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    • 61. 发明授权
    • Micro electronic mechanical system structure
    • 微电子机械系统结构
    • US08502328B2
    • 2013-08-06
    • US13409020
    • 2012-02-29
    • Tsai-Chiang NiehTung-Ming LaiFeng-Tsai Tsai
    • Tsai-Chiang NiehTung-Ming LaiFeng-Tsai Tsai
    • H01L29/84
    • B81C1/00944B81B3/0008B81C2203/0742
    • A micro electronic mechanical system structure and a manufacturing method thereof are provided. A substrate has a plurality of conductive regions is provided. A dielectric layer is formed on the substrate. A plurality of openings and recesses are formed in the dielectric layer, wherein the openings expose the conductive regions. The recesses are located between the openings. A conductive layer is formed on the dielectric layer and the openings and the recesses are filled with the conductive layer. The conductive layer is patterned to form a plurality of strips of the first conductive patterns on the dielectric layer and a second conductive pattern on the sidewall and the bottom of each recess, wherein the first conductive patterns are connected with each other through the second conductive patterns. The dielectric layer is removed. The second conductive patterns between the first conductive patterns are removed.
    • 提供微电子机械系统结构及其制造方法。 衬底具有多个导电区域。 在基板上形成电介质层。 在电介质层中形成多个开口和凹槽,其中开口暴露导电区域。 凹槽位于开口之间。 在电介质层上形成导电层,并且用导电层填充开口和凹部。 导电层被图案化以在电介质层上形成多个第一导电图案的条带,并且在每个凹部的侧壁和底部上形成第二导电图案,其中第一导电图案通过第二导电图案彼此连接 。 去除电介质层。 去除第一导电图案之间的第二导电图案。
    • 63. 发明授权
    • Mechanical quantity sensor and method of manufacturing the same
    • 机械量传感器及其制造方法
    • US08240205B2
    • 2012-08-14
    • US12527554
    • 2008-06-24
    • Akio Morii
    • Akio Morii
    • G01C19/00
    • G01P15/125B81B3/0008B81B2201/0242B81C2203/031G01C19/56G01C25/00G01P15/0802G01P15/18G01P2015/084G01P2015/0842
    • A mechanical quantity sensor includes a first structure having a fixed portion with an opening, a displaceable portion arranged in the opening and displaceable relative to the fixed portion, and a connection portion connecting the fixed portion and the displaceable portion, a second structure having a weight portion joined to the displaceable portion and a pedestal joined to the fixed portion, and arranged and stacked on the first structure, and a base having a driving electrode and a detection electrode arranged on a face facing the weight portion, connected to the pedestal, and arranged and stacked on the second structure. The second structure has a projection arranged in an area on a face of the weight portion facing the base, the area corresponding to an area where the driving electrode and the detection electrode are not arranged, the projection having a thickness larger than thicknesses of the driving electrode and the detection electrode.
    • 机械量传感器包括具有开口的固定部分的第一结构,布置在开口中并相对于固定部分移位的位移部分和连接固定部分和可移位部分的连接部分,具有重量的第二结构 接合到可位移部分的部分和接合到固定部分的基座,并且布置和堆叠在第一结构上,以及基座,其具有布置在与基座相连的面对重物部分的面上的驱动电极和检测电极,以及 布置并堆叠在第二结构上。 第二结构具有布置在面对基部的配重部分的面上的区域中的突出部分,该区域对应于未布置驱动电极和检测电极的区域,突出部的厚度大于驱动 电极和检测电极。
    • 64. 发明申请
    • MICRO ELECTRONIC MECHANICAL SYSTEM STRUCTURE
    • 微电子机械系统结构
    • US20120153469A1
    • 2012-06-21
    • US13409020
    • 2012-02-29
    • Tsai-Chiang NiehTung-Ming LaiFeng-Tsai Tsai
    • Tsai-Chiang NiehTung-Ming LaiFeng-Tsai Tsai
    • H01L23/498
    • B81C1/00944B81B3/0008B81C2203/0742
    • A micro electronic mechanical system structure and a manufacturing method thereof are provided. A substrate has a plurality of conductive regions is provided. A dielectric layer is formed on the substrate. A plurality of openings and recesses are formed in the dielectric layer, wherein the openings expose the conductive regions. The recesses are located between the openings. A conductive layer is formed on the dielectric layer and the openings and the recesses are filled with the conductive layer. The conductive layer is patterned to form a plurality of strips of the first conductive patterns on the dielectric layer and a second conductive pattern on the sidewall and the bottom of each recess, wherein the first conductive patterns are connected with each other through the second conductive patterns. The dielectric layer is removed. The second conductive patterns between the first conductive patterns are removed.
    • 提供微电子机械系统结构及其制造方法。 衬底具有多个导电区域。 在基板上形成电介质层。 在电介质层中形成多个开口和凹槽,其中开口暴露导电区域。 凹槽位于开口之间。 在电介质层上形成导电层,并且用导电层填充开口和凹部。 导电层被图案化以在电介质层上形成多个第一导电图案的条带,并且在每个凹部的侧壁和底部上形成第二导电图案,其中第一导电图案通过第二导电图案彼此连接 。 去除电介质层。 去除第一导电图案之间的第二导电图案。
    • 65. 发明申请
    • MICRO ELECTRONIC MECHANICAL SYSTEM STRUCTURE AND MANUFACTURING METHOD THEREOF
    • 微电子机械系统结构及其制造方法
    • US20110169106A1
    • 2011-07-14
    • US12721546
    • 2010-03-10
    • Tsai-Chiang NiehTung-Ming LaiFeng-Tsai Tsai
    • Tsai-Chiang NiehTung-Ming LaiFeng-Tsai Tsai
    • H01L29/84H01L21/02
    • B81C1/00944B81B3/0008B81C2203/0742
    • A micro electronic mechanical system structure and a manufacturing method thereof are provided. A substrate has a plurality of conductive regions is provided. A dielectric layer is formed on the substrate. A plurality of openings and recesses are formed in the dielectric layer, wherein the openings expose the conductive regions. The recesses are located between the openings. A conductive layer is formed on the dielectric layer and the openings and the recesses are filled with the conductive layer. The conductive layer is patterned to form a plurality of strips of the first conductive patterns on the dielectric layer and a second conductive pattern on the sidewall and the bottom of each recess, wherein the first conductive patterns are connected with each other through the second conductive patterns. The dielectric layer is removed. The second conductive patterns between the first conductive patterns are removed.
    • 提供微电子机械系统结构及其制造方法。 衬底具有多个导电区域。 在基板上形成电介质层。 在电介质层中形成多个开口和凹槽,其中开口暴露导电区域。 凹槽位于开口之间。 在电介质层上形成导电层,并且用导电层填充开口和凹部。 导电层被图案化以在电介质层上形成多个第一导电图案的条带,并且在每个凹部的侧壁和底部上形成第二导电图案,其中第一导电图案通过第二导电图案彼此连接 。 去除电介质层。 去除第一导电图案之间的第二导电图案。