substrate. Projecting portions (terminal supporting elements) projecting from the surrounding portion are formed in regions of the second die which regions are positioned just under the connecting terminals. The projecting portions support the connecting terminals in the second step.
摘要翻译：结合块模型型的存储卡，提供了一种能够防止在传递成型中出现芯片裂纹的方法。该方法包括第一步骤，其中具有构成多个存储卡并且安装在基板的表面上并且还具有形成在与芯片安装表面相对的基板表面上的凹部中的连接端子的多个芯片的基板被夹在第一模具上模具）和安装在形成有连接端子的表面侧的第二模具（下模具）。该方法还包括在第一模具和基板之间注入密封树脂以在安装在基板上的多个芯片的时间进行密封的第二步骤。在第二模具的区域中形成从周围部分突出的突出部分（端子支撑元件），这些区域位于连接端子正下方。突出部分在第二步骤中支撑连接端子。

62. 发明申请

US20090283599A1 FABRICATION METHOD OF IC INLET, ID TAG, ID TAG READER AND METHOD OF READING DATA THEREOF 审中-公开
标题翻译： IC入口，ID标签，ID标签读取器及其数据读取方法的制造方法
公开(公告)号：US20090283599A1
公开(公告)日：2009-11-19
申请号：US12512250
申请日：2009-07-30
申请人： Michio OKAMOTO , Hisao Yamagata , Nobuo Murakami , Keizo Kakitani , Hidehiro Fujiwara , Takeshi Saitou
发明人： Michio OKAMOTO , Hisao Yamagata , Nobuo Murakami , Keizo Kakitani , Hidehiro Fujiwara , Takeshi Saitou
IPC分类号： G06K7/00 , G06K19/06
CPC分类号： H01Q1/2208 , G01N22/04 , G06K7/0095 , G06K7/10336 , G06K7/10465 , G06K19/07718 , G06K19/07747 , G06K19/07749 , H01L21/563 , H01L22/20 , H01L23/49855 , H01L24/11 , H01L24/16 , H01L24/81 , H01L2224/13099 , H01L2224/13144 , H01L2224/16 , H01L2224/75 , H01L2224/75301 , H01L2224/81191 , H01L2224/81203 , H01L2224/81801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/12042 , H01L2924/14 , H01L2924/16152 , H01Q17/001 , H01L2924/00 , H01L2224/0401
摘要： A method accurately inspects whether an IC inlet to be inspected is non-defective or defective in a state in which a large number of IC inlets are formed over an insulating film. The inspection of IC inlets formed over an insulating film is performed by transmitting microwaves to the IC inlets from antennas. To selectively irradiate the microwaves to only one IC inlet to be inspected out of a large number of IC inlets that are formed over the insulating film, a radio-wave absorbing plate is inserted between the insulating film and the antennas, and the microwaves are irradiated to the IC inlet through a slit formed in the radio-wave absorbing plate. The radio-wave absorbing plate is configured such that the slit, which is substantially equal to the IC inlet in size, is formed in a portion of a planar plate that is formed of a radio-wave absorber.
摘要翻译：在绝缘膜上形成有大量的IC入口的状态下，准确地检查要检查的IC入口是否不良或有缺陷。在绝缘膜上形成的IC入口的检查通过从天线向IC入口发送微波来进行。为了在绝缘膜上形成的大量IC入口中仅选择性地将微波照射到要检查的一个IC入口，在绝缘膜和天线之间插入无线电波吸收板，并且照射微波通过形成在无线电波吸收板中的狭缝到IC入口。无线电波吸收板被构造成使得与由IC入口大致相等的狭缝形成在由无线电波吸收体形成的平板的一部分中。

63. 发明授权

US07615855B2 IC card and method of manufacturing the same 有权
标题翻译： IC卡及其制造方法
公开(公告)号：US07615855B2
公开(公告)日：2009-11-10
申请号：US12116190
申请日：2008-05-06
申请人： Junichiro Osako , Hirotaka Nishizawa , Kenji Osawa , Akira Higuchi
发明人： Junichiro Osako , Hirotaka Nishizawa , Kenji Osawa , Akira Higuchi
IPC分类号： H01L23/02 , H01L23/12 , H01L23/28
CPC分类号： H05K3/284 , B29C45/14647 , B29C45/14655 , B29C45/1657 , B29C45/1671 , B29C2045/1673 , H01L21/563 , H01L21/565 , H01L23/3121 , H01L23/3135 , H01L23/49855 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2924/01014 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H05K1/117 , H05K2201/10159 , H05K2203/1316 , H05K2203/1572 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured. The IC body comprises: a wiring substrate formed with an external connection terminal at a back surface thereof; a semiconductor chip loaded over a surface of the wiring substrate and electrically connected to the external connection terminal via a interconnect; and the sealing portion made of thermosetting resin material so as to cover the semiconductor chip and a bonding wire. The sealing portion is formed so that the external connection terminal is exposed. The present invention makes it possible to heighten the strength of IC cards and at the same time, to reduce the manufacturing cost and improve the reliability.
摘要翻译：将IC体装载到由热固性树脂材料制成的壳体2上，并用由热固性树脂材料制成的密封部分密封，从而制造IC卡。 IC体包括：在其背面形成有外部连接端子的布线基板; 半导体芯片，其负载在所述布线基板的表面上，并且经由互连电连接到所述外部连接端子; 以及由热固性树脂材料制成的密封部分以覆盖半导体芯片和接合线。密封部形成为使外部连接端子露出。本发明可以提高IC卡的强度，同时降低制造成本，提高可靠性。

