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61. 发明授权

US07660123B1 Heat dissipating fin assembly for clamping dynamic random access memory to dissipate heat 失效
标题翻译：散热片组件用于夹紧动态随机存取存储器以散热
公开(公告)号：US07660123B1
公开(公告)日：2010-02-09
申请号：US12276488
申请日：2008-11-24
申请人： Kuo-Len Lin , Ken Hsu , Chih-Hung Cheng
发明人： Kuo-Len Lin , Ken Hsu , Chih-Hung Cheng
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H01L23/3672 , F28F1/30 , H01L21/4882 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： An exemplary heat dissipating fin assembly for clamping the DRAM to dissipate heat includes a number of heat dissipating fins arranged in a stacked fashion and a shaft. Each of the heat dissipating fins defines a pivoting hole and a slot therein. The slots of the heat dissipating fins are configured for receiving the DRAM. The shaft goes through the pivoting hole of each of the heat dissipating fins so as to string the heat dissipating fins. The heat dissipating fin assembly can enhance heat dissipating efficiency of the DRAM and reduce cost greatly.
摘要翻译：用于夹持DRAM以散热的示例性散热翅片组件包括以堆叠方式布置的多个散热翅片和轴。每个散热翅片在其中限定枢转孔和槽。散热片的槽被配置为用于接收DRAM。轴穿过每个散热片的枢转孔，以便排散散热片。散热片组件可以提高DRAM的散热效率，大大降低成本。

62. 发明申请

US20090049691A1 METHOD FOR EMBEDDING HEAT PIPE INTO HEAT-CONDUCTING SEAT 失效
标题翻译：将热管嵌入热导座椅的方法
公开(公告)号：US20090049691A1
公开(公告)日：2009-02-26
申请号：US12264651
申请日：2008-11-04
申请人： Chih-Hung Cheng , Kuo-Len Lin , Ken Hsu
发明人： Chih-Hung Cheng , Kuo-Len Lin , Ken Hsu
IPC分类号： B21D53/02
CPC分类号： F28D15/0275 , B23P2700/09 , F28D15/0233 , H01L23/427 , H01L2924/0002 , Y10T29/4935 , Y10T29/49353 , Y10T29/53113 , Y10T29/53122 , H01L2924/00
摘要： A method for embedding a heat pipe into a slot of heat-conducting seat is disclosed. The method has the exposed portion of the heat pipe be flat and coplanar with the surface of the heat-conducting seat after the heat pipe is embedded into the slot of the seat. The method utilizes a power press machine with multiple stamping dies to progressively press the heat pipe.
摘要翻译：公开了一种将热管嵌入导热座的槽中的方法。该方法在热管嵌入座椅的槽中之后，热管的暴露部分平坦并与导热座的表面共面。该方法利用具有多个冲压模的动力压力机逐渐按压热管。

63. 发明授权

US07866043B2 Method of flatting evaporating section of heat pipe embedded in heat dissipation device 有权
标题翻译：散热装置内埋置热管蒸发段的方法
公开(公告)号：US07866043B2
公开(公告)日：2011-01-11
申请号：US12110438
申请日：2008-04-28
申请人： Kuo-Len Lin , Wen-Jung Liu , Chih-Hung Cheng , Ken Hsu
发明人： Kuo-Len Lin , Wen-Jung Liu , Chih-Hung Cheng , Ken Hsu
IPC分类号： B21D53/02 , B23P6/00
CPC分类号： B21D53/02 , F28D15/0233 , F28D15/0275 , F28F2013/006 , F28F2275/12 , H01L21/4882 , H01L23/427 , H01L2924/0002 , Y10T29/49353 , H01L2924/00
摘要： A method of flatting evaporating section of a heat pipe embedded in a heat dissipation device includes the following steps: (a) providing at least a heat pipe and a base of the heat dissipation device to be thermally connected with the heat pipe, the base defining at least a groove for embedding the heat pipe therein; (b) positioning an evaporating section of the heat pipe on the groove of the base; (c) pressing the evaporating section of the heat pipe to embed the evaporating section into the groove of the base with a partial uneven surface of the evaporating section protruding out of the base; (d) flatting the protruded uneven surface of the evaporating section by polishing.
摘要翻译：嵌入散热装置的热管的蒸发部的平坦化方法包括以下步骤：（a）至少提供与热管热连接的散热装置的热管和底座，所述基部限定至少一个用于将热管嵌入其中的凹槽; （b）将热管的蒸发区域定位在基座的槽上; （c）按压热管的蒸发部分将蒸发部分嵌入到基部的槽中，其中蒸发部分的部分不平坦表面突出到基部之外; （d）通过抛光使蒸发部的凸出的不平坦表面平坦化。

