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61. 发明授权

US07836585B2 Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries 有权
公开(公告)号：US07836585B2
公开(公告)日：2010-11-23
申请号：US12106462
申请日：2008-04-21
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H01K3/00 , H01R12/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A method of operatively combining a plurality of components to form a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.

62. 发明授权

US07491068B2 Land grid array (LGA) interposer groups of different heights utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries 失效
标题翻译：使用金属弹性体半环和其他多点接触几何的不同高度的土地栅格阵列（LGA）中介层组
公开(公告)号：US07491068B2
公开(公告)日：2009-02-17
申请号：US11865436
申请日：2007-10-01
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H01R12/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.
摘要翻译：包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入器。插入件在横截面中具有半环形结构，并由介电弹性体材料构成。多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触飞机还提供了一种制造焊盘栅格阵列中介层结构的方法。

63. 发明申请

US20090013528A1 LAND GRID ARRAY (LGA) INTERPOSER UTILIZING METAL-ON-ELASTOMER HEMI-TORUS AND OTHER MULTIPLE POINTS OF CONTACT GEOMETRIES 有权
标题翻译：土地网阵列（LGA）利用金属激光器热电偶和其他多点接触几何
公开(公告)号：US20090013528A1
公开(公告)日：2009-01-15
申请号：US12212927
申请日：2008-09-18
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H01R43/16
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cros s-section and is constituted of a dielectric elastomeric material. At least one sidewall of the interposer is slitted to facilitate the venting of gases and pressure therethrough. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.
摘要翻译：一种制造包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入件的方法。插入件在横向横截面中具有半环形结构，并由介电弹性体材料构成。插入器的至少一个侧壁被切割以便于气体的排出和通过其中的压力。多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触飞机

64. 发明申请

US20090007427A1 LAND GRID ARRAY (LGA) INTERPOSER UTILIZING METAL-ON-ELASTOMER HEMI-TORUS AND OTHER MULTIPLE POINTS OF CONTACT GEOMETRIES 有权
公开(公告)号：US20090007427A1
公开(公告)日：2009-01-08
申请号：US12207713
申请日：2008-09-10
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H01R43/20
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.

65. 发明申请

US20080176418A1 LAND GRID ARRAY (LGA) INTERPOSER UTILIZING METAL-ON-ELASTOMER HEMI TORUS AND OTHER MULTIPLE POINTS OF CONTACT GEOMETRIES 失效
标题翻译：土地网阵列（LGA）利用金属激光器HEMI TORUS和其他多点接触几何
公开(公告)号：US20080176418A1
公开(公告)日：2008-07-24
申请号：US11865396
申请日：2007-10-01
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H01R12/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.
摘要翻译：包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入器。插入件在横截面中具有半环形结构，并由介电弹性体材料构成。多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触飞机还提供了一种制造焊盘栅格阵列中介层结构的方法。

66. 发明授权

US07377790B2 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries 有权
标题翻译：利用金属弹性体半环和其他多点接触几何形式的土地栅格阵列（LGA）插入器
公开(公告)号：US07377790B2
公开(公告)日：2008-05-27
申请号：US11865231
申请日：2007-10-01
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H01R12/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.
摘要翻译：包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入器。插入件在横截面中具有半环形结构，并由介电弹性体材料构成。多个导电元件围绕至少一个半环形插入件的表面布置，并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触飞机还提供了一种制造焊盘栅格阵列中介层结构的方法。

67. 发明申请

US20080123300A1 FOLDED-SHEET-METAL HEATSINKS FOR CLOSELY PACKAGED HEAT-PRODUCING DEVICES 失效
标题翻译：用于封闭热封装置的折叠式金属热源
公开(公告)号：US20080123300A1
公开(公告)日：2008-05-29
申请号：US11564353
申请日：2006-11-29
申请人： Shurong Tian , Shawn A. Hall , Paul W. Coteus
发明人： Shurong Tian , Shawn A. Hall , Paul W. Coteus
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , G11C5/04 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A folded heatsink for cooling heat-producing devices. The folded heatsink includes a substantially planar base having a first end and a second end. The base is intended to be affixed in thermal contact to an exposed, substantially planar surface of one or more heat-producing devices. The folded heatsink also includes two shoulders each having a proximal end and a distal end. The proximal ends of the shoulders project substantially at right angles from the first and second ends of the base. The folded heatsink also includes two arms each having a proximal end and a distal end. The proximal ends of the arms project substantially at right angles from the distal ends of the shoulders such that the base, shoulders and arms from a nearly closed rectangular tube formed from a continuous sheet of metal.
摘要翻译：用于冷却发热装置的折叠式散热器。折叠式散热器包括具有第一端和第二端的基本平坦的基座。底座旨在与一个或多个发热装置的暴露的，基本平坦的表面热接触地固定。折叠的散热器还包括两个肩部，每个肩部具有近端和远端。肩部的近端从基座的第一端和第二端基本成直角地突出。折叠的散热器还包括两个臂，每个臂具有近端和远端。臂的近端从肩部的远端基本上以直角突出，使得基部，肩部和臂从近似接近的矩形管由连续的金属片形成。

