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61. 发明申请

US20020162686A1 Discrete circuit component and process of fabrication 有权
标题翻译：分立电路元件及制造工艺
公开(公告)号：US20020162686A1
公开(公告)日：2002-11-07
申请号：US09950856
申请日：2001-09-10
申请人： Comchip Technology Co., Ltd.
发明人： Wen Long Chen
IPC分类号： H05K001/11
CPC分类号： H01C7/003 , H01C7/18 , H01C17/006 , H01C17/283 , H01G4/06 , H01L2224/05552 , H01L2924/12032 , H01L2924/00012 , H01L2924/00
摘要： A discrete circuit component comprises a circuit component die having a first electrode and a second electrode. A surface of a first substrate has an electrically-conductive trace electrically connected to the first electrode of the circuit component die, and a surface of a second substrate also has an electrically-conductive trace electrically connected to the second electrode of the circuit component die. A first terminal electrode is electrically connected to the conductive trace of the first substrate, surface of the first terminal electrode is orthogonal to the longitudinal axis of the conductive trace of the first substrate. A second terminal electrode is electrically connected to the conductive trace of the second substrate, and surface of the second terminal electrode is orthogonal to the longitudinal axis of the conductive trace of the second substrate. The first and second substrates are parallel to each other and encloses the circuit component die. The conductive trace of the first substrate leads away from the circuit component die in the direction opposite to the direction in which the conductive trace of the second substrate leads away from the circuit component die. The space between the first and second substrates not being occupied by the circuit component die is filled with a material the same as the material for the first and second substrates. The filled material encloses the circuit component die completely.
摘要翻译：分立电路部件包括具有第一电极和第二电极的电路部件芯片。第一基板的表面具有电连接到电路元件芯片的第一电极的导电迹线，并且第二基板的表面还具有电连接到电路元件芯片的第二电极的导电迹线。第一端子电极电连接到第一衬底的导电迹线，第一端子电极的表面垂直于第一衬底的导电迹线的纵向轴线。第二端子电极电连接到第二衬底的导电迹线，并且第二端子电极的表面与第二衬底的导电迹线的纵向轴线正交。第一和第二基板彼此平行并包围电路元件模具。第一衬底的导电迹线在与第二衬底的导电迹线远离电路元件裸片的方向相反的方向上远离电路元件裸片。未被电路元件模具占据的第一和第二基板之间的空间填充有与第一和第二基板的材料相同的材料。填充材料完全封闭电路元件模具。

62. 发明申请

US20020146556A1 Resistor foil 审中-公开
标题翻译：电阻箔
公开(公告)号：US20020146556A1
公开(公告)日：2002-10-10
申请号：US09825803
申请日：2001-04-04
申请人： GA-TEK Inc. (dba Gould Electronics Inc.)
发明人： Joel W. Pankow , Michael A. Centanni
IPC分类号： B32B015/08
CPC分类号： H05K1/167 , H01C7/003 , H01C7/005 , H01C17/07 , H05K2201/0329 , H05K2201/0355 , H05K2203/0361 , H05K2203/121 , H05K2203/122 , Y10T428/265 , Y10T428/31699
摘要： A resistor foil comprised of a layer of copper foil and a coating of an organic molecular semiconductor material on one side of the copper foil.
摘要翻译：一种由铜箔层和铜箔一面上的有机分子半导体材料涂层组成的电阻箔。