64. 发明申请

US20090154097A1 HEAT-DISSIPATING DEVICE HAVING AIR-GUIDING COVER 失效
标题翻译：具有空气导向罩的散热装置
公开(公告)号：US20090154097A1
公开(公告)日：2009-06-18
申请号：US11954734
申请日：2007-12-12
申请人： Ken HSU , Chih-Hung Cheng , Kuo-Len Lin
发明人： Ken HSU , Chih-Hung Cheng , Kuo-Len Lin
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat-dissipating device having an air-guiding cover includes a heat-dissipating body, an air-guiding cover, a plurality of heat pipes, a fixing base and a fan. The heat-dissipating body is constituted of a plurality of heat-dissipating pieces that are stacked up at intervals. On the heat-dissipating body, venting channels and a plurality of through holes are provided. The air-guiding cover includes a hollow cylinder and an air-guiding blade. The hollow cylinder covers the heat-dissipating body. The air-guiding blade is accommodated in the venting channel. Each of the plurality of heat pipes includes a section to be heated and a heat-releasing section extending from the section to be heated. The heat-releasing section penetrates into the through hole. The bottom of the fixing base is provided with a plurality of grooves for accommodating the sections to be heated of the heat pipes. The fan is provided above the air-guiding cover. Via the above arrangement, the air-guiding cover guides the airflow blown by the fan, thereby enhancing the heat-dissipating effect.
摘要翻译：具有空气引导盖的散热装置包括散热体，空气引导盖，多个热管，固定基座和风扇。散热体由间隔堆叠的多个散热片构成。在散热体上设有排气通道和多个通孔。空气引导盖包括中空圆筒和导气叶片。中空圆筒覆盖散热体。导气叶片容纳在排气通道中。多个热管中的每一个都包括待加热部分和从被加热部分延伸的散热部分。散热部穿透通孔。固定底座的底部设置有用于容纳热管的待加热部分的多个槽。风扇设置在导气罩的上方。通过上述结构，空气引导盖引导风扇吹送的气流，从而提高散热效果。

65. 发明申请

US20080121377A1 Method For Connecting Heat-Dissipating Body And Heat Pipe And Structure Thereof 失效
标题翻译：连接散热体和热管及其结构的方法
公开(公告)号：US20080121377A1
公开(公告)日：2008-05-29
申请号：US11563005
申请日：2006-11-23
申请人： Kuo-Len Lin , Ken Hsu , Chih-Hung Cheng
发明人： Kuo-Len Lin , Ken Hsu , Chih-Hung Cheng
IPC分类号： F28D15/00 , H05K7/20
CPC分类号： F28D15/02 , F28F1/20 , F28F2215/10 , F28F2275/10 , H01L23/427 , H01L2924/0002 , Y10T29/49353 , Y10T29/49368 , Y10T29/53109 , H01L2924/00
摘要： A method for connecting a heat-dissipating body and a heat pipe and the structure thereof are used to improve the efficiency of heat conduction. The structure includes a heat-dissipating body and a heat pipe. The central position of the heat-dissipating body is provided with an accommodating trough for accommodating the heat pipe. A plurality of corresponding slots extends outwardly from the periphery of the trough. The other end of the slot is connected to a through hole. Tools are disposed in the slots to widen the slots and thus the periphery of the trough, so that the inner diameter of the trough is larger than the outer diameter of the heat pipe. After the heat pipe penetrates into the trough, the tools are removed, so that the inner wall surface of the trough abuts tightly against the outer circumferential surface of the heat pipe. Thus, the optimal efficiency of heat conduction between the heat pipe and the heat-dissipating body can be achieved.
摘要翻译：用于连接散热体和热管的方法及其结构用于提高热传导的效率。该结构包括散热体和热管。散热体的中心位置设置有用于容纳热管的容纳槽。多个相应的槽从槽的周边向外延伸。槽的另一端连接到通孔。工具设置在槽中以加宽槽的槽，从而加宽槽的周边，使得槽的内径大于热管的外径。在热管穿透槽之后，移除工具，使得槽的内壁表面紧紧地抵靠热管的外周表面。因此，可以实现热管和散热体之间的热传导的最佳效率。

66. 发明授权

US08528627B2 Heat-dissipating device having air-guiding cover 失效
标题翻译：具有导气盖的散热装置
公开(公告)号：US08528627B2
公开(公告)日：2013-09-10
申请号：US11954734
申请日：2007-12-12
申请人： Ken Hsu , Chih-Hung Cheng , Kuo-Len Lin
发明人： Ken Hsu , Chih-Hung Cheng , Kuo-Len Lin
IPC分类号： H01L23/467
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A wind guider of integrated circuit heat dissipation structure includes a first connecting portion, wide-guiding pipes, a second connecting portion and wind-guiding holes. The first connecting portion is connected to heat-dissipating fins. The wide-guiding pipes are integrally connected to the first connecting portion. The second connecting portion is integrally connected to the wide-guiding pipes. A heat-dissipating fan is mounted in the second connecting portion. The second connecting portion is not in parallel to the first connecting portion. The wide-guiding holes run through the first connecting portion, the wide-guiding pipes and the second connecting portion. Since the second connecting portion is not in parallel to the first connecting portion, a cooling airflow generated by the heat-dissipating fan in the second connecting portion can blow to a region corresponding to the heat-dissipating fins. Thus, the cooling airflow blows to the hottest portion of the heat-dissipating fins directly, thereby improving the cooling efficiency and lowering the temperature of the integrated circuit.
摘要