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    • 61. 发明授权
    • Spot welding apparatus
    • 点焊设备
    • US5530218A
    • 1996-06-25
    • US374234
    • 1995-01-18
    • Yoshio NakamuraShinichi KitaguchiYoshihiko Yamaguchi
    • Yoshio NakamuraShinichi KitaguchiYoshihiko Yamaguchi
    • B23K11/31B23K37/02
    • B23K11/314
    • In a spot welding apparatus in which a column (7) is stood on a base (5) provided with a worktable (3) for supporting work (W); and a welding arm (15) having an electrode (13) at a free end portion thereof is pivotally supported up and down at a lower portion of a support cylinder (11) hung from a support beam (9) supported by the column (7) horizontally, the spot welding apparatus comprises an arm supporting section (47) for supporting support members (49, 55, 53, 57) for pivotally supporting the welding arm (15), so as to be movable up and down relative to the support cylinder (11) and further urged upward; and an arm pressing section (37) for pressing a free end portion of the welding arm (15) downward against an urging force of the arm supporting section.
    • 在立柱(7)位于设置有用于支撑工件(W)的工作台(3)的基座(5)上的点焊装置中; 并且在其自由端部分具有电极(13)的焊接臂(15)在从支柱(7)支撑的支撑梁(9)悬挂的支撑筒(11)的下部处被上下可枢转地支撑 ),所述点焊装置包括用于支撑用于枢转地支撑所述焊接臂(15)的支撑构件(49,55,53,57)的臂支撑部(47),以便能够相对于所述支撑件上下移动 气缸(11)并进一步向上推动; 以及用于将所述焊接臂(15)的自由端部抵抗所述臂支撑部的作用力向下方向下压的臂按压部(37)。
    • 62. 发明授权
    • Grain oriented electrical steel sheet having high magnetic flux density
and ultra low iron loss and process for production the same
    • 具有高磁通密度和超低铁损的晶粒取向电工钢板及其制造方法相同
    • US5507883A
    • 1996-04-16
    • US257765
    • 1994-06-09
    • Osamu TanakaHiroaki MasuiHotaka HonmaKatsuro KurokiTsutomu HarataniYoichi MishimaMaremizu IshibashiYoshio Nakamura
    • Osamu TanakaHiroaki MasuiHotaka HonmaKatsuro KurokiTsutomu HarataniYoichi MishimaMaremizu IshibashiYoshio Nakamura
    • C21D8/12H01F1/147H01F1/04
    • C21D8/1283H01F1/14783C21D8/1255C21D8/1272
    • A grain oriented electrical steel sheet having no significant glass film and having a high magnetic flux density and an excellent iron loss property, comprising, in terms of by weight, 2.5 to 4.5% of Si, the steel sheet having, as oxides on its surface, a glass film comprising 0.6 g/m.sup.2 or less in total of forsterite and spinel composed of MgO, SiO.sub.2 and Al.sub.2 O.sub.3 and an insulating coating having a thickness of 6 .mu.m or less, the face tension imparted on the surface of the steel sheet by the coating being in the range of from 0.5 to 2.0 kg/mm.sup.2. In the final box annealing of the steel sheet after primary recrystallization annealing, use is made of an annealing separator comprising 100 parts by weight of MgO and, added thereto, 2 to 30 parts by weight of at least one member selected from the group consisting of chlorides, carbonates, nitrates, sulfates and sulfides of Li, K, Bi, Na, Ba, Ca, Mg, Zn, Fe, Zr, Sr, Sn, Al, etc., and the heating in the final box annealing is effected in an atmosphere comprising N.sub.2 and H.sub.2 with the nitrogen content being 30% or more at a heating rate of 20.degree. C./hr or less, and a seam or spotty flaw is imparted at an angle of 45.degree. to 90.degree. to the rolling direction of the steel sheet.
    • 一种不具有显着玻璃膜并且具有高磁通密度和优异的铁损特性的晶粒取向电工钢板,其中,按重量计包含2.5至4.5%的Si,该钢板在其表面上具有氧化物 ,由MgO,SiO 2和Al 2 O 3组成的镁橄榄石和尖晶石的总计为0.6g / m 2以下的玻璃膜和厚度为6μm以下的绝缘涂层,通过以下方式赋予钢板表面的表面张力 涂层在0.5至2.0kg / mm 2的范围内。 在一次再结晶退火后的钢板的最终退火中,使用包含100重量份MgO的退火分离剂,向其中加入2〜30重量份的选自以下的至少一种: Li,K,Bi,Na,Ba,Ca,Mg,Zn,Fe,Zr,Sr,Sn,Al等的氯化物,碳酸盐,硝酸盐,硫酸盐和硫化物,最终箱退火中的加热是 包含N 2和H 2的气氛,氮含量在20℃/小时以下的加热速率为30%以上,接缝或斑点缺陷与轧制方向成45度〜90度的角度 的钢板。
    • 63. 发明授权
    • Contact electrode structure for semiconductor device
    • 半导体器件接触电极结构
    • US5302855A
    • 1994-04-12
    • US757480
    • 1991-09-10
    • Shigeyuki MatsumotoMasaru SakamotoYoshio Nakamura
    • Shigeyuki MatsumotoMasaru SakamotoYoshio Nakamura
    • H01L21/285H01L21/768H01L23/485H01L23/532H01L23/48H01L29/44
    • H01L23/53223H01L21/28562H01L21/76877H01L23/485H01L2924/0002
    • A semiconductor device and a manufacture method for the semiconductor device, the method comprising the steps of forming an insulating film on the surface of a semiconductor substrate, forming contact holes in the insulating layer to expose the surface of the semiconductor substrate, selectively depositing a metal film, which contains aluminum as a main ingredient, on the exposed surface to form an electrodes in each the contact hole, and forming a wiring made of a second metal, which contains as a principal ingredient an element other than aluminum, on both the insulating layer and the electrode. Preferably, the upper surface of each electrode is substantially flat in a connecting portion between the electrode and the wiring, and a relationship of A.gtoreq.C is established where A is a length of one side of the electrode's upper surface and C is a width of the wiring in the connecting portion therebetween. The metal film is produced at a high deposition rate and a high throughput while ensuring good reliability and presenting superior film characteristics such as step coverage and electro migration.
    • 一种半导体器件的半导体器件和制造方法,所述方法包括以下步骤:在半导体衬底的表面上形成绝缘膜,在所述绝缘层中形成接触孔以暴露所述半导体衬底的表面,选择性地沉积金属 在暴露的表面上形成在每个接触孔中的电极的膜,并且形成由第二金属制成的布线,该第二金属作为主要成分包含除了铝之外的元素,在绝缘 层和电极。 优选地,每个电极的上表面在电极和布线之间的连接部分中基本平坦,并且建立A> = C的关系,其中A是电极上表面的一侧的长度,C是宽度 在其间的连接部分中的布线。 金属膜以高沉积速率和高产量生产,同时确保良好的可靠性并呈现出优异的薄膜特性,如台阶覆盖和电迁移。