63. 发明申请

US20020130760A1 METHOD FOR MANUFACTURING A POWER CHIP RESISTOR 失效
标题翻译：制造电源芯片电阻的方法
公开(公告)号：US20020130760A1
公开(公告)日：2002-09-19
申请号：US10091792
申请日：2002-03-06
发明人： Louis P. Huber , Ziv Shoshani
IPC分类号： H01C001/012
CPC分类号： H01C7/003 , H01C1/01 , H01C3/12 , H01C7/18 , Y10S438/977 , Y10T29/49082 , Y10T29/49083 , Y10T29/49098 , Y10T29/49099 , Y10T29/49101
摘要： A method and apparatus for a stacked power chip resistor is disclosed. The invention provides for multiple power chip resistors to be stacked, providing for encapsulant such as glass to separate each power chip resistor and a metal barrier such as nickel plating on each end of the stacked power chip resistor to provide for electrical and mechanical connection of each power chip resistor in the stack.
摘要翻译：公开了一种叠层电源片式电阻器的方法和装置。本发明提供了要堆叠的多个功率芯片电阻器，提供诸如玻璃的密封剂以分离每个功率芯片电阻器和在堆叠的功率芯片电阻器的每个端部上分离诸如镀镍的金属屏障，以提供每一个的电气和机械连接堆叠中的电源芯片电阻。

64. 发明申请

US20020003466A1 Chip resistor 有权
标题翻译：贴片电阻
公开(公告)号：US20020003466A1
公开(公告)日：2002-01-10
申请号：US09900151
申请日：2001-07-09
申请人： ROHM CO., LTD.
发明人： Masaki Yoneda
IPC分类号： H01C001/012
CPC分类号： H01C7/003 , H01C7/18
摘要： There are provided a pair of upper surface electrodes 21, 31 at both end sections, which are opposed to each other, of the insulating substrate 1 made of alumina. There is provided a resistor body 4 on the substrate 1 so that the upper surface electrode 21 and both the end sections can be electrically connected with each other. On the pair of upper surface electrodes 21, 31, there are provided a pair of upper surface auxiliary electrodes 24, 34 made of material, the heat-resistance with respect to solder of which is superior to that of the upper surface electrodes 21, 31, so that the exposed sections of the upper surface electrodes 21, 31 can be completely covered with the pair of upper surface auxiliary electrodes 24, 34, wherein the pair of upper surface auxiliary electrodes 24, 34 are not directly connected with the resistor body 4. On the surface of the resistor body 4, there is provided a protective film 5 (a first protective film 51 to a third protective film 53).
摘要翻译：在由氧化铝制成的绝缘基板1的两端部彼此相对设置有一对上表面电极21,31。在基板1上设置有电阻体4，使得上表面电极21和两端部电连接。在一对上表面电极21,31上设置有一对由材料制成的上表面辅助电极24,34，相对于焊料的耐热性优于上表面电极21,31的耐热性使得上表面电极21,31的暴露部分可以被一对上表面辅助电极24,34完全覆盖，其中一对上表面辅助电极24,34不直接与电阻体4连接在电阻体4的表面设有保护膜5（第一保护膜51〜第三保护膜53）。

65. 发明申请

US20010054950A1 Termination resistor in printed circuit board 失效
公开(公告)号：US20010054950A1
公开(公告)日：2001-12-27
申请号：US09921728
申请日：2001-08-03
发明人： Steven V.R. Hellriegel
IPC分类号： H01C001/012
CPC分类号： H01C7/003 , H05K1/167 , H05K3/429 , H05K2201/0355 , H05K2201/09263 , H05K2201/093 , H05K2203/0361
摘要： A printed circuit board having resistors formed therein. A conductive layer composed of two different metals is provided on top of an insulating layer in a printed circuit board. The first metal layer is highly conductive and the second metal layer is highly resistive. For a major portion of the layer, both layers are connected electrically in parallel so that they provide a highly conductive path. At selected locations throughout the printed circuit board, the highly conductive metal is removed providing only the high resistivity metal to act as a resistor between selected locations in the conductive layer. Many resistors are formed at the same time, thus providing ease of fabrication and precision in resistor values across the entire printed circuit board. Following the formation of the resistor, additional insulating and conductive layers are formed to complete the printed circuit board. An electrical connector is then formed between at least one metal layer in the printed circuit board and the resistive layer. This permits easy connection between a conductive layer which is connected to an integrated circuit to provide proper termination voltage and the termination layer, including the termination resistor.

