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    • 69. 发明授权
    • System for aligning rectangular wafers
    • 矩形晶圆对齐系统
    • US06195619B1
    • 2001-02-27
    • US09363159
    • 1999-07-28
    • Jie Ren
    • Jie Ren
    • G01R31265
    • G03F9/7011G01R31/01G03F7/7075G03F7/70791H01L21/681Y10S414/136
    • A system is provided for determining an eccentricity vector &egr; which defines the magnitude and direction of an initial placement displaced from a desired location of a centroid O of a right quadrilateral semiconductor wafer which may be clear or opaque. With an initial point of reference desirably established on its peripheral edge for detection by an edge sensor, the wafer is rotated about a point P and a curve defining the profile of the peripheral edge is obtained. The eccentricity vector is computed from the sensed positions of the corners of the wafer and has a magnitude representative of the spatial dislocation of the centroid O relative to the point P and having an orientation &phgr; representative of the angle subtended by a first line connecting the point P and the centroid O relative to a second line connecting opposite corners of the wafer. As processing proceeds, the wafer is inserted into an aligner station, then repositioned from an initial position to a desired position, then advanced seriatim into a plurality of processing stations while maintaining the desired position previously attained. The aligner and the processing stations may be evacuated. The wafer may be post positioned to a new desired position by rotating the wafer until a side thereof is generally parallel to an internal wall of the aligner station, enabling an end effector of a robot arm to readily lift the wafer from its support and advance it into the processing stations while maintaining the desired position previously attained.
    • 提供了一种用于确定偏心矢量epsi的系统,该偏心矢量定义从可能是透明或不透明的右四边形半导体晶片的质心O的期望位置偏移的初始位置的大小和方向。 为了最初的参考点在其外围边缘上建立用于由边缘传感器检测的边缘,晶片绕点P旋转,并且获得限定外围边缘轮廓的曲线。 从感测到的晶片角部位置计算出偏心矢量,并且具有表示质心O相对于点P的空间位错的大小,并且具有代表由连接点 P和质心O相对于连接晶片的相对角的第二线。 随着处理的进行,将晶片插入到对准台中,然后从初始位置重新定位到期望的位置,然后在保持先前达到的期望位置的同时将其前进到多个处理站。 对准器和加工站可以被排空。 晶片可以通过旋转晶片而被定位到新的期望位置,直到其一侧大致平行于对准器台的内壁,使得机器人手臂的末端执行器能够容易地将晶片从其支撑件提升并推进 同时保持先前达到的期望位置。