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    • 61. 发明授权
    • Method for thin film device with stranded conductor
    • 具有绞线的薄膜器件的方法
    • US08318610B2
    • 2012-11-27
    • US13172543
    • 2011-06-29
    • Ping MeiHao LuoCarl Taussig
    • Ping MeiHao LuoCarl Taussig
    • H01L21/31
    • H01L27/1259H01L27/1214H01L27/1218H01L29/78603
    • Provided is a thin film device and an associated method of making a thin film device. For example, fabrication of an inverter thin film device is described. Moreover, a parallel spaced electrically conductive strips are provided upon a substrate. A functional material is deposited upon the conductive strips. A 3D structure is then provided upon the functional material, the 3D structure having a plurality of different heights, at least one height defining a first portion of the conductive strips to be bundled. The 3D structure and functional material are then etched to define a TFD disposed above the first portion of the conductive strips. The first portion of the conductive strips is bundled adjacent to the TFD.
    • 本发明提供一种制造薄膜器件的薄膜器件和相关方法。 例如,描述了逆变器薄膜器件的制造。 此外,在基板上设置平行隔开的导电条。 功能材料沉积在导电条上。 然后在功能材料上提供3D结构,3D结构具有多个不同的高度,限定要捆扎的导电条的第一部分的至少一个高度。 然后蚀刻3D结构和功能材料以限定设置在导电条的第一部分之上的TFD。 导电条的第一部分与TFD相邻捆扎。
    • 62. 发明授权
    • Method for forming an electronic device
    • 电子设备的形成方法
    • US08097400B2
    • 2012-01-17
    • US11062384
    • 2005-02-22
    • Warren JacksonCarl TaussigPing Mei
    • Warren JacksonCarl TaussigPing Mei
    • G03F7/20
    • G03F7/0002B82Y10/00B82Y40/00
    • Provided is a low cost system and method for forming electronic devices, especially large surface area devices. The process of imprint lithography is combined with alternate manufacturing techniques to fabricate the devices. Initially, a template imprints a three-dimensional pattern into a resist layer deposited on a flexible substrate. The resist layer is cured using ultraviolet light or other curing techniques. After curing, the 3-D pattern is modified using one of several techniques to include inkjetting, electrodeposition or laser patterning. In one embodiment, a semi-fluid material may be jetted into channels formed in the pattern, thereby forming conductive or insulating lead lines. Alternatively, a two-dimensional pattern may be jetted onto the resist layer. Final processing may include multiple etch-mask-etch steps. The integration of techniques into a single system provides a low cost, efficient method for manufacturing high quality, large surface area electronic devices.
    • 提供一种用于形成电子装置,特别是大型表面积装置的低成本系统和方法。 压印光刻的过程与替代制造技术相结合以制造器件。 最初,模板将三维图案印刷到沉积在柔性基板上的抗蚀剂层中。 使用紫外线或其他固化技术固化抗蚀剂层。 固化后,使用几种技术之一来修改3-D图案,以包括喷墨,电沉积或激光图案化。 在一个实施例中,可以将半流体材料喷射到在图案中形成的通道中,从而形成导电或绝缘导线。 或者,可以将二维图案喷射到抗蚀剂层上。 最终处理可以包括多个蚀刻掩模蚀刻步骤。 将技术整合到单个系统中提供了用于制造高质量,大表面积电子器件的低成本,有效的方法。
    • 64. 发明授权
    • Structure and method for thin film device with stranded conductor
    • 具有绞线的薄膜器件的结构和方法
    • US07994509B2
    • 2011-08-09
    • US11264321
    • 2005-11-01
    • Ping MeiHao LuoCarl Taussig
    • Ping MeiHao LuoCarl Taussig
    • H01L29/10
    • H01L27/1259H01L27/1214H01L27/1218H01L29/78603
    • Provided is a thin film device and an associated method of making a thin film device. For example, fabrication of an inverter thin film device is described. Moreover, a parallel spaced electrically conductive strips are provided upon a substrate. A functional material is deposited upon the conductive strips. A 3D structure is then provided upon the functional material, the 3D structure having a plurality of different heights, at least one height defining a first portion of the conductive strips to be bundled. The 3D structure and functional material are then etched to define a TFD disposed above the first portion of the conductive strips. The first portion of the conductive strips is bundled adjacent to the TFD.