66. 发明申请

US20010006451A1 Monolithic ceramic electronic component and production process therefor, and ceramic paste and production process therefor 有权
标题翻译：单片陶瓷电子元器件及其制作工艺及其制作工艺
公开(公告)号：US20010006451A1
公开(公告)日：2001-07-05
申请号：US09735879
申请日：2000-12-13
申请人： Murata Manufacturing Co., Ltd.
发明人： Makoto Miyazaki , Satoru Tanaka , Koji Kimura , Koji Hato , Koji Suzuki
IPC分类号： H01G004/06 , B28B001/00 , B28B003/00 , C03B029/00 , C04B035/64
CPC分类号： C04B35/6264 , B32B18/00 , B32B37/0046 , B32B38/145 , B32B2038/042 , B32B2311/08 , B32B2311/12 , B32B2311/22 , C04B35/053 , C04B35/111 , C04B35/2658 , C04B35/46 , C04B35/468 , C04B35/486 , C04B35/491 , C04B35/565 , C04B35/584 , C04B35/63 , C04B35/632 , C04B35/634 , C04B35/63416 , C04B35/63424 , C04B35/636 , C04B35/6365 , C04B35/638 , C04B37/005 , C04B2235/3206 , C04B2235/3262 , C04B2235/3275 , C04B2235/3279 , C04B2235/36 , C04B2235/5436 , C04B2237/06 , C04B2237/064 , C04B2237/068 , C04B2237/08 , C04B2237/083 , C04B2237/09 , C04B2237/405 , C04B2237/407 , C04B2237/408 , C04B2237/50 , C04B2237/68 , H01C7/003 , H01C7/18 , H01F17/0013 , H01F41/043 , H01F41/046 , H01G4/12 , H01G4/30 , H01L21/4857
摘要： A process for producing a monolithic ceramic electronic component, which includes: providing a ceramic slurry, a conductive paste, and a ceramic paste; forming a plurality of composite structures each comprising a ceramic green sheet produced by shaping the ceramic slurry, internal circuit element films formed by applying the conductive paste partially onto a main surface of the ceramic green sheet so as to provide step-like sections, and a ceramic green layer which compensates for spaces defined by the step-like sections, the ceramic green layer being formed by applying the ceramic paste onto the region on the main surface of the sheet on which the element films are not formed, so as to substantially compensate for the spaces; forming a green laminate by laminating the composite structures; and firing the green laminate, wherein the ceramic paste contains ceramic powder, an organic solvent, and an organic binder. A monolithic ceramic electronic component produced through the process; a ceramic paste; and a production process for the ceramic paste are also disclosed.
摘要翻译：一种用于制造单块陶瓷电子部件的方法，其包括：提供陶瓷浆料，导电浆料和陶瓷糊料; 形成多个复合结构，每个复合结构包括通过使陶瓷浆料成形而制成的陶瓷生片，通过将导电浆部分地涂覆在陶瓷生片的主表面上形成的内部电路元件膜，以提供阶梯状部分，以及陶瓷绿色层，其补偿由阶梯状部分限定的空间，陶瓷生坯层通过将陶瓷浆料涂覆在不形成元件膜的片材的主表面上的区域上而形成，以便基本上补偿为空间; 通过层压复合结构形成绿色层压板; 烧成绿色层压体，其中，陶瓷糊含有陶瓷粉末，有机溶剂和有机粘合剂。通过该方法生产的单片陶瓷电子部件; 陶瓷糊; 还公开了陶瓷糊的制造方法。

