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    • 64. 发明申请
    • METHOD OF OPERATING TESTING SYSTEM
    • 操作测试系统的方法
    • US20150204962A1
    • 2015-07-23
    • US14557181
    • 2014-12-01
    • MPI CORPORATION
    • WEI-CHENG KUSHAO-WEI LUHAO WEIYU-TSE WANG
    • G01R35/00G01R31/04
    • G01R31/2891G01R35/005
    • A method of operating a testing system is provided, wherein the testing system has a test machine and a probe module, which has a first probe set and a second probe set. One of the first probe set and the second probe set can be connected to the test machine. The method includes the following steps: connect the test machine and the first probe set; calibrate the testing system; abut the first probe set against a DUT to do electrical tests; disconnect the first probe set and the DUT; disconnect the test machine and the first probe set; connect the test machine and the second probe set; calibrate the testing system again; abut the second probe set against the DUT to do electrical tests.
    • 提供了一种操作测试系统的方法,其中所述测试系统具有测试机器和探针模块,所述测试机器和探针模块具有第一探针组和第二探针组。 第一个探针组和第二个探针组之一可以连接到测试机。 该方法包括以下步骤:连接测试机和第一个探头组; 校准测试系统; 将第一个探测器对准DUT进行电气测试; 断开第一个探针组和DUT; 断开测试机和第一个探头组; 连接测试机和第二个探头组; 再次校准测试系统; 将第二个探测器对准DUT,进行电气测试。
    • 69. 发明授权
    • Test apparatus of semiconductor package and methods of testing the semiconductor package using the same
    • 半导体封装的测试装置和使用其的半导体封装的测试方法
    • US09007085B2
    • 2015-04-14
    • US13532982
    • 2012-06-26
    • Hunkyo Seo
    • Hunkyo Seo
    • G01R31/00G01R1/04G01R31/28
    • G01R1/0483G01R1/0466G01R31/2891
    • A semiconductor package testing apparatus and testing a semiconductor package, the apparatus including a test circuit substrate that electrically tests a semiconductor package having connection terminals; a socket electrically connecting the test circuit substrate with the semiconductor package; a socket guide having an open region delimiting the socket; an insert that fixes the semiconductor package and positions the semiconductor package in the open region of the socket guide; a pusher that presses the semiconductor package to make contact between the socket and the semiconductor package; and an alignment part that aligns the semiconductor package with the open region, wherein the alignment part is configured to selectively apply a magnetic force to align keys of the semiconductor package, the align keys being formed of a magnetic material.
    • 一种半导体封装测试装置和半导体封装的测试,该装置包括:电测试具有连接端子的半导体封装的测试电路基板; 将测试电路基板与半导体封装电连接的插座; 具有限定所述插座的开放区域的插座引导件; 固定所述半导体封装并将所述半导体封装定位在所述插座引导件的开放区域中的插入件; 按压半导体封装以在插座和半导体封装之间接触的推动器; 以及将半导体封装与开放区域对准的对准部件,其中对准部件被配置为选择性地施加磁力以对准半导体封装的键,对准键由磁性材料形成。
    • 70. 发明授权
    • Positioner system and method of positioning
    • 定位系统和定位方法
    • US08981807B2
    • 2015-03-17
    • US13190928
    • 2011-07-26
    • Christopher Leonard WestCharles Paul Nappen
    • Christopher Leonard WestCharles Paul Nappen
    • G01R31/20G01R31/28
    • G01R31/2887B25J9/023B25J9/041B25J17/0208B25J19/002G01R31/2834G01R31/2891
    • A system for positioning a load including a support column, a drive rail unit coupled to the support column, the drive rail unit moveable relative to the support column, a vertical carriage moveable along the support column, wherein the vertical carriage supports the load, an engagement member which engages the drive rail and which moves along the drive rail, and a motor which applies force to the engagement member, causing the engagement member to move along the drive rail. The motor is coupled to the vertical carriage so that, as the motor applies force to the engagement member, the vertical carriage moves relative to the drive rail unit, the vertical carriage is also moveable with the drive rail unit so that the vertical carriage and the drive rail unit move relative to the support column. A method of positioning a load is also provided.
    • 一种用于定位负载的系统,包括支撑柱,耦合到支撑柱的驱动轨单元,可相对于支撑柱移动的驱动轨道单元,可沿着支撑柱移动的竖直托架,其中竖直托架支撑负载, 接合构件,其与驱动轨道接合并沿着驱动轨道移动;以及电动机,其向接合构件施加力,使得接合构件沿着驱动轨道移动。 电动机联接到垂直滑架,使得当电动机对接合构件施加力时,垂直滑架相对于驱动轨道单元移动,垂直滑架也可以与驱动轨道单元一起移动,使得垂直滑架和 驱动轨道单元相对于支撑柱移动。 还提供了一种定位负载的方法。