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1. 发明授权

US08163583B2 Manufacturing method of micro electronic mechanical system structure 有权
标题翻译：微电子机械系统结构的制造方法
公开(公告)号：US08163583B2
公开(公告)日：2012-04-24
申请号：US12721546
申请日：2010-03-10
申请人： Tsai-Chiang Nieh , Tung-Ming Lai , Feng-Tsai Tsai
发明人： Tsai-Chiang Nieh , Tung-Ming Lai , Feng-Tsai Tsai
IPC分类号： H01L21/467
CPC分类号： B81C1/00944 , B81B3/0008 , B81C2203/0742
摘要： A micro electronic mechanical system structure and a manufacturing method thereof are provided. A substrate has a plurality of conductive regions is provided. A dielectric layer is formed on the substrate. A plurality of openings and recesses are formed in the dielectric layer, wherein the openings expose the conductive regions. The recesses are located between the openings. A conductive layer is formed on the dielectric layer and the openings and the recesses are filled with the conductive layer. The conductive layer is patterned to form a plurality of strips of the first conductive patterns on the dielectric layer and a second conductive pattern on the sidewall and the bottom of each recess, wherein the first conductive patterns are connected with each other through the second conductive patterns. The dielectric layer is removed. The second conductive patterns between the first conductive patterns are removed.
摘要翻译：提供微电子机械系统结构及其制造方法。衬底具有多个导电区域。在基板上形成电介质层。在电介质层中形成多个开口和凹槽，其中开口暴露导电区域。凹槽位于开口之间。在电介质层上形成导电层，并且用导电层填充开口和凹部。导电层被图案化以在电介质层上形成多个第一导电图案的条带，并且在每个凹部的侧壁和底部上形成第二导电图案，其中第一导电图案通过第二导电图案彼此连接。去除电介质层。去除第一导电图案之间的第二导电图案。

2. 发明授权

US08502328B2 Micro electronic mechanical system structure 有权
标题翻译：微电子机械系统结构
公开(公告)号：US08502328B2
公开(公告)日：2013-08-06
申请号：US13409020
申请日：2012-02-29
申请人： Tsai-Chiang Nieh , Tung-Ming Lai , Feng-Tsai Tsai
发明人： Tsai-Chiang Nieh , Tung-Ming Lai , Feng-Tsai Tsai
IPC分类号： H01L29/84
CPC分类号： B81C1/00944 , B81B3/0008 , B81C2203/0742
摘要： A micro electronic mechanical system structure and a manufacturing method thereof are provided. A substrate has a plurality of conductive regions is provided. A dielectric layer is formed on the substrate. A plurality of openings and recesses are formed in the dielectric layer, wherein the openings expose the conductive regions. The recesses are located between the openings. A conductive layer is formed on the dielectric layer and the openings and the recesses are filled with the conductive layer. The conductive layer is patterned to form a plurality of strips of the first conductive patterns on the dielectric layer and a second conductive pattern on the sidewall and the bottom of each recess, wherein the first conductive patterns are connected with each other through the second conductive patterns. The dielectric layer is removed. The second conductive patterns between the first conductive patterns are removed.
摘要翻译：提供微电子机械系统结构及其制造方法。衬底具有多个导电区域。在基板上形成电介质层。在电介质层中形成多个开口和凹槽，其中开口暴露导电区域。凹槽位于开口之间。在电介质层上形成导电层，并且用导电层填充开口和凹部。导电层被图案化以在电介质层上形成多个第一导电图案的条带，并且在每个凹部的侧壁和底部上形成第二导电图案，其中第一导电图案通过第二导电图案彼此连接。去除电介质层。去除第一导电图案之间的第二导电图案。

3. 发明申请

US20120153469A1 MICRO ELECTRONIC MECHANICAL SYSTEM STRUCTURE 有权
标题翻译：微电子机械系统结构
公开(公告)号：US20120153469A1
公开(公告)日：2012-06-21
申请号：US13409020
申请日：2012-02-29
申请人： Tsai-Chiang Nieh , Tung-Ming Lai , Feng-Tsai Tsai
发明人： Tsai-Chiang Nieh , Tung-Ming Lai , Feng-Tsai Tsai
IPC分类号： H01L23/498
CPC分类号： B81C1/00944 , B81B3/0008 , B81C2203/0742
摘要： A micro electronic mechanical system structure and a manufacturing method thereof are provided. A substrate has a plurality of conductive regions is provided. A dielectric layer is formed on the substrate. A plurality of openings and recesses are formed in the dielectric layer, wherein the openings expose the conductive regions. The recesses are located between the openings. A conductive layer is formed on the dielectric layer and the openings and the recesses are filled with the conductive layer. The conductive layer is patterned to form a plurality of strips of the first conductive patterns on the dielectric layer and a second conductive pattern on the sidewall and the bottom of each recess, wherein the first conductive patterns are connected with each other through the second conductive patterns. The dielectric layer is removed. The second conductive patterns between the first conductive patterns are removed.
摘要翻译：提供微电子机械系统结构及其制造方法。衬底具有多个导电区域。在基板上形成电介质层。在电介质层中形成多个开口和凹槽，其中开口暴露导电区域。凹槽位于开口之间。在电介质层上形成导电层，并且用导电层填充开口和凹部。导电层被图案化以在电介质层上形成多个第一导电图案的条带，并且在每个凹部的侧壁和底部上形成第二导电图案，其中第一导电图案通过第二导电图案彼此连接。去除电介质层。去除第一导电图案之间的第二导电图案。

4. 发明申请

US20110169106A1 MICRO ELECTRONIC MECHANICAL SYSTEM STRUCTURE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：微电子机械系统结构及其制造方法
公开(公告)号：US20110169106A1
公开(公告)日：2011-07-14
申请号：US12721546
申请日：2010-03-10
申请人： Tsai-Chiang Nieh , Tung-Ming Lai , Feng-Tsai Tsai
发明人： Tsai-Chiang Nieh , Tung-Ming Lai , Feng-Tsai Tsai
IPC分类号： H01L29/84 , H01L21/02
CPC分类号： B81C1/00944 , B81B3/0008 , B81C2203/0742
摘要： A micro electronic mechanical system structure and a manufacturing method thereof are provided. A substrate has a plurality of conductive regions is provided. A dielectric layer is formed on the substrate. A plurality of openings and recesses are formed in the dielectric layer, wherein the openings expose the conductive regions. The recesses are located between the openings. A conductive layer is formed on the dielectric layer and the openings and the recesses are filled with the conductive layer. The conductive layer is patterned to form a plurality of strips of the first conductive patterns on the dielectric layer and a second conductive pattern on the sidewall and the bottom of each recess, wherein the first conductive patterns are connected with each other through the second conductive patterns. The dielectric layer is removed. The second conductive patterns between the first conductive patterns are removed.
摘要翻译：提供微电子机械系统结构及其制造方法。衬底具有多个导电区域。在基板上形成电介质层。在电介质层中形成多个开口和凹槽，其中开口暴露导电区域。凹槽位于开口之间。在电介质层上形成导电层，并且用导电层填充开口和凹部。导电层被图案化以在电介质层上形成多个第一导电图案的条带，并且在每个凹部的侧壁和底部上形成第二导电图案，其中第一导电图案通过第二导电图案彼此连接。去除电介质层。去除第一导电图案之间的第二导电图案。

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