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61. 发明申请

US20050118935A1 Substrate holding apparatus 有权
标题翻译：基板保持装置
公开(公告)号：US20050118935A1
公开(公告)日：2005-06-02
申请号：US11028629
申请日：2005-01-05
申请人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
发明人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
IPC分类号： B24B37/005 , B24B37/04 , B24B37/30 , B24B41/06 , H01L21/304 , B24B1/00
CPC分类号： B24B37/30 , B24B41/061
摘要： The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.
摘要翻译：本发明涉及一种用于保持待抛光的基板并将基板压靠在抛光表面上的基板保持装置。基板保持装置包括用于保持基板的顶环体，用于与基板接触的弹性垫，以及用于支撑弹性垫的支撑构件。基板保持装置还包括安装在支撑构件的下表面上并设置在由弹性垫和支撑构件形成的空间中的接触构件。接触构件具有用于与弹性垫接触的弹性膜。第一压力室限定在接触构件中，并且第二压力室限定在接触构件的外部。基板保持装置还包括用于独立地向第一压力室和第二压力室供应流体或产生真空的流体源。

62. 发明授权

US06878044B2 Polishing apparatus 有权
公开(公告)号：US06878044B2
公开(公告)日：2005-04-12
申请号：US10750823
申请日：2004-01-05
申请人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
发明人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
IPC分类号： B24B37/04 , H01L21/306 , B24B7/00
CPC分类号： B24B37/345 , B24B37/042 , H01L21/30625
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

63. 发明申请

US20050064703A1 Substrate processing method 有权
标题翻译：基板加工方法
公开(公告)号：US20050064703A1
公开(公告)日：2005-03-24
申请号：US10976040
申请日：2004-10-29
申请人： Fumio Kondo , Koji Mishima , Akira Tanaka , Yoko Suzuki , Tetsuji Togawa , Hiroaki Inoue
发明人： Fumio Kondo , Koji Mishima , Akira Tanaka , Yoko Suzuki , Tetsuji Togawa , Hiroaki Inoue
IPC分类号： B65G49/07 , B24B37/04 , B24B49/16 , C23C18/16 , C25D5/00 , C25D5/50 , C25D7/12 , H01L21/00 , H01L21/02 , H01L21/288 , H01L21/304 , H01L21/3205 , H01L21/321 , H01L21/673 , H01L21/677 , H01L21/768 , H01L23/52 , H01L21/4763
CPC分类号： H01L21/67161 , B24B37/005 , B24B37/042 , B24B37/245 , B24B37/345 , B24B41/061 , B24B49/16 , C23C18/1632 , C23C18/1653 , C25D7/123 , H01L21/02074 , H01L21/02087 , H01L21/0209 , H01L21/288 , H01L21/2885 , H01L21/3212 , H01L21/67167 , H01L21/67173 , H01L21/67184 , H01L21/67219 , H01L21/6723 , H01L21/67393 , H01L21/67396 , H01L21/67772 , H01L21/7684 , H01L21/76843 , H01L21/76849 , H01L21/76864 , H01L21/76873 , H01L21/76874 , H01L21/76877
摘要： A substrate processing method comprising steps for forming a copper film on a surface of a substrate. These steps includes the step of filling a first metal in the trenches so as to form a plated film of the first metal on an entire surface of the substrate by electroplating, wherein the electromagnetic field is adjusted by the virtual anode so that differences of thickness of the plated film between the central portion and the peripheral portion of the substrate being minimized, and polishing and removing the plated film by pressing the substrate to the polishing surface, wherein the pressures pressing the substrate to the polishing surface at a central portion and a peripheral portion are adjusted.
摘要翻译：一种基板处理方法，包括在基板的表面上形成铜膜的步骤。这些步骤包括在沟槽中填充第一金属以便通过电镀在基板的整个表面上形成第一金属的镀膜的步骤，其中电磁场由虚拟阳极调节，使得厚度差异基板的中央部分和周边部分之间的镀膜最小化，并且通过将基板压在抛光表面上来研磨和去除镀膜，其中将基板压在抛光表面上的压力在中心部分和周边部分进行调整。

64. 发明授权

US06852019B2 Substrate holding apparatus 有权
公开(公告)号：US06852019B2
公开(公告)日：2005-02-08
申请号：US09973842
申请日：2001-10-11
申请人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
发明人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
IPC分类号： B24B37/005 , B24B37/04 , B24B37/30 , B24B41/06 , H01L21/304 , B24B7/22
CPC分类号： B24B37/30 , B24B41/061
摘要： The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.

