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    • 63. 发明申请
    • METHOD OF FORMING GATE CONDUCTOR STRUCTURES
    • 形成栅极导体结构的方法
    • US20120288802A1
    • 2012-11-15
    • US13103108
    • 2011-05-09
    • Chang-Ming WuYi-Nan ChenHsien-Wen Liu
    • Chang-Ming WuYi-Nan ChenHsien-Wen Liu
    • G03F7/20
    • H01L21/32139H01L21/28123H01L21/28132
    • A method of forming gate conductor structures. A substrate having thereon a gate electrode layer is provided. A multi-layer hard mask is formed overlying the gate electrode layer. The multi-layer hard mask comprises a first hard mask, a second hard mask, and a third hard mask. A photoresist pattern is formed on the multi-layer hard mask. A first etching process is performed to etch the third hard mask, using the photoresist pattern as a first etch resist, thereby forming a patterned third hard mask. A second etching process is performed to etch the second hard mask and the first hard mask, using the patterned third hard mask as a second etch resist, thereby forming a patterned first hard mask. A third etching process is performed to etch a layer of the gate electrode layer, using the patterned first hard mask as a third etch resist.
    • 一种形成栅极导体结构的方法。 提供了具有栅电极层的基板。 形成覆盖栅电极层的多层硬掩模。 多层硬掩模包括第一硬掩模,第二硬掩模和第三硬掩模。 在多层硬掩模上形成光刻胶图形。 执行第一蚀刻工艺以蚀刻第三硬掩模,使用光致抗蚀剂图案作为第一蚀刻抗蚀剂,由此形成图案化的第三硬掩模。 执行第二蚀刻工艺以蚀刻第二硬掩模和第一硬掩模,使用图案化的第三硬掩模作为第二蚀刻抗蚀剂,由此形成图案化的第一硬掩模。 执行第三蚀刻工艺以蚀刻栅极电极层的层,使用图案化的第一硬掩模作为第三蚀刻抗蚀剂。
    • 67. 发明申请
    • TRANSISTOR WITH BURIED FINS
    • 带有隐形金属的晶体管
    • US20120256257A1
    • 2012-10-11
    • US13081509
    • 2011-04-07
    • Tieh-Chiang WuYi-Nan ChenHsien-Wen Liu
    • Tieh-Chiang WuYi-Nan ChenHsien-Wen Liu
    • H01L29/772
    • H01L27/10879H01L27/10826H01L29/1037H01L29/4236H01L29/42376H01L29/78
    • The present invention disclosed a recessed gate transistor with buried fins. The recessed gate transistor with buried fins is disposed in an active region on a semiconductor substrate. Two isolation regions disposed in the semiconductor substrate, and sandwich the active region. A gate structure is disposed in the semiconductor substrate, wherein the gate structure includes: an upper part and a lower part. The upper part is disposed in the active region and a lower part having a front fin disposed in one of the two isolation regions, at least one middle fin disposed in the active region, and a last fin disposed in the other one of the two isolation regions, wherein the front fin are both elliptic cylindrical.
    • 本发明公开了一种具有埋地鳍片的凹陷式栅极晶体管。 具有埋入散热片的嵌入式栅极晶体管设置在半导体衬底上的有源区中。 两个隔离区域设置在半导体衬底中并夹持有源区。 栅极结构设置在半导体衬底中,其中栅极结构包括:上部和下部。 上部设置在有源区域中,下部具有设置在两个隔离区域之一中的前翅片,设置在有源区域中的至少一个中间翅片,以及设置在两个隔离物中的另一个中的最后一个翅片 区域,其中前鳍都是椭圆柱形。
    • 69. 发明申请
    • POWER DEVICE WITH TRENCHED GATE STRUCTURE AND METHOD OF FABRICATING THE SAME
    • 具有开关门结构的电力装置及其制造方法
    • US20120256230A1
    • 2012-10-11
    • US13081500
    • 2011-04-07
    • Tieh-Chiang WuYi-Nan ChenHsien-Wen Liu
    • Tieh-Chiang WuYi-Nan ChenHsien-Wen Liu
    • H01L29/739H01L21/331
    • H01L29/7397H01L29/4236H01L29/66348
    • A power device with trenched gate structure, includes: a substrate having a first face and a second face opposing to the first face, a body region of a first conductivity type disposed in the substrate, a base region of a second conductivity type disposed in the body region, a cathode region of the first conductivity type disposed in the base region, an anode region of the second conductivity type disposed in the substrate at the second face a trench disposed in the substrate and extending from the first face into the body region, and the cathode region encompassing the trench, wherein the trench has a wavelike sidewall, a gate structure disposed in the trench and an accumulation region disposed in the body region and along the wavelike sidewall. The wavelike sidewall can increase the base current of the bipolar transistor and increase the performance of the IGBT.
    • 具有沟槽栅极结构的功率器件包括:具有第一面和与第一面相对的第二面的衬底,设置在衬底中的第一导电类型的主体区域,设置在第二导电类型的基极区域 设置在所述基底区域中的所述第一导电类型的阴极区域,所述第二导电类型的阳极区域设置在所述基板的所述第二面处,所述沟槽设置在所述基板中并且从所述第一面延伸到所述主体区域中, 以及包围所述沟槽的阴极区域,其中所述沟槽具有波状侧壁,设置在所述沟槽中的栅极结构以及设置在所述体区中并沿着所述波浪形侧壁的堆积区域。 波形侧壁可以增加双极晶体管的基极电流并增加IGBT的性能。
    • 70. 发明授权
    • Antifuse element for integrated circuit device
    • 集成电路器件用防尘元件
    • US08278732B1
    • 2012-10-02
    • US13096995
    • 2011-04-28
    • Jar-Ming HoYi-Nan ChenHsien-Wen Liu
    • Jar-Ming HoYi-Nan ChenHsien-Wen Liu
    • H01L23/52
    • H01L23/5252H01L2924/0002H01L2924/00
    • An antifuse element for an integrated circuit is provided, including a conductive region formed in a semiconductor substrate, extending along a first direction; a dielectric layer formed on a portion of the conductive region; a first conductive plug formed on the dielectric layer; a second conductive plug formed on another portion of the conductive region; and a first conductive member formed over the first and second conductive plugs, extending along a second direction perpendicular to the first direction; and a second conductive member formed over the second conductive plug extending along the second direction, wherein the first conductive member intersects with the conductive region, having a first overlapping area therebetween, and the dielectric layer and the conductive region have a second overlapping area therebetween, and a ratio between the first overlapping area and the second overlapping area is about 1.5:1 to 3:1.
    • 提供了一种用于集成电路的反熔丝元件,包括形成在半导体衬底中的导电区域,沿着第一方向延伸; 形成在所述导电区域的一部分上的电介质层; 形成在所述电介质层上的第一导电插塞; 形成在所述导电区域的另一部分上的第二导电插塞; 以及第一导电构件,形成在所述第一和第二导电插塞上,沿着垂直于所述第一方向的第二方向延伸; 以及形成在所述第二导电插塞上的第二导电构件,所述第二导电插塞沿着所述第二方向延伸,其中所述第一导电构件与所述导电区域相交,所述导电区域之间具有第一重叠区域,并且所述介电层和所述导电区域之间具有第二重叠区域 并且第一重叠区域和第二重叠区域之间的比率为约1.5:1至3:1。