64. 发明授权

US07611927B2 Method of minimizing kerf width on a semiconductor substrate panel 失效
标题翻译：使半导体衬底面板上的切口宽度最小化的方法
公开(公告)号：US07611927B2
公开(公告)日：2009-11-03
申请号：US11760385
申请日：2007-06-08
申请人： Chih-Chin Liao , Ning Ye , Cheemen Yu , Jack Chang Chien , Hem Takiar
发明人： Chih-Chin Liao , Ning Ye , Cheemen Yu , Jack Chang Chien , Hem Takiar
IPC分类号： H01L21/332
CPC分类号： H05K3/242 , H01L21/4846 , H01L23/49838 , H01L23/49855 , H01L2224/48227 , H01L2924/10253 , H01L2924/19105 , H05K1/117 , H05K3/0052 , H05K2203/175 , H01L2924/00
摘要： A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.
摘要翻译：公开了半导体管芯衬底面板，其包括在面板上相邻的半导体封装轮廓之间的最小间隙宽度，同时确保电镀电端子的电隔离。通过减小相邻封装轮廓之间的边界的宽度，在用于半导体封装的衬底面板上获得额外的空间。

65. 发明申请

US20090261173A1 SECURITIES, CHIP MOUNTING PRODUCT, AND MANUFACTURING METHOD THEREOF 有权
标题翻译：证券，芯片安装产品及其制造方法
公开(公告)号：US20090261173A1
公开(公告)日：2009-10-22
申请号：US12486838
申请日：2009-06-18
申请人： Shunpei YAMAZAKI , Kiyoshi KATO
发明人： Shunpei YAMAZAKI , Kiyoshi KATO
IPC分类号： G06K19/06
CPC分类号： H01L23/49855 , G06K19/07749 , G06K19/07758 , G06K19/07767 , G07D7/01 , H01L2924/0002 , H01L2924/00
摘要： The invention provides an ID chip with reduced cost, increased impact resistance and attractive design, as well as products and the like mounting the ID chip and a manufacturing method thereof. In view of the foregoing, an integrated circuit having a semiconductor film with a thickness of 0.2 μm or less is mounted on securities including bills, belongings, containers of food and drink, and the like (hereinafter referred to as products and the like). The ID chip of the invention can be reduced in cost and increased in impact resistance as compared with a chip formed over a silicon wafer while maintaining an attractive design.
摘要翻译：本发明提供一种具有降低成本，增加耐冲击性和有吸引力的设计的ID芯片以及安装ID芯片的产品等及其制造方法。鉴于上述，将厚度为0.2μm以下的半导体膜的集成电路安装在包括纸币，财物，食品和饮料容器等的证券（以下称为产品等）上。与保持有吸引力的设计的硅晶片上形成的芯片相比，本发明的ID芯片可以降低成本并增加耐冲击性。

66. 发明授权

US07605056B2 Method of manufacturing a semiconductor device including separation by physical force 有权
标题翻译：制造半导体器件的方法，包括通过物理力分离
公开(公告)号：US07605056B2
公开(公告)日：2009-10-20
申请号：US11436090
申请日：2006-05-18
申请人： Hidekazu Takahashi , Daiki Yamada , Kyosuke Ito , Eiji Sugiyama , Yoshitaka Dozen
发明人： Hidekazu Takahashi , Daiki Yamada , Kyosuke Ito , Eiji Sugiyama , Yoshitaka Dozen
IPC分类号： H01L23/48
CPC分类号： H01L23/66 , H01L23/49855 , H01L2924/0002 , H01L2924/00
摘要： The semiconductor device of the invention includes a transistor, an insulating layer provided over the transistor, a first conductive layer (corresponding to a source wire or a drain wire) electrically connected to a source region or a drain region of the transistor through an opening portion provided in the insulating layer, a first resin layer provided over the insulating layer and the first conductive layer, a layer containing conductive particles which is electrically connected to the first conductive layer through an opening portion provided in the first resin layer, and a substrate provided with a second resin layer and a second conductive layer serving as an antenna. In the semiconductor device having the above-described structure, the second conductive layer is electrically connected to the first conductive layer with the layer containing conductive particles interposed therebetween. In addition, the second resin layer is provided over the first resin layer.
摘要翻译：本发明的半导体器件包括晶体管，设置在晶体管上的绝缘层，通过开口部分电连接到晶体管的源极区域或漏极区域的第一导电层（对应于源极线或漏极线）设置在所述绝缘层中的第一树脂层，设置在所述绝缘层和所述第一导电层上的第一树脂层，包含通过设置在所述第一树脂层中的开口部与所述第一导电层电连接的导电粒子的层和设置在所述第一树脂层上的基板具有第二树脂层和用作天线的第二导电层。在具有上述结构的半导体器件中，第二导电层与第一导电层电连接，其间含有导电粒子的层。此外，第二树脂层设置在第一树脂层上。