65. 发明授权

US06558226B1 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US06558226B1
公开(公告)日：2003-05-06
申请号：US09643882
申请日：2000-08-23
申请人： Nobuyuki Takada , Tetsuji Togawa
发明人： Nobuyuki Takada , Tetsuji Togawa
IPC分类号： B24B500
CPC分类号： B24B37/105 , B24B53/017
摘要： There is disclosed a polishing apparatus comprising: a polishing table having a first axis and a counterweight provided on the polishing table. The polishing table is adapted to be subjected to a circular orbital motion in which the first axis of the polishing table is rotated about an orbit center axis while the orientation of the polishing table is kept substantially constant. The counterweight cancels a centrifugal force generated by the circular orbital motion of the polishing table.
摘要翻译：公开了一种抛光装置，包括：抛光台，其具有设置在抛光台上的第一轴和配重。抛光台适于进行圆周轨道运动，其中抛光台的第一轴线围绕轨道中心轴线旋转，同时抛光台的取向基本保持不变。配重消除由抛光台的圆周轨道运动产生的离心力。

66. 发明授权

US06428400B1 Drainage structure in polishing plant 有权
标题翻译：抛光厂排水结构
公开(公告)号：US06428400B1
公开(公告)日：2002-08-06
申请号：US09612939
申请日：2000-07-10
申请人： Tetsuji Togawa , Kuniaki Yamaguchi
发明人： Tetsuji Togawa , Kuniaki Yamaguchi
IPC分类号： B24B900
CPC分类号： H01L21/67057 , B24B37/04 , B24B57/02
摘要： A polishing plant including a polishing apparatus having a top ring for holding a workpiece and a turn table for polishing a surface of the workpiece held by the top ring. A cleaning apparatus has cleaning machines for cleaning the workpiece polished by the polishing apparatus. At least one drainage pipe connected to the polishing apparatus discharges a waste liquid from the polishing apparatus, and at least one drainage pipe connected to the cleaning apparatus discharges a waste liquid from the cleaning apparatus are provided as separate plural drainage pipe lines, depending on the type of waste liquid. By use of the polishing plant of the present invention, treatment of waste liquids can be efficiently conducted.
摘要翻译：一种抛光装置，包括具有用于保持工件的顶环的抛光装置和用于抛光由顶环保持的工件的表面的转台。清洁装置具有清洁由抛光装置抛光的工件的清洁机。连接到抛光装置的至少一个排水管从抛光装置排出废液，并且连接到清洁装置的至少一个排水管将来自清洁装置的废液排出，作为单独的多个排水管线设置，这取决于废液类型。通过使用本发明的研磨装置，可以有效地进行废液的处理。

67. 发明授权

US06390901B1 Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US06390901B1
公开(公告)日：2002-05-21
申请号：US09397916
申请日：1999-09-17
申请人： Hirokuni Hiyama , Yutaka Wada , Kazuto Hirokawa , Hisanori Matsuo , Tetsuji Togawa , Satoshi Wakabayashi
发明人： Hirokuni Hiyama , Yutaka Wada , Kazuto Hirokawa , Hisanori Matsuo , Tetsuji Togawa , Satoshi Wakabayashi
IPC分类号： B24B2900
CPC分类号： B24B37/11 , B24D9/085
摘要： An object of the present invention is to provide a polishing apparatus with a grinding plate that can easily and reliably be installed on and detached from a turntable. The polishing apparatus has a grinding plate tool, fixedly mounted on the turntable, which includes the grinding plate, and a top ring for holding a workpiece to be polished and pressing the workpiece against the grinding plate in sliding contact therewith for polishing a surface of the workpiece to a flat, mirror finish. A clamping mechanism is mounted in the turntable for fixing an outer circumferential flange of the grinding plate tool to the turntable.
摘要翻译：本发明的目的是提供一种具有研磨板的抛光装置，其可以容易且可靠地安装在转台上和从转盘上拆下。抛光装置具有固定安装在转盘上的研磨板工具，其包括研磨板，以及用于保持要抛光的工件的顶环，并将工件抵靠研磨板与其滑动接触，以抛光其中的表面工件平整，镜面光洁。夹持机构安装在转盘中，用于将研磨板工具的外周凸缘固定到转台上。