68. 发明申请

US20080212282A1 METHOD AND APPARATUS FOR COOLING AN EQUIPMENT ENCLOSURE THROUGH CLOSED-LOOP LIQUID-ASSISTED AIR COOLING IN COMBINATION WITH DIRECT LIQUID COOLING 审中-公开
公开(公告)号：US20080212282A1
公开(公告)日：2008-09-04
申请号：US12042596
申请日：2008-03-05
申请人： Shawn A. Hall , Shurong Tian , Paul W. Coteus , John P. Karidis , Evan G. Colgan , Robert W. Guernsey
发明人： Shawn A. Hall , Shurong Tian , Paul W. Coteus , John P. Karidis , Evan G. Colgan , Robert W. Guernsey
IPC分类号： H05K7/20
CPC分类号： H05K7/20754 , G06F1/20 , G06F2200/201
摘要： A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.

69. 发明授权

US07342789B2 Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling 有权
标题翻译：通过闭环，液体辅助空气冷却与直接液体冷却结合来冷却设备外壳的方法和设备
公开(公告)号：US07342789B2
公开(公告)日：2008-03-11
申请号：US11427384
申请日：2006-06-29
申请人： Shawn A. Hall , Shurong Tian , Paul W. Coteus , John P. Karidis , Evan G. Colgan , Robert W. Guernsey, Jr.
发明人： Shawn A. Hall , Shurong Tian , Paul W. Coteus , John P. Karidis , Evan G. Colgan , Robert W. Guernsey, Jr.
IPC分类号： H05K7/20 , F28D15/00 , F28F7/00
CPC分类号： H05K7/20754 , G06F1/20 , G06F2200/201
摘要： A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.
摘要翻译：优选地在外壳内冷却发热部件的多样性的方法和装置，其中至少一些部件具有高功率密度，而其它部件具有低功率密度。由基本相对较少的高功率密度组件（例如微处理器芯片）产生的热量通过直接液体冷却而被去除，而由更多的低功率或低功率密度组件产生的热量，例如存储芯片例如，通过液体辅助空气冷却以封闭回路的形式除去，包括沿着空气路径交替的多个加热和冷却区域。