67. 发明授权

US07576656B2 Apparatuses and methods for high speed bonding 有权
标题翻译：高速键合的装置和方法
公开(公告)号：US07576656B2
公开(公告)日：2009-08-18
申请号：US11522045
申请日：2006-09-14
申请人： Gordon S. W. Craig , Susan Swindlehurst , Randolph W. Eisenhardt , Ming X. Chan
发明人： Gordon S. W. Craig , Susan Swindlehurst , Randolph W. Eisenhardt , Ming X. Chan
IPC分类号： G08B13/14
CPC分类号： G06K19/07749 , H01L23/4985 , H01L23/49855 , H01L24/83 , H01L24/90 , H01L24/97 , H01L2224/2919 , H01L2224/83192 , H01L2224/838 , H01L2224/83851 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01082 , H01L2924/14 , H01L2224/83 , H01L2924/00014
摘要： Apparatuses and methods for high speed bonding for an RFID device are provided. A first substrate includes an antenna and is coupled to a strap assembly by an adhesive material. The adhesive material is substantially inert thermally for a predetermined temperature range, or it otherwise lacks a heat flow variation greater than 0.05 W/g for the predetermined temperature range. Such an adhesive material provides a reliable bond. In a specific embodiment, the predetermined temperature range is about 30° Celsius to about 85° Celsius. In an alternative embodiment, the adhesive material can be exposed to water or steam to reduce its heat flow variation to less than 0.05 W/g for the temperature range.
摘要翻译：提供了用于RFID装置的高速粘合的装置和方法。第一衬底包括天线，并通过粘合剂材料联接到带组件。粘合剂材料在预定温度范围内基本上是惰性的，否则在预定温度范围内缺少大于0.05W / g的热流变化。这种粘合剂材料提供可靠的粘合。在具体实施方案中，预定温度范围为约30摄氏度至约85摄氏度。在替代实施例中，粘合剂材料可以暴露于水或蒸汽，以在其温度范围内将其热流变化减小到小于0.05W / g。

68. 发明授权

US07575173B2 Smart card, smart card module, and a method for production of a smart card module 有权
标题翻译：智能卡，智能卡模块和智能卡模块的生产方法
公开(公告)号：US07575173B2
公开(公告)日：2009-08-18
申请号：US11341892
申请日：2006-01-30
申请人： Edward Fuergut , Bernd Goller , Robert-Christian Hagen , Simon Jerebic , Jens Pohl , Peter Strobel , Holger Woerner
发明人： Edward Fuergut , Bernd Goller , Robert-Christian Hagen , Simon Jerebic , Jens Pohl , Peter Strobel , Holger Woerner
IPC分类号： G06K19/00
CPC分类号： H01L21/568 , G06K19/07743 , G06K19/07745 , G06K19/07747 , H01L21/561 , H01L21/566 , H01L23/3107 , H01L23/49855 , H01L23/5389 , H01L24/48 , H01L24/49 , H01L24/96 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/49109 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01032 , H01L2924/01033 , H01L2924/01068 , H01L2924/01075 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A smart card for contact data transmission includes a card body and a smart card module which is fitted in the card body. The smart card module includes a semiconductor chip with an active upper surface, a plastic housing compound that surrounds the semiconductor chip and includes at least one surface that is coplanar with the active upper surface of the semiconductor chip, a first dielectric layer that is arranged on the plastic housing compound surface and on the active upper surface of the semiconductor chip, one or more interposer metallization levels, which are isolated via further dielectric layers and are connected to the active upper surface of the semiconductor chip, and external contact surfaces. The external contact surfaces are formed on the outermost interposer level and facilitate contact data transmission. The smart card module uses no bonding wires and has a very small physical volume.
摘要翻译：用于联系数据传输的智能卡包括安装在卡体内的卡体和智能卡模块。智能卡模块包括具有有源上表面的半导体芯片，围绕半导体芯片的塑料壳体化合物，并且包括至少一个与半导体芯片的有源上表面共面的表面;第一介电层，其布置在塑料外壳复合表面和半导体芯片的有源上表面上，一个或多个中介层金属化层，其通过另外的电介质层隔离并连接到半导体芯片的有源上表面和外部接触表面。外部接触表面形成在最外侧的插入层上，便于接触数据传输。智能卡模块不使用接合线，体积非常小。