67. 发明授权

US6055151A Multilayer ceramic circuit boards including embedded components 失效
标题翻译：多层陶瓷电路板包括嵌入式元件
公开(公告)号：US6055151A
公开(公告)日：2000-04-25
申请号：US31745
申请日：1998-02-27
申请人： Ellen Schwartz Tormey , Ashok Narayan Prabhu , Attiganal Narayanaswamy Sreeram , Michael James Liberatore
发明人： Ellen Schwartz Tormey , Ashok Narayan Prabhu , Attiganal Narayanaswamy Sreeram , Michael James Liberatore
IPC分类号： H01C7/00 , H01C13/02 , H01C17/30 , H01L23/64 , H05K1/03 , H05K1/09 , H05K1/16 , H05K3/46 , H01G4/06 , H01G4/20
CPC分类号： H01C7/003 , H01C13/02 , H01C17/30 , H01L23/64 , H05K1/162 , H05K1/167 , H01L2924/0002 , H01L2924/09701 , H01L2924/19041 , H05K1/0306 , H05K1/092 , H05K3/4611 , H05K3/4629 , H05K3/4688 , Y10T29/49128
摘要： Embedded passive components such as capacitors are formed in multilayer ceramic circuit boards by screen printing a component precursor compound ink sandwiched between conductor ink layers onto a green tape stack and covering the component ink layer with one or two green tape layers, aligning and laminating the green tapes and firing. Capacitor inks are made from dielectrics chosen from barium titanate, titanium oxide and lead-magnesium-niobate. The green tapes are made of a mixture of a crystallizing glass, a non-crystallizing glass and an oxide filler which does not shrink in the x and y dimensions during firing mounted on a metal support. Thus the embedded components can be made to close tolerances.
摘要翻译：诸如电容器的嵌入式无源部件通过丝网印刷夹在导电油墨层之间的组分前体复合油墨到一个生胶带堆叠上而形成在多层陶瓷电路板中，并用一个或两个生胶带层覆盖部件油墨层，对准和层压绿色磁带和射击。电容器油墨由选自钛酸钡，氧化钛和铌酸镁镁的电介质制成。生胶带由结晶玻璃，非结晶玻璃和氧化物填料的混合物制成，其在烧制安装在金属载体上时在x和y尺寸上不收缩。因此，嵌入式组件可以制成紧密公差。

68. 发明授权

US5907274A Chip resistor 失效
标题翻译：贴片电阻
公开(公告)号：US5907274A
公开(公告)日：1999-05-25
申请号：US923703
申请日：1997-09-04
申请人： Suzushi Kimura , Koji Shimoyama , Naotugu Yoneda , Keiichi Nakao
发明人： Suzushi Kimura , Koji Shimoyama , Naotugu Yoneda , Keiichi Nakao
IPC分类号： H01C1/142 , H01C7/00 , H01C17/00 , H01C17/28 , H01C1/012
CPC分类号： H01C1/142 , H01C17/006 , H01C17/281 , H01C7/003 , Y10T29/49082 , Y10T29/49099 , Y10T29/49101
摘要： The invention relates to a chip resistor which is used as a circuit part for various electric apparatuses. The object of the invention is to realize a low resistance and a low TCR, and also high accuracy and high reliability. In order to achieve the object, a chip resistor is configured so as to have: a substrate; a resistance layer which is formed on at least one face of the substrate and which is made of a copper nickel alloy; upper-face electrode layers which make surface contact with the upper faces of both the end portions of the resistance layer; and end-face electrodes which are formed so as to cover the upper-face electrode layers. Since the bonding between the resistance layer and the upper-face electrode layers is conducted by metal-to-metal bonding, particularly, impurities which may affect the properties do not exist in the interface. As a result, it is possible to realize a chip resistor which is excellent in heat resistance, and which has a low resistance and a low TCR.
摘要翻译：本发明涉及一种片状电阻器，其用作各种电气设备的电路部分。本发明的目的是实现低电阻和低TCR，并且还具有高精度和高可靠性。为了实现该目的，芯片电阻器被配置为具有：基板; 电阻层，其形成在所述基板的至少一个面上，并且由铜镍合金制成; 与电阻层的两端部的上表面接触的上表面电极层; 以及形成为覆盖上表面电极层的端面电极。由于电阻层和上表面电极层之间的结合是通过金属 - 金属键合进行的，特别是界面中不存在可能影响特性的杂质。结果，可以实现耐热性优异并且具有低电阻和低TCR的片式电阻器。