70. 发明授权

US09081501B2 Multi-petascale highly efficient parallel supercomputer 有权
标题翻译：多千兆高效并行超级计算机
公开(公告)号：US09081501B2
公开(公告)日：2015-07-14
申请号：US13004007
申请日：2011-01-10
申请人： Sameh Asaad , Ralph E. Bellofatto , Michael A. Blocksome , Matthias A. Blumrich , Peter Boyle , Jose R. Brunheroto , Dong Chen , Chen-Yong Cher , George L. Chiu , Norman Christ , Paul W. Coteus , Kristan D. Davis , Gabor J. Dozsa , Alexandre E. Eichenberger , Noel A. Eisley , Matthew R. Ellavsky , Kahn C. Evans , Bruce M. Fleischer , Thomas W. Fox , Alan Gara , Mark E. Giampapa , Thomas M. Gooding , Michael K. Gschwind , John A. Gunnels , Shawn A. Hall , Rudolf A. Haring , Philip Heidelberger , Todd A. Inglett , Brant L. Knudson , Gerard V. Kopcsay , Sameer Kumar , Amith R. Mamidala , James A. Marcella , Mark G. Megerian , Douglas R. Miller , Samuel J. Miller , Adam J. Muff , Michael B. Mundy , John K. O'Brien , Kathryn M. O'Brien , Martin Ohmacht , Jeffrey J. Parker , Ruth J. Poole , Joseph D. Ratterman , Valentina Salapura , David L. Satterfield , Robert M. Senger , Brian Smith , Burkhard Steinmacher-Burow , William M. Stockdell , Craig B. Stunkel , Krishnan Sugavanam , Yutaka Sugawara , Todd E. Takken , Barry M. Trager , James L. Van Oosten , Charles D. Wait , Robert E. Walkup , Alfred T. Watson , Robert W. Wisniewski , Peng Wu
发明人： Sameh Asaad , Ralph E. Bellofatto , Michael A. Blocksome , Matthias A. Blumrich , Peter Boyle , Jose R. Brunheroto , Dong Chen , Chen-Yong Cher , George L. Chiu , Norman Christ , Paul W. Coteus , Kristan D. Davis , Gabor J. Dozsa , Alexandre E. Eichenberger , Noel A. Eisley , Matthew R. Ellavsky , Kahn C. Evans , Bruce M. Fleischer , Thomas W. Fox , Alan Gara , Mark E. Giampapa , Thomas M. Gooding , Michael K. Gschwind , John A. Gunnels , Shawn A. Hall , Rudolf A. Haring , Philip Heidelberger , Todd A. Inglett , Brant L. Knudson , Gerard V. Kopcsay , Sameer Kumar , Amith R. Mamidala , James A. Marcella , Mark G. Megerian , Douglas R. Miller , Samuel J. Miller , Adam J. Muff , Michael B. Mundy , John K. O'Brien , Kathryn M. O'Brien , Martin Ohmacht , Jeffrey J. Parker , Ruth J. Poole , Joseph D. Ratterman , Valentina Salapura , David L. Satterfield , Robert M. Senger , Brian Smith , Burkhard Steinmacher-Burow , William M. Stockdell , Craig B. Stunkel , Krishnan Sugavanam , Yutaka Sugawara , Todd E. Takken , Barry M. Trager , James L. Van Oosten , Charles D. Wait , Robert E. Walkup , Alfred T. Watson , Robert W. Wisniewski , Peng Wu
IPC分类号： G06F15/173 , G06F9/06 , G06F15/76
CPC分类号： G06F13/287 , G06F9/06 , G06F9/3004 , G06F9/30047 , G06F9/3885 , G06F12/0811 , G06F12/0831 , G06F12/0862 , G06F12/0864 , G06F12/1027 , G06F15/17381 , G06F15/17387 , G06F15/76 , G06F15/8069 , G06F2212/1016 , G06F2212/602 , G06F2212/6022 , G06F2212/6024 , G06F2212/6032 , Y02D10/13 , Y02D10/14
摘要： A Multi-Petascale Highly Efficient Parallel Supercomputer of 100 petaOPS-scale computing, at decreased cost, power and footprint, and that allows for a maximum packaging density of processing nodes from an interconnect point of view. The Supercomputer exploits technological advances in VLSI that enables a computing model where many processors can be integrated into a single Application Specific Integrated Circuit (ASIC). Each ASIC computing node comprises a system-on-chip ASIC utilizing four or more processors integrated into one die, with each having full access to all system resources and enabling adaptive partitioning of the processors to functions such as compute or messaging I/O on an application by application basis, and preferably, enable adaptive partitioning of functions in accordance with various algorithmic phases within an application, or if I/O or other processors are underutilized, then can participate in computation or communication nodes are interconnected by a five dimensional torus network with DMA that optimally maximize the throughput of packet communications between nodes and minimize latency.
摘要翻译：具有100 petaOPS规模计算的多Petascale高效并行超级计算机，其成本，功耗和占地面积都在降低，并且允许从互连角度来看处理节点的最大封装密度。超级计算机利用了VLSI的技术进步，实现了许多处理器可以集成到单个专用集成电路（ASIC）中的计算模型。每个ASIC计算节点包括利用集成到一个管芯中的四个或更多个处理器的片上系统ASIC，每个处理器具有对所有系统资源的完全访问，并且使得处理器能够对诸如计算或消息传递I / O 并且优选地，根据应用内的各种算法阶段实现功能的自适应分割，或者如果I / O或其他处理器未被充分利用，则可以参与计算或通信节点通过五维环面网络互连使用DMA来最大限度地最大化节点之间的分组通信的吞吐量并最小化等待时间。

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