69. 发明申请

US20090169776A1 Foil composite card 有权
标题翻译：箔复合卡
公开(公告)号：US20090169776A1
公开(公告)日：2009-07-02
申请号：US12006168
申请日：2007-12-31
申请人： John Herslow
发明人： John Herslow
IPC分类号： B32B33/00 , B05D5/06 , B05D3/06
CPC分类号： H01L23/57 , B32B7/12 , B32B15/04 , B32B37/12 , B32B38/06 , B32B38/10 , B32B2038/0092 , B32B2310/0843 , B32B2367/00 , B32B2425/00 , B32B2429/00 , B42D25/328 , B42D25/373 , B42D25/41 , B42D25/425 , B42D25/435 , B42D25/47 , G06K19/06065 , G06K19/07749 , G06K19/0775 , H01L21/561 , H01L23/4985 , H01L23/49855 , H01L2924/0002 , H01L2924/00
摘要： Composite cards formed in accordance with the invention include a security layer comprising a hologram or diffraction grating formed at, or in, the center, or core layer, of the card. The hologram may be formed by embossing a designated area of the core layer with a diffraction pattern and depositing a thin layer of metal on the embossed layer. Additional layers may be selectively and symmetrically attached to the top and bottom surfaces of the core layer. A laser may be used to remove selected portions of the metal formed on the embossed layer, at selected stages of forming the card, to impart a selected pattern or information to the holographic region. The cards may be “lasered” when the cards being processed are attached to, and part of, a large sheet of material, whereby the “lasering” of all the cards on the sheet can be done at the same time and relatively inexpensively. Alternatively, each card may be individually “lasered” to produce desired alpha numeric information, bar codes information or a graphic image, after the sheets are die-cut into cards.
摘要翻译：根据本发明形成的复合卡包括安全层，该安全层包括形成在卡的中心或芯层的中心或芯层的全息图或衍射光栅。全息图可以通过用衍射图案压印芯层的指定区域并在压花层上沉积薄金属层来形成。另外的层可以选择性地和对称地附接到芯层的顶表面和底表面。可以使用激光器来在形成卡片的选定阶段移除形成在压纹层上的金属的选定部分，以将所选择的图案或信息赋予全息区域。当正在处理的卡被附着到大片材料的一部分上时，这些卡片可能被“激光”，由此片材上的所有卡片的“激光”可以同时且相对便宜地完成。或者，在纸张被切割成卡之后，每个卡可以被单独地“激光”以产生所需的字母数字信息，条形码信息或图形图像。

70. 发明授权

US07531757B2 IC card and semiconductor integrated circuit device package 失效
标题翻译： IC卡和半导体集成电路器件封装
公开(公告)号：US07531757B2
公开(公告)日：2009-05-12
申请号：US12037713
申请日：2008-02-26
申请人： Takuya Takahashi , Kazuhiro Yamamoto , Minoru Ohara
发明人： Takuya Takahashi , Kazuhiro Yamamoto , Minoru Ohara
IPC分类号： H01L23/28
CPC分类号： G06K19/07745 , G06K19/07743 , H01L23/49855 , H01L24/97 , H01L2224/48091 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： An IC card includes a semiconductor integrated circuit device package having one surface and another surface opposite to the one surface, card terminals on the one surface of the package, and a base card which includes a concave portion attached to the other surface of the package. The package includes a wiring board, a semiconductor integrated circuit chip on the wiring board, and an insulating resin coated over the semiconductor integrated circuit chip. The package is a rectangular parallelepiped package. The insulating resin is exposed to the other surface of the package. The insulating resin and the wiring board are exposed to four surfaces of the package except for the one surface and the other surface.
摘要翻译： IC卡包括具有一个表面和与一个表面相对的另一个表面的半导体集成电路器件封装，在封装的一个表面上的卡片端子，以及包括附接到封装的另一个表面的凹入部分的基卡。该封装包括布线板，布线板上的半导体集成电路芯片和涂覆在半导体集成电路芯片上的绝缘树脂。包装是一个长方体包装。绝缘树脂暴露于包装的另一个表面。除了一个表面和另一个表面之外，绝缘树脂和布线板暴露于封装的四个表面。

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