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    • 61. 发明授权
    • System and method for controlling power to resources based on historical utilization data
    • 基于历史使用数据控制资源的系统和方法
    • US08041967B2
    • 2011-10-18
    • US11058554
    • 2005-02-15
    • Christian L. BeladyTom L. Vaden
    • Christian L. BeladyTom L. Vaden
    • G06F1/26G06F1/32
    • G06F1/3203G06F1/325G06F1/3275G06F1/3287Y02D10/14Y02D10/171
    • A method comprises collecting utilization data for a resource, and predicting by a power management system, based on the collected utilization data, future utilization of the resource. The method further comprises controlling, by the power management system, power to the resource, based at least in part on the predicted future utilization of the resource. In one embodiment, the utilization data is collected for a plurality of resources that are operable to perform tasks, and the method further comprises determining, by the power management system, how many of the resources are needed to provide a desired capacity for servicing the predicted future utilization of the resources for performing the tasks. The method further comprises configuring, by the power management system, ones of the resources exceeding the determined number of resources needed to provide the desired capacity in a reduced power-consumption mode.
    • 一种方法包括收集资源的利用数据,以及由电力管理系统基于收集的利用数据预测资源的未来利用。 该方法还包括至少部分地基于资源的预测的未来利用来控制电力管理系统对资源的功率。 在一个实施例中,针对可操作以执行任务的多个资源收集利用数据,并且该方法还包括由电力管理系统确定需要多少资源以提供用于维护预测的所需能力 未来利用资源执行任务。 该方法还包括通过电力管理系统配置超过确定的资源数量中的一个资源,以在降低的功耗模式中提供期望的容量所需的资源。
    • 63. 发明授权
    • Redundant upgradeable, modular data center cooling apparatus
    • 冗余可升级,模块化数据中心冷却设备
    • US07810341B2
    • 2010-10-12
    • US11273274
    • 2005-11-14
    • Christian L. Belady
    • Christian L. Belady
    • F25D23/12
    • F24F3/06H05K7/20745H05K7/2079
    • A data center is configured in a room using alternating rows of racks containing heat-generating electronic devices and air conditioners or liquid conditioners. Chilled fluid, such as water or a refrigerant, for the air conditioners or liquid conditioners is supplied through redundant plumbing comprising first and second supply and return pipes below a raised floor. Attached to this redundant plumbing are standard fluid couplings configured to couple to either air conditioners or liquid conditioners. The air conditioners and liquid conditioners use the same chilled fluid so that they may share the redundant plumbing and continually receive chilled fluid in the event of the failure of one of the chilled fluid supplies.
    • 数据中心配置在房间内,使用交替排列的发热电子设备和空调或液体调节器。 用于空调或液体调节器的冷冻液体如水或制冷剂通过冗余管道供应,其包括位于高架地板下方的第一和第二供应和返回管道。 连接到这个冗余的管道是配置为耦合到空调或液体调节器的标准流体联轴器。 空调和液体调节器使用相同的冷冻液体,使得它们可以共享冗余的管道,并且在冷却液供应中的一个发生故障的情况下不断接收冷冻液体。
    • 64. 发明授权
    • System for distributing AC power within an equipment rack
    • 在设备机架内分配交流电源的系统
    • US07646109B2
    • 2010-01-12
    • US11179920
    • 2005-07-12
    • Christian L. BeladyBradley D. Winick
    • Christian L. BeladyBradley D. Winick
    • H02J3/26
    • H02G3/285H02G3/00H05K7/1492Y10T307/266Y10T307/273
    • A system comprises a first equipment rack, a power distribution unit (PDU) and a plurality of rack connectors. The PDU is mounted in the first equipment rack and is configured to provide alternating current (AC) power that comprises a plurality of phases. The plurality of rack connectors mount within the first equipment rack, and each of the plurality of rack connectors couples to the PDU and provides access to the plurality of phases. Each rack connector is usable to accommodate a first device installed in the equipment rack that uses one or more of the plurality of phases, and is also usable to accommodate a second device installed in the equipment rack that uses one or more of the plurality of phases, thereby permitting each rack connector to couple to any of a plurality of devices, and permitting each of the plurality of devices to use any number of the plurality of phases. The number of phases used by the first device differs from the number of phases used by the second device.
