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    • 62. 发明申请
    • Method of fabricating light-emitting device and light-emitting device
    • 制造发光器件和发光器件的方法
    • US20050285127A1
    • 2005-12-29
    • US10523636
    • 2003-08-06
    • Nobuhiko NotoMasato YamadaShinji NozakiKazuo UchidaHiroshi Morisaki
    • Nobuhiko NotoMasato YamadaShinji NozakiKazuo UchidaHiroshi Morisaki
    • H01L33/10H01L33/30H01L33/36H01L29/20H01L21/00
    • H01L33/42H01L33/30
    • A light-emitting device 100 has ITO transparent electrode layers 8, 10 used for applying drive voltage for light-emission to a light-emitting layer section 24, and is designed so as to extract light from the light-emitting layer section 24 through the ITO transparent electrode layers 8, 10. The light-emitting device 100 also has contact layers composed of In-containing GaAs, formed between the light-emitting layer section 24 and the ITO transparent electrode layers 8, 10, so as to contact with the ITO transparent electrode layers respectively. The contact layers 7, 9 are formed by annealing a stack 13 obtained by forming GaAs layers 7′, 9′ on the light-emitting layer section, and by forming the ITO transparent electrode layers 8, 10 so as to contact with the GaAs layers 7′, 9′, to thereby allow In to diffuse from the ITO transparent electrode layers 8, 10 into the GaAs layers 7′, 9′. This provides a method of fabricating a light-emitting device, in which the ITO transparent electrode layers as the light-emission drive electrodes are bonded as being underlain by the contact layers, to thereby reduce contact resistance of these electrodes, and to thereby make the contact layers less susceptible to difference in the lattice constants with those of the light-emitting layer section during the formation thereof.
    • 发光装置100具有用于向发光层部分24施加用于发光的驱动电压的ITO透明电极层8,10,并且被设计成从发光层部分24通过 ITO透明电极层8,10。 发光装置100还具有形成在发光层部24和ITO透明电极层8,10之间的含有In的GaAs的接触层,以分别与ITO透明电极层接触。 接触层7,9通过在发光层部分上形成GaAs层7',9'而获得的叠层13退火并通过形成ITO透明电极层8,10而与GaAs层接触而形成 7',9',从而允许In从ITO透明电极层8,10扩散到GaAs层7',9'中。 这提供了一种制造发光器件的方法,其中作为发光驱动电极的ITO透明电极层被接触层接合,从而降低这些电极的接触电阻,从而使 接触层在其形成期间不太容易发生与发光层部分的晶格常数的差异。
    • 64. 发明授权
    • Algainp light-emitting device
    • 阿根廷发光装置
    • US5739553A
    • 1998-04-14
    • US577961
    • 1995-12-26
    • Nobuhiko NotoKeizo AdomiTakao Takenaka
    • Nobuhiko NotoKeizo AdomiTakao Takenaka
    • H01L33/14H01L33/30H01L33/00
    • H01L33/30H01L33/14
    • The present invention provides an AlGaInP light-emitting device with a longer life and higher reliability. The AlGaInP light-emitting device comprises an n-type (Al.sub.0.7 Ga.sub.0.3).sub.0.51 In.sub.0.49 P cladding layer (about 1 .mu.m in thickness), an (Al.sub.0.15 Ga.sub.0.85).sub.0.51 In.sub.0.49 P active layer (about 0.6 .mu.m in thickness), a p-type (Al.sub.0.7 Ga.sub.0.3).sub.0.51 In.sub.0.49 P cladding layer (about 1 .mu.m in thickness), and a p-type current-spreading layer composed of either a p-type Al.sub.0.7 Ga.sub.0.3 As layer (about 3 .mu.m in thickness) or a p-type Al.sub.0.7 Ga.sub.0.3 As.sub.0.97 P.sub.0.03 layer (about 3 .mu.m in thickness) and a p-type GaAs.sub.0.5 P.sub.0.5 layer (about 7 .mu.m in thickness), in sequence formed on an n-type GaAs substrate, and further an upper surface electrode mounted on the p-type GaAs.sub.0.5 P.sub.0.5 layer and a lower surface electrode mounted on the lower surface of the n-type GaAs substrate.
    • 本发明提供一种具有更长寿命和更高可靠性的AlGaInP发光器件。 AlGaInP发光器件包括n型(Al0.7Ga0.3)0.51In0.49P包层(厚度约1μm),(Al0.15Ga0.85)0.51In0.49P有源层(约0.6 厚度为1μm),p型(Al0.7Ga0.3)0.51In0.49P包层(厚度约1μm)以及由p型Al0构成的p型电流扩展层。 (厚约3μm)或p型Al0.7Ga0.3As0.97P0.03层(约3μm厚)和p型GaAs0.5P0.5层(约7μm) m),依次形成在n型GaAs衬底上,另外安装在p型GaAs0.5P0.5层上的上表面电极和安装在n型GaAs的下表面上的下表面电极 基质。
    • 65. 发明授权
    • AlGaInP light emitting device
    • AlGaInP发光器件
    • US5444269A
    • 1995-08-22
    • US251370
    • 1994-05-31
    • Keizo AdomiNobuhiko NotoTakao Takenaka
    • Keizo AdomiNobuhiko NotoTakao Takenaka
    • H01L33/14H01L33/30H01L33/00
    • H01L33/14
    • An AlGaInP double heterojunction structure or an AlGaInP single heterojunction structure is formed on a first conductivity-type GaAs substrate, and then a layer made of a second conductivity-type Al.sub.w Ga.sub.1-w As.sub.1-v P.sub.v mixed crystal (Al.sub.0.7 Ga.sub.0.3 As.sub.0.97 P.sub.0.03, for example) which has the bandgap energy larger than the energy of photon emitted from the active layer of said light emitting layer portion, and has good lattice-matching with (Al.sub.B Ga.sub.1-B).sub.0.51 In.sub.0.49 P mixed crystal (layer) constituting said light emitting layer portion, is formed as a current spreading layer on top of said light emitting layer portion. Here, w and v are in the range of 0.45.ltoreq.w
    • 在第一导电型GaAs衬底上形成AlGaInP双异质结结构或AlGaInP单异质结结构,然后形成由第二导电型AlwGa1-wAs1-vPv混晶(Al0.7Ga0.3As0.97P0.03 具有比从所述发光层部分的有源层发射的光子能量大的带隙能量,并且与构成所述发光层部分的(AlBGa1-B)0.51In0.49P混晶(层)具有良好的晶格匹配 发光层部分形成为在所述发光层部分的顶部上的电流扩散层。 这里,w和v分别在0.45