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    • 61. 发明授权
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US07768077B2
    • 2010-08-03
    • US12631891
    • 2009-12-07
    • Yoshinori TsuchiyaMasato KoyamaMasahiko Yoshiki
    • Yoshinori TsuchiyaMasato KoyamaMasahiko Yoshiki
    • H01L27/092
    • H01L21/823842H01L21/28079H01L21/28097H01L21/823835H01L21/823857H01L27/092H01L29/495H01L29/4975H01L29/517H01L29/665
    • A semiconductor device includes: an n-channel MIS transistor and a p-channel MIS transistor. An n-channel MIS transistor includes: a first gate insulating film having an amorphous layer or an epitaxial layer formed on a p-type semiconductor region between a first source/drain regions; and a first gate electrode having a stack structure formed with a first metal layer and a first compound layer. The first metal layer is formed on the first gate insulating film and made of a first metal having a work function of 4.3 eV or smaller, and the first compound layer is formed on the first metal layer and contains a compound of a second metal and a IV-group semiconductor. The second metal is different from the first metal. A p-channel MIS transistor includes a second gate electrode having a second compound layer containing a compound of the same composition as the first compound layer.
    • 半导体器件包括:n沟道MIS晶体管和p沟道MIS晶体管。 n沟道MIS晶体管包括:具有在第一源极/漏极区之间的p型半导体区域上形成的非晶层或外延层的第一栅极绝缘膜; 以及具有形成有第一金属层和第一化合物层的堆叠结构的第一栅电极。 第一金属层形成在第一栅极绝缘膜上,由功函数为4.3eV以下的第一金属构成,第一金属层形成在第一金属层上,并且含有第二金属和 IV族半导体。 第二种金属与第一种金属不同。 P沟道MIS晶体管包括具有第二化合物层的第二栅电极,第二化合物层含有与第一化合物层相同组成的化合物。
    • 62. 发明授权
    • Semiconductor device
    • 半导体器件
    • US07608896B2
    • 2009-10-27
    • US11857197
    • 2007-09-18
    • Reika IchiharaYoshinori TsuchiyaHiroki TanakaMasato Koyama
    • Reika IchiharaYoshinori TsuchiyaHiroki TanakaMasato Koyama
    • H01L29/76H01L29/94H01L31/062H01L31/113H01L31/119H01L23/62
    • H01L21/823842H01L21/823864
    • A semiconductor device has an n-channel MIS transistor and a p-channel MIS transistor on a substrate. The n-channel MIS transistor includes a p-type semiconductor region formed on the substrate, a lower layer gate electrode which is formed via a gate insulating film above the p-type semiconductor region and which is one monolayer or more and 3 nm or less in thickness, and an upper layer gate electrode which is formed on the lower layer gate electrode, whose average electronegativity is 0.1 or more smaller than the average electronegativity of the lower layer gate electrode. The p-channel MIS transistor includes an n-type semiconductor region formed on the substrate and a gate electrode which is formed via a gate insulating film above the n-type semiconductor region and is made of the same metal material as that of the upper layer gate electrode.
    • 半导体器件在衬底上具有n沟道MIS晶体管和p沟道MIS晶体管。 n沟道MIS晶体管包括形成在基板上的p型半导体区域,通过p型半导体区域上方的栅极绝缘膜形成并且为单层以上且3nm以下的下层栅电极 以及形成在下层栅电极上的上层栅电极,其平均电负性比下层栅电极的平均电负性小0.1或更小。 p沟道MIS晶体管包括形成在衬底上的n型半导体区域和通过n型半导体区域上方的栅极绝缘膜形成并由与上层相同的金属材料制成的栅电极 栅电极。
    • 63. 发明授权
    • Semiconductor device
    • 半导体器件
    • US07576397B2
    • 2009-08-18
    • US11841757
    • 2007-08-20
    • Reika IchiharaYoshinori TsuchiyaMasato KoyamaAkira Nishiyama
    • Reika IchiharaYoshinori TsuchiyaMasato KoyamaAkira Nishiyama
    • H01L27/092
    • H01L21/823857H01L21/823462
    • A semiconductor device includes a semiconductor substrate, an nMISFET formed on the substrate, the nMISFET including a first dielectric formed on the substrate and a first metal gate electrode formed on the first dielectric and formed of one metal element selected from Ti, Zr, Hf, Ta, Sc, Y, a lanthanoide and actinide series and of one selected from boride, silicide and germanide compounds of the one metal element, and a pMISFET formed on the substrate, the pMISFET including a second dielectric formed on the substrate and a second metal gate electrode formed on the second dielectric and made of the same material as that of the first metal gate electrode, at least a portion of the second dielectric facing the second metal gate electrode being made of an insulating material different from that of at least a portion of the first dielectric facing the first metal gate electrode.
    • 半导体器件包括半导体衬底,形成在衬底上的nMISFET,nMISFET包括形成在衬底上的第一电介质和形成在第一电介质上的第一金属栅极,并由选自Ti,Zr,Hf, Ta,Sc,Y,镧系元素和锕系和选自所述一种金属元素的硼化物,硅化物和锗化合物的一种,以及形成在所述衬底上的pMISFET,所述pMISFET包括形成在所述衬底上的第二电介质和第二金属 栅电极形成在第二电介质上并由与第一金属栅电极相同的材料制成,第二电介质面向第二金属栅电极的至少一部分由绝缘材料制成,绝缘材料与至少一部分 的第一电介质面向第一金属栅电极。
    • 67. 发明申请
    • Semiconductor Device
    • 半导体器件
    • US20080176368A1
    • 2008-07-24
    • US11841817
    • 2007-08-20
    • Reika IchiharaYoshinori TsuchiyaMasato KoyamaAkira Nishiyama
    • Reika IchiharaYoshinori TsuchiyaMasato KoyamaAkira Nishiyama
    • H01L21/8238
    • H01L21/823857H01L21/823462
    • A semiconductor device includes a semiconductor substrate, an nMISFET formed on the substrate, the nMISFET including a first dielectric formed on the substrate and a first metal gate electrode formed on the first dielectric and formed of one metal element selected from Ti, Zr, Hf, Ta, Sc, Y, a lanthanoide and actinide series and of one selected from boride, silicide and germanide compounds of the one metal element, and a pMISFET formed on the substrate, the pMISFET including a second dielectric formed on the substrate and a second metal gate electrode formed on the second dielectric and made of the same material as that of the first metal gate electrode, at least a portion of the second dielectric facing the second metal gate electrode being made of an insulating material different from that of at least a portion of the first dielectric facing the first metal gate electrode.
    • 半导体器件包括半导体衬底,形成在衬底上的nMISFET,nMISFET包括形成在衬底上的第一电介质和形成在第一电介质上的第一金属栅极,并由选自Ti,Zr,Hf, Ta,Sc,Y,镧系元素和锕系和选自所述一种金属元素的硼化物,硅化物和锗化合物的一种,以及形成在所述衬底上的pMISFET,所述pMISFET包括形成在所述衬底上的第二电介质和第二金属 栅电极形成在第二电介质上并由与第一金属栅电极相同的材料制成,第二电介质面向第二金属栅电极的至少一部分由绝缘材料制成,绝缘材料与至少一部分 的第一电介质面向第一金属栅电极。