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    • 66. 发明申请
    • Glass fixture-joined glass article and joint structure using this
    • 玻璃夹具接合玻璃制品和使用这种连接结构
    • US20050112291A1
    • 2005-05-26
    • US10506385
    • 2003-03-11
    • Ichiro OkajimaHideki WatanabeKazuo Yamada
    • Ichiro OkajimaHideki WatanabeKazuo Yamada
    • B23K1/00B23K1/20B23K35/26H01R4/02H01R4/04H01R4/62H01R4/64H05B3/84B05D1/02
    • H05B3/84B23K1/0008B23K1/20B23K35/262B23K2103/12B23K2103/16B23K2103/18B23K2103/54H01R4/02H01R4/04H01R4/62H01R4/625H01R4/64H01R2201/02H01R2201/26H05B2203/016
    • The present invention is intended to provide a glass article with a metal member joined thereto in which an electroconductive coating film is formed on at least a part of the surface of the glass article by baking a silver paste that includes Ag particles and a glass frit, a joining plane of the metal member is fixed onto the electroconductive coating film with a lead-free solder alloy containing Sn as a main component, and the lead-free solder alloy contains at least 1.5 mass % of Ag, which prevents the appearance of the electroconductive coating film and the bonding strength from degrading. Furthermore, in the present invention, when using a metal member having at least two joining planes, the total area of the joining planes is set within a range of 37 mm2 to 50 mm2, which allows high bonding strength between the glass article and metal member to be maintained while using the lead-free solder alloy. Moreover, in the present invention, the volume of the lead-free solder alloy to be provided on each joining plane is set to be 1.0 to 2.0 times the product of the area of the joining plane concerned and the thickness of the lead-free solder alloy, which prevents cracks from occurring in the glass article.
    • 本发明旨在提供一种具有连接到其上的金属构件的玻璃制品,其中通过烘烤包括Ag颗粒和玻璃料的银膏在玻璃制品的至少一部分表面上形成导电涂层, 使用含有Sn作为主要成分的无铅焊料将金属构件的接合面固定在导电性涂膜上,无铅焊料合金含有Ag的1.5质量%以上,防止了 导电涂膜和粘合强度降低。 此外,在本发明中,当使用具有至少两个接合面的金属构件时,接合面的总面积设定在37mm×2mm〜50mm的范围内, / SUP>,其在使用无铅焊料合金的同时保持玻璃制品和金属构件之间的高粘结强度。 此外,在本发明中,设置在各接合面上的无铅焊料合金的体积设定为所涉接合面积的面积与无铅焊料的厚度的1.0〜2.0倍 合金,其防止在玻璃制品中发生裂纹。
    • 70. 发明授权
    • Sampling frequency conversion device
    • 采样变频装置
    • US4536745A
    • 1985-08-20
    • US503508
    • 1983-06-13
    • Hirohisa YamaguchiKazuo YamadaTsutomu Miyasato
    • Hirohisa YamaguchiKazuo YamadaTsutomu Miyasato
    • H04B14/04H03H17/00H03H17/02H03H17/06H03M7/00H04L3/00
    • H03H17/0607H03H17/0621H03H17/0685
    • An input digital signal with M(=5) samples/second is converted to an output signal with N(=6) samples/second with n(=9) quantization bits. The device comprises parallel shift registers each having bit length P+n(P=11) for accepting an input signal with bit length n; an address converter for providing the continuous P bits in input signals from each of said parallel shift registers for every shift operation of said shift registers; N groups of ROMs (read only memory) storing the predetermined value in each address which is designated by output of said address converter; a shift register adder for accumulating output of said ROMs with shift operation; and an output gate coupled with output of said shift register adder for providing a converted output signal.
    • 具有M(= 5)个采样/秒的输入数字信号被转换成N(= 6)采样/秒的输出信号,其中n(= 9)个量化位。 该装置包括并行移位寄存器,每个移位寄存器具有用于接受位长度为n的输入信号的位长度P + n(P = 11) 地址转换器,用于从所述移位寄存器的每个移位操作提供来自每个所述并行移位寄存器的输入信号中的连续P位; 在由所述地址转换器的输出指定的每个地址中存储预定值的N组ROM(只读存储器) 移位寄存器加法器,用于利用移位操作来累加所述ROM的输出; 以及与所述移位寄存器加法器的输出耦合的输出门,用于提供转换的输出信号。