    • 系统包括第一设备机架,配电单元(PDU)和多个机架连接器。 PDU安装在第一设备机架中并且被配置为提供包括多个相位的交流(AC)功率。 多个机架连接器安装在第一设备机架内,并且多个机架连接器中的每一个连接到PDU并提供对多个阶段的访问。 每个机架连接器可用于容纳安装在设备机架中的第一设备,其使用多个阶段中的一个或多个阶段,并且还可用于容纳安装在设备机架中的第二设备,该设备机架使用多个阶段中的一个或多个阶段 从而允许每个机架连接器耦合到多个设备中的任一个,并且允许多个设备中的每一个使用多个相位中的任意数量。 第一设备使用的相位数不同于第二设备使用的相位数。
    • 68. 发明授权
    • Method of cooling semiconductor die using microchannel thermosyphon
    • 使用微通道热虹吸管冷却半导体晶片的方法
    • US07002801B2
    • 2006-02-21
    • US10687382
    • 2003-10-16
    • Roy ZeighamiChristian L. Belady
    • Roy ZeighamiChristian L. Belady
    • H05K7/20
    • F28D15/0266H01L23/427H01L2924/0002H01L2924/3011H01L2924/00
    • The invention provides for cooling a semiconductor die. The die has plurality of micro-channels. A condenser is in fluid communication with the micro-channels such that the die heats vaporizes fluid at the die to force fluid towards the condenser, and such that gravity pressurizes cooler condenser fluid towards the die. A semiconductor plate such as glass may couple with the die to seal the micro-channels and to form a plurality of fluid conduits for the fluid. Generally, the fluid is alcohol. A first fluid conduit and a second fluid conduit couple between the die's micro-channels and the condenser to form a closed loop thermosyphon system. The condenser is preferably constructed and arranged above the die such that gravity forces cooler fluid to the micro-channels. The micro-channels may be shaped for preferential fluid flow along one direction of the die. The condenser may contain fins to enhance heat transfer to air adjacent the condenser.
    • 本发明提供冷却半导体管芯。 模具具有多个微通道。 冷凝器与微通道流体连通,使得模具加热使模具处的流体蒸发,以迫使流体朝向冷凝器,并且使得重力将较冷的冷凝器流体朝向模具加压。 诸如玻璃之类的半导体板可以与模具耦合以密封微通道并形成用于流体的多个流体导管。 通常,流体是酒精。 第一流体导管和第二流体导管在管芯的微通道和冷凝器之间耦合以形成闭环热虹吸系统。 冷凝器优选地构造和布置在模具上方,使得重力将冷却器流体流向微通道。 微通道可以被成形为沿着模具的一个方向的优先流体流动。 冷凝器可以包含翅片以增强热量传递到靠近冷凝器的空气。
    • 70. 发明授权
    • Loop thermosyphon using microchannel etched semiconductor die as evaporator
    • 使用微通道蚀刻的半导体管芯作为蒸发器的循环热虹吸管
    • US06704200B2
    • 2004-03-09
    • US10074885
    • 2002-02-12
    • Roy ZeighamiChristian L. Belady
    • Roy ZeighamiChristian L. Belady
    • H05K720
    • F28D15/0266H01L23/427H01L2924/0002H01L2924/3011H01L2924/00
    • The invention provides for cooling a semiconductor die. The die has plurality of micro-channels. A condenser is in fluid communication with the micro-channels such that the die heats vaporizes fluid at the die to force fluid towards the condenser, and such that gravity pressurizes cooler condenser fluid towards the die. A semiconductor plate such as glass may couple with the die to seal the micro-channels and to form a plurality of fluid conduits for the fluid. Generally, the fluid is alcohol. A first fluid conduit and a second fluid conduit couple between the die's micro-channels and the condenser to form a closed loop thermosyphon system. The condenser is preferably constructed and arranged above the die such that gravity forces cooler fluid to the micro-channels. The micro-channels may be shaped for preferential fluid flow along one direction of the die. The condenser may contain fins to enhance heat transfer to air adjacent the condenser.
    • 本发明提供冷却半导体管芯。 模具具有多个微通道。 冷凝器与微通道流体连通,使得模具加热使模具处的流体蒸发,以迫使流体朝向冷凝器,并且使得重力将较冷的冷凝器流体朝向模具加压。 诸如玻璃之类的半导体板可以与模具耦合以密封微通道并形成用于流体的多个流体导管。 通常,流体是酒精。 第一流体导管和第二流体导管在管芯的微通道和冷凝器之间耦合以形成闭环热虹吸系统。 冷凝器优选地构造和布置在模具上方,使得重力将冷却器流体流向微通道。 微通道可以被成形为沿着模具的一个方向的优先流体流动。 冷凝器可以包含翅片以增强热量传递到靠近冷凝器的空气。