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    • 69. 发明授权
    • Clad metal substrate
    • 包层金属基材
    • US5653379A
    • 1997-08-05
    • US459440
    • 1995-06-02
    • James ForsterPremkumar HingoranyHenry F. Breit
    • James ForsterPremkumar HingoranyHenry F. Breit
    • B23K35/00C04B37/02H05K1/03H05K1/05H05K3/38B23K31/02B23K35/24
    • B23K35/007C04B37/021C04B2237/32C04B2237/365C04B2237/366C04B2237/402C04B2237/407H05K1/0306H05K1/053H05K3/38
    • Ceramic to metal stock or substrates having a relatively large and thick metal core and a relatively thin ceramic layer or layers are bonded to the metal core or a selected portion thereof by providing a metal core material having a temperature coefficient of expansion which is tailored to the temperature coefficient of expansion of the ceramic layer to be bonded thereto. The typical core materials include multilayer composite metal laminates embodying Cu/Mo/Cu, Cu/Kovar/Cu, Cu/Invar/Cu and the like and including powdered metal composites embodying Cu-W, Ag-Mo, Ag-W, Al-Si, Cu/Mo/Cu, Cu/Kovar/Cu, SiC-Cu, Ni-Fe alloys having from about 20% Ni to about 80% Ni, etc. The ceramic layer is chosen primarily for the properties of dielectric strength and isolation properties and typically include such ceramics as alumina, beryllium oxide, aluminum nitride, silicon carbide, etc. Where the core composite includes copper outer surface materials or is plated to have copper outer surface materials, the core and ceramic materials and particularly multiple sections of the ceramic materials are provided in spaced relation on the metal cores of relatively large area and are preferably bonded to the core using a copper oxide eutectic formed on the core surface.
    • 具有相对较大和较厚的金属芯和相对较薄的陶瓷层的陶瓷与金属原料或基底通过提供具有温度膨胀系数的金属芯材料结合到金属芯或其选定部分,该金属芯材料适合于 要结合的陶瓷层的温度膨胀系数。 典型的核心材料包括体现Cu / Mo / Cu,Cu / Kovar / Cu,Cu / Invar / Cu等的多层复合金属层压体,包括体现Cu-W,Ag-Mo,Ag-W,Al- Si,Cu / Mo / Cu,Cu / Kovar / Cu,具有约20%Ni至约80%Ni等的SiC-Cu,Ni-Fe合金等。陶瓷层主要用于介电强度和隔离性能 性质,并且通常包括诸如氧化铝,氧化铍,氮化铝,碳化硅等的陶瓷。其中芯复合材料包括铜外表面材料或被电镀以具有铜外表面材料,芯和陶瓷材料,特别是多个部分 在相对较大面积的金属芯上以间隔设置陶瓷材料,并且优选使用在芯表面上形成的铜氧化物共晶体将其结合到芯上。