    • 本发明提供一种制造薄膜器件的薄膜器件和相关方法。 例如,描述了逆变器薄膜器件的制造。 此外,在基板上设置平行隔开的导电条。 功能材料沉积在导电条上。 然后在功能材料上提供3D结构,3D结构具有多个不同的高度,限定要捆扎的导电条的第一部分的至少一个高度。 然后蚀刻3D结构和功能材料以限定设置在导电条的第一部分之上的TFD。 导电条的第一部分与TFD相邻捆扎。
    • 66. 发明授权
    • Anti-counterfeiting system and method
    • 防伪系统和方法
    • US07533905B2
    • 2009-05-19
    • US11144203
    • 2005-06-02
    • Warren JacksonPing Mei
    • Warren JacksonPing Mei
    • B42D15/00
    • G07D7/02
    • Disclosed is an anti-counterfeiting system. In a particular embodiment, the anti-counterfeiting system has a first structure having a plurality of three-dimensional nanostructures, each having a height dimension less than a wavelength of visible light. In addition, there is a second structure having a second plurality of three-dimensional nanostructures, each having a height dimension less than a wavelength of visible light. The first and second structures are configured to couple together. An alignment mechanism is operable to align the first structure to the second structure and establish proximate contact between the first and second pluralities of nanostructures. With respect to the first and second structures, each encodes part of an authentication key. The authentication key includes pre-determined elements and interaction modalities. The resolution of the structures makes them copy-resistant. An associated method of use is also provided.
    • 披露了一种防伪系统。 在特定实施例中,防伪系统具有第一结构,其具有多个三维纳米结构,每个具有小于可见光波长的高度尺寸。 此外,存在具有第二多个三维纳米结构的第二结构,每个具有小于可见光波长的高度尺寸。 第一和第二结构被配置成耦合在一起。 对准机构可操作以将第一结构与第二结构对准并且在第一和第二多个纳米结构之间建立近似接触。 对于第一和第二结构,每个编码认证密钥的一部分。 验证密钥包括预定元素和交互模式。 结构的分辨率使其具有抗复制能力。 还提供了相关联的使用方法。
    • 68. 发明申请
    • Thin film transistor logic
    • 薄膜晶体管逻辑
    • US20080315918A1
    • 2008-12-25
    • US11821068
    • 2007-06-20
    • Hao LuoPing MeiCarl P. Tausig
    • Hao LuoPing MeiCarl P. Tausig
    • H03K19/0175
    • H03K19/09441
    • A thin-film logic circuit, which can be fabricated entirely of TFTs of the same conductivity type, includes a logic stage connected to a supply voltage and a level shifter connected to a wider voltage range provided by the supply voltage and ground. The logic circuit produces output signals with full rail-to-rail signal range from ground to the supply voltage and can implement or include a basic logic component such as an inverter, a NAND gate, or a NOR gate or more complicated circuits in which many basic logic components are cascaded together. Such logic circuits can be fabricated directly on flexible structures or large areas such as in flat panel displays.
    • 可以完全由相同导电类型的TFT制造的薄膜逻辑电路包括连接到电源电压的逻辑级和连接到由电源电压和接地提供的较宽电压范围的电平转换器。 逻辑电路产生具有从地到电源电压的完整轨到轨信号范围的输出信号,并且可以实现或包括诸如逆变器,NAND门或NOR门的基本逻辑组件或更复杂的电路,其中许多 基本逻辑元件级联在一起。 这样的逻辑电路可以直接在柔性结构或大面积上制造,例如在平板显示器中。