68. 发明授权

US06358131B1 Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US06358131B1
公开(公告)日：2002-03-19
申请号：US09625490
申请日：2000-07-25
申请人： Kunihiko Sakurai , Satoshi Wakabayashi , Tetsuji Togawa
发明人： Kunihiko Sakurai , Satoshi Wakabayashi , Tetsuji Togawa
IPC分类号： B24B500
CPC分类号： B24B37/345 , B24B41/061
摘要： The present invention provides a polishing apparatus comprising a polishing table having a polishing surface, a substrate carrier having an axis about which the substrate carrier is rotatable. The substrate carrier includes a plurality of substrate holders positioned around a circle about the axis of the substrate carrier and spaced apart from each other at equal angular distances, with each of the substrate holders being adapted to hold a substrate and bring it into contact with the polishing surface. The apparatus further comprises a substrate loading device laterally spaced apart from the polishing table, in which device a substrate is picked up by one of the substrate holders which is positioned at the substrate loading device, and a substrate unloading device laterally spaced apart from the polishing table, in which device one of the substrate holders which is positioned at the substrate unloading device releases a wafer onto the unloading device. The substrate carrier is indexably rotated about the stated axis in such a manner that one of the substrate holders is selectively positioned at the loading device, while another substrate holder is positioned at the unloading device and at least one of the other substrate holders is positioned over the polishing surface.
摘要翻译：本发明提供了一种抛光装置，其包括具有抛光表面的抛光台，具有基板载体可旋转的轴线的基板载体。衬底载体包括多个衬底保持器，其围绕衬底载体的轴线围绕圆周定位，并以相等的角距彼此间隔开，衬底保持器中的每一个适于保持衬底并使其与抛光面。该装置还包括与抛光台横向间隔开的衬底加载装置，其中衬底被位于衬底装载装置的衬底保持器中的一个拾取，以及与抛光件横向间隔开的衬底卸载装置工作台，其中位于衬底卸载装置的衬底保持器之一的装置将晶片释放到卸载装置上。衬底载体可以以所述轴线可转动地旋转，使得衬底保持器中的一个选择性地定位在加载装置处，而另一衬底保持器定位在卸载装置处，并且至少一个衬底保持器位于抛光面。

69. 发明授权

US06354922B1 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US06354922B1
公开(公告)日：2002-03-12
申请号：US09476905
申请日：2000-01-03
申请人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
发明人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
IPC分类号： B24B722
CPC分类号： B24B37/345 , B24B37/042 , H01L21/30625
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The transfer structure comprises a plurality of robots and is capable of changing transfer routes between the three cleaning apparatuses.
摘要翻译：抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。抛光装置包括具有抛光表面的转台，用于保持工件的顶环，并将工件压靠抛光表面抛光工件，用于清洁抛光工件的至少三个清洁装置和用于传送抛光工件的转印结构在至少三个清洁装置之间。传送结构包括多个机器人，并且能够改变三个清洁设备之间的传送路线。

70. 发明授权

US5934984A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US5934984A
公开(公告)日：1999-08-10
申请号：US806622
申请日：1997-02-26
申请人： Tetsuji Togawa , Shunichiro Kojima
发明人： Tetsuji Togawa , Shunichiro Kojima
IPC分类号： B24B37/04 , B24B37/10 , B24B37/34 , B24B41/06 , B24B47/26 , B24B13/05
CPC分类号： B24B37/105 , B24B37/345 , B24B47/26 , Y10S414/136
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus has a pusher for transferring the workpiece between a top ring of a polishing apparatus and the pusher. The polishing apparatus includes a turntable having a polishing surface, a top ring for supporting the workpiece to be polished and pressing the workpiece against the polishing surface, and a pusher for transferring the workpiece between the top ring and the pusher. The pusher comprises a workpiece support for supporting the workpiece, an actuating unit for moving the workpiece support in a vertical direction, a sliding mechanism movable within a horizontal plane, and a positioning mechanism for positioning the workpiece support and the top ring with respect to each other in association with the sliding mechanism when the workpiece is transferred between the workpiece support and the top ring.
摘要翻译：抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。抛光装置具有用于在抛光装置的顶环和推动器之间传送工件的推动器。抛光装置包括具有抛光表面的转盘，用于支撑待抛光工件的顶环，并将工件压靠在抛光表面上，以及用于在顶环和推动器之间传送工件的推动器。推动器包括用于支撑工件的工件支撑件，用于沿垂直方向移动工件支撑件的致动单元，可在水平平面内移动的滑动机构，以及用于相对于每个位置定位工件支撑件和顶环的定位机构当工件在工件支撑件和顶环之间转移时，与滑动机构相关联。

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