69. 发明授权

US5750958A Ceramic glow plug 失效
标题翻译：陶瓷电热塞
公开(公告)号：US5750958A
公开(公告)日：1998-05-12
申请号：US305085
申请日：1994-09-13
申请人： Norio Okuda , Hiroyuki Arima , Kyouji Uchiyama , Michio Ohno , Hiroaki Ohyama , Jun Fukuda , Makoto Niina
发明人： Norio Okuda , Hiroyuki Arima , Kyouji Uchiyama , Michio Ohno , Hiroaki Ohyama , Jun Fukuda , Makoto Niina
IPC分类号： F02B3/06 , F23Q7/00 , H01C7/00 , H01C17/065 , H05B3/14 , H05B3/48 , F23Q7/22 , F02P19/00 , H05B3/44
CPC分类号： H05B3/141 , C04B35/5626 , C04B35/584 , F23Q7/001 , H01C17/0652 , H01C7/003 , H05B3/48 , C04B2235/3217 , C04B2235/3224 , C04B2235/3418 , C04B2235/3873 , C04B2235/3891 , C04B2235/723 , C04B2235/80 , C04B2235/85 , F02B3/06
摘要： A ceramic heater for a DC power source comprising an insulating ceramic sintered body, a heating resistor composed of at least two separate layers of heating resistor made of an inorganic conductive material, leads made of high-melting point metal wires and connected to each end of the layers, and electrodes made of an inorganic conductive material, each formed in a single layer or divided into a plurality of pieces and connected to the leads, the heating resistor, leads and electrodes being embedded in the ceramic sintered body. The present invention further includes six related inventions closely related with one another in regard to the above-mentioned ceramic heater and ceramic glow plugs embodied by using the ceramic heater.
摘要翻译：一种用于DC电源的陶瓷加热器，包括绝缘陶瓷烧结体，由至少两个由无机导电材料制成的加热电阻器的单独层组成的加热电阻器，由高熔点金属线制成的引线，并连接到各层和由无机导电材料制成的电极，各自形成为单层或分成多个片并连接到引线，加热电阻器，引线和电极嵌入陶瓷烧结体中。本发明还包括关于通过使用陶瓷加热器实现的上述陶瓷加热器和陶瓷预热塞彼此密切相关的六个相关发明。

70. 发明授权

US5734314A Low resistance paints for surge applications using nickel-chromium alloy blended with additional alloys 失效
标题翻译：使用镍铬合金与额外合金混合的浪涌应用的低电阻涂料
公开(公告)号：US5734314A
公开(公告)日：1998-03-31
申请号：US689531
申请日：1996-08-08
申请人： Charles C. Y. Kuo
发明人： Charles C. Y. Kuo
IPC分类号： H01C7/00 , H01C17/065 , H01C1/012 , H01C7/10
CPC分类号： H01C7/003 , H01C17/06526
摘要： A surge resistor has a thick film resistance element containing alloyed nickel-chromium mixed with alloyed copper-nickel and less than twenty percent by weight glass. The surge resistor overcomes the limitations of the prior art by offering the unexpected advantage of improved power surge handling capacity. A thick film composition used to form the surge resistor, which also includes screening agent, is fired at temperatures generally below 1,000.degree. C., yielding a highly stable and well adhered electrical resistor. In addition to improved surge capability, the composition offers lower cost and less migration than the precious metal alternatives that the composition replaces. Additional inventive surge resistors include copper-manganese and nickel-chromium in combination with less than twenty percent by weight glass.
摘要翻译：浪涌电阻器具有厚膜电阻元件，其包含与合金铜镍和少于二十重量百分比的玻璃混合的合金镍铬。浪涌电阻器通过提供改进的功率浪涌处理能力的意想不到的优点来克服现有技术的局限性。用于形成浪涌电阻器的厚膜组合物，其也包括筛选剂，在通常低于1000℃的温度下焙烧，产生高度稳定和良好粘附的电阻器。除了提高浪涌能力外，组合物还具有较低的成本和较少的组成替代品的贵金属替代品的迁移。额外的本发明的浪涌电阻器包括铜 - 锰和镍 - 铬以及少于百分之二十的重量百分比的玻璃。

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