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    • 64. 发明申请
    • CATADIOPTRIC PROJECTION OBJECTIVE
    • 目标投影目标
    • US20110075121A1
    • 2011-03-31
    • US12748862
    • 2010-03-29
    • Alexander EppleToralf GrunerRalf Mueller
    • Alexander EppleToralf GrunerRalf Mueller
    • G03B27/72G02B17/06
    • G02B13/143G02B17/0892G03F7/70225
    • Catadioptric projection objective (1) for microlithography for imaging an object field (3) in an object plane (5) onto an image field (7) in an image plane (9), including a first partial objective (11) imaging the object field onto a first real intermediate image (13), a second partial objective (15) imaging the first intermediate image onto a second real intermediate image (17) and a third partial objective (19) imaging the second intermediate image onto the image field (7). The second partial objective (15) has exactly one concave mirror (21) and at least one lens (23). The minimum distance between an optically utilized region of the concave mirror (21) and an optically utilized region of a surface (25)—facing the concave mirror—of a lens (23) adjacent to the concave mirror is greater than 10 mm.
    • 用于微光刻的反折射投影物镜(1),用于将物平面(5)中的物场(3)成像到图像平面(9)中的图像场(7),包括对物场进行成像的第一部分物镜(11) 到第一实际中间图像(13),将第一中间图像成像到第二实际中间图像(17)上的第二部分目标(15)和将第二中间图像成像到图像场(7)上的第三部分目标(19) )。 第二部分物镜(15)具有正好一个凹面镜(21)和至少一个透镜(23)。 凹面镜(21)的光学利用区域与与凹面镜相邻的透镜(23)的凹面镜的表面(25)的光学利用区域之间的最小距离大于10mm。
    • 65. 发明申请
    • OPTICAL SYSTEM OF A MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS
    • 微波投影曝光装置的光学系统
    • US20100201960A1
    • 2010-08-12
    • US12765285
    • 2010-04-22
    • Joerg TschischgaleToralf Gruner
    • Joerg TschischgaleToralf Gruner
    • G03B27/68G01B9/00G01B9/02G03B27/54
    • G03F7/70591G03B13/00G03F7/70266
    • In a method for improving imaging properties of an illumination system or a projection objective of a microlithographic projection exposure apparatus, which comprises an optical element having a surface, the shape of the surface is measured directly at various points. To this end, a measuring beam is directed on the points, and the reflected or refracted beam is measured, e.g. using an interferometer. Based on deviations of the measured shape from a target shape, corrective measures are derived so that the imaging errors of the optical system are improved. The corrective measures may comprise a change in the position or the shape of the optical element being analyzed, or another optical element of the optical system. The target shape of the surface may, for example, be determined so that the optical element at least partially corrects imaging errors caused by other optical elements.
    • 在用于改善包括具有表面的光学元件的微光刻投影曝光装置的照明系统或投影物镜的成像特性的方法中,直接在各个点测量表面的形状。 为此,测量光束被引导到这些点上,并且测量反射或折射的光束。 使用干涉仪。 基于测量形状与目标形状的偏差,导出校正措施,使得光学系统的成像误差得到改善。 校正措施可以包括被分析的光学元件的位置或形状的改变,或光学系统的另一个光学元件的变化。 例如,可以确定表面的目标形状,使得光学元件至少部分地校正由其它光学元件引起的成像误差。
    • 66. 发明申请
    • METHOD OF MANUFACTURING A MINIATURIZED DEVICE
    • 制造微型器件的方法
    • US20090190116A1
    • 2009-07-30
    • US12408577
    • 2009-03-20
    • Markus SchwabAksel GoehnermeierToralf GrunerTammo Uitterdijk
    • Markus SchwabAksel GoehnermeierToralf GrunerTammo Uitterdijk
    • G03B27/42G03B27/54
    • G03B27/42G03F7/70258
    • A lithographic method of manufacturing a miniaturized device using a projection exposure system involves illuminating the object plane of an imaging optics of the projection exposure system with measuring light; detecting, for each of a plurality of locations on an image plane of the imaging optics, an angular distribution of an intensity of the measuring light traversing the image plane at the respective location; adjusting a telecentricity of the projection exposure system based on a selected patterning structure to be imaged and on the plurality of the detected angular distributions; disposing the selected pattern structure to be imaged in a region of the object plane of the imaging optics; disposing a substrate carrying a resist in a region of the image plane of the imaging optics and exposing the resist with imaging light using the projection exposure system with the adjusted telecentricity; and developing the exposed resist and processing the substrate with the developed resist.
    • 使用投影曝光系统制造小型化装置的光刻方法包括用测量光照射投影曝光系统的成像光学元件的物平面; 针对所述摄像光学元件的像平面上的多个位置中的每一个检测在相应位置处穿过所述图像平面的测量光的角度分布; 基于要成像的所选择的图案化结构和所述多个所检测的角度分布来调整所述投影曝光系统的远心度; 将要成像的所选择的图案结构设置在成像光学器件的物平面的区域中; 在所述成像光学元件的像面的区域中设置携带抗蚀剂的基板,并且利用所述投影曝光系统以调节的远心度将成像光曝光; 并显影出曝光的抗蚀剂并用显影的抗蚀剂处理衬底。
    • 67. 发明申请
    • Illumination System Including Grazing Incidence Mirror For Microlithography Exposure System
    • 包括用于微光刻曝光系统的放映入射镜的照明系统
    • US20090073392A1
    • 2009-03-19
    • US11855359
    • 2007-09-14
    • Hans-Juergen MannWilhelm UlrichDaniel KraemerToralf GrunerAurelian Dodoc
    • Hans-Juergen MannWilhelm UlrichDaniel KraemerToralf GrunerAurelian Dodoc
    • G03B21/28G03B21/06
    • G03F7/70233G03F7/702
    • In general, in one aspect, the invention features a system that includes a catoptric projection objective having an optical axis and including a plurality of projection objective elements positioned between an object plane and an image plane, the object and image planes being orthogonal to the optical axis, the projection objective being configured so that during operation the projection objective directs radiation reflected at the object plane to the image plane to form an image at the image plane of an object positioned in a field at the object plane, the field having a first dimension of 8 mm or more and a second dimension of 8 mm or more, the first and second dimensions being along orthogonal directions. The system also includes an illumination system including a plurality of illumination system elements, the illumination system being configured so that during operation the illumination system directs the radiation to the field at the object plane, where a chief ray of the radiation has an angle of incidence of 10° or less at the object plane.
    • 通常,在一个方面,本发明的特征在于一种系统,其包括具有光轴并且包括位于物平面和图像平面之间的多个投影物镜元件的反射投影物镜,物体和像平面正交于光学 所述投影物镜被配置为使得在操作期间,投影物镜将在物平面处反射的辐射引导到像平面以在位于物平面处的场中的物体的像平面处形成图像,该场具有第一 尺寸为8mm以上,第二尺寸为8mm以上,第一尺寸和第二尺寸沿正交方向。 该系统还包括包括多个照明系统元件的照明系统,照明系统被配置为使得在操作期间照明系统将辐射引导到物平面处的场,其中辐射的主射线具有入射角 在物平面上为10°以下。