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1. 发明授权

US06682408B2 Polishing apparatus 失效
公开(公告)号：US06682408B2
公开(公告)日：2004-01-27
申请号：US10026763
申请日：2001-12-27
申请人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
发明人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
IPC分类号： B24B100
CPC分类号： B24B37/345 , B24B37/042 , H01L21/30625
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

2. 发明授权

US06578891B1 Substrate holder and substrate transfer apparatus using the same 有权
标题翻译：基板支架和使用其的基板输送装置
公开(公告)号：US06578891B1
公开(公告)日：2003-06-17
申请号：US09612212
申请日：2000-07-07
申请人： Hiroo Suzuki , Kenya Ito , Kunihiko Sakurai , Satoshi Wakabayashi , Tetsuji Togawa
发明人： Hiroo Suzuki , Kenya Ito , Kunihiko Sakurai , Satoshi Wakabayashi , Tetsuji Togawa
IPC分类号： B25J1500
CPC分类号： H01L21/67259 , B25J13/086 , B25J15/00 , B25J19/021 , H01L21/67766 , H01L21/68707 , Y10S294/907 , Y10S414/141
摘要： The present invention provides a substrate holder for holding and transferring a thin substrate, comprising a substrate support member having a recessed area for placing a thin substrate therein and substrate mount portions formed in the recessed area in the vicinity of a circumferential edge thereof. The substrate mount portions is adapted to be engaged with an outer circumferential portion of a backside of the substrate placed in the recessed area. The substrate holder further comprises a substrate detector for detecting presence or absence of the substrate in the recessed area.
摘要翻译：本发明提供了一种用于保持和转印薄基板的基板保持器，包括：具有用于放置薄基板的凹陷区域的基板支撑构件和形成在其周缘附近的凹陷区域中的基板安装部分。基板安装部分适于与放置在凹陷区域中的基板的背面的外周部分接合。衬底保持器还包括用于检测凹陷区域中的衬底的存在或不存在的衬底检测器。

3. 发明申请

US20050159082A1 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US20050159082A1
公开(公告)日：2005-07-21
申请号：US11078495
申请日：2005-03-14
申请人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
发明人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
IPC分类号： B24B37/04 , H01L21/306 , B24B49/00
CPC分类号： B24B37/345 , B24B37/042 , H01L21/30625
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.
摘要翻译：抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。抛光装置包括具有抛光表面的转台，用于保持工件的顶环，并将工件压靠抛光表面抛光工件，用于清洁抛光工件的至少三个清洁装置和用于传送抛光工件的转印结构在至少三个清洁装置之间。抛光装置还包括旋转输送器，其设置在可由所述顶环接近的位置，并且具有从旋转运送器的旋转中心定位在预定圆周上的多个部分，用于保持工件。

4. 发明授权

US06878044B2 Polishing apparatus 有权
公开(公告)号：US06878044B2
公开(公告)日：2005-04-12
申请号：US10750823
申请日：2004-01-05
申请人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
发明人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
IPC分类号： B24B37/04 , H01L21/306 , B24B7/00
CPC分类号： B24B37/345 , B24B37/042 , H01L21/30625
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

5. 发明授权

US06358131B1 Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US06358131B1
公开(公告)日：2002-03-19
申请号：US09625490
申请日：2000-07-25
申请人： Kunihiko Sakurai , Satoshi Wakabayashi , Tetsuji Togawa
发明人： Kunihiko Sakurai , Satoshi Wakabayashi , Tetsuji Togawa
IPC分类号： B24B500
CPC分类号： B24B37/345 , B24B41/061
摘要： The present invention provides a polishing apparatus comprising a polishing table having a polishing surface, a substrate carrier having an axis about which the substrate carrier is rotatable. The substrate carrier includes a plurality of substrate holders positioned around a circle about the axis of the substrate carrier and spaced apart from each other at equal angular distances, with each of the substrate holders being adapted to hold a substrate and bring it into contact with the polishing surface. The apparatus further comprises a substrate loading device laterally spaced apart from the polishing table, in which device a substrate is picked up by one of the substrate holders which is positioned at the substrate loading device, and a substrate unloading device laterally spaced apart from the polishing table, in which device one of the substrate holders which is positioned at the substrate unloading device releases a wafer onto the unloading device. The substrate carrier is indexably rotated about the stated axis in such a manner that one of the substrate holders is selectively positioned at the loading device, while another substrate holder is positioned at the unloading device and at least one of the other substrate holders is positioned over the polishing surface.
摘要翻译：本发明提供了一种抛光装置，其包括具有抛光表面的抛光台，具有基板载体可旋转的轴线的基板载体。衬底载体包括多个衬底保持器，其围绕衬底载体的轴线围绕圆周定位，并以相等的角距彼此间隔开，衬底保持器中的每一个适于保持衬底并使其与抛光面。该装置还包括与抛光台横向间隔开的衬底加载装置，其中衬底被位于衬底装载装置的衬底保持器中的一个拾取，以及与抛光件横向间隔开的衬底卸载装置工作台，其中位于衬底卸载装置的衬底保持器之一的装置将晶片释放到卸载装置上。衬底载体可以以所述轴线可转动地旋转，使得衬底保持器中的一个选择性地定位在加载装置处，而另一衬底保持器定位在卸载装置处，并且至少一个衬底保持器位于抛光面。

6. 发明授权

US06354922B1 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US06354922B1
公开(公告)日：2002-03-12
申请号：US09476905
申请日：2000-01-03
申请人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
发明人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
IPC分类号： B24B722
CPC分类号： B24B37/345 , B24B37/042 , H01L21/30625
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The transfer structure comprises a plurality of robots and is capable of changing transfer routes between the three cleaning apparatuses.
摘要翻译：抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。抛光装置包括具有抛光表面的转台，用于保持工件的顶环，并将工件压靠抛光表面抛光工件，用于清洁抛光工件的至少三个清洁装置和用于传送抛光工件的转印结构在至少三个清洁装置之间。传送结构包括多个机器人，并且能够改变三个清洁设备之间的传送路线。

7. 发明授权

US07632378B2 Polishing apparatus 有权
公开(公告)号：US07632378B2
公开(公告)日：2009-12-15
申请号：US11078495
申请日：2005-03-14
申请人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
发明人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
IPC分类号： C23F1/00 , H01L21/306
CPC分类号： B24B37/345 , B24B37/042 , H01L21/30625
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

8. 发明授权

US06358128B1 Polishing apparatus 有权
公开(公告)号：US06358128B1
公开(公告)日：2002-03-19
申请号：US09663417
申请日：2000-09-15
申请人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
发明人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
IPC分类号： B24B700
CPC分类号： B24B37/345 , B24B37/042 , H01L21/30625
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

9. 发明申请

US20060234609A1 Substrate holding apparatus 有权
公开(公告)号：US20060234609A1
公开(公告)日：2006-10-19
申请号：US11452218
申请日：2006-06-14
申请人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
发明人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
IPC分类号： B24B29/00 , B24B47/02
CPC分类号： B24B37/30 , B24B41/061
摘要： The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.

10. 发明申请

US20060099892A1 Substrate holding apparatus and polishing apparatus 有权
公开(公告)号：US20060099892A1
公开(公告)日：2006-05-11
申请号：US11312571
申请日：2005-12-21
申请人： Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
发明人： Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
IPC分类号： B24B47/00 , B24B29/00
CPC分类号： B24B37/30 , B24B41/061 , B24B49/105
摘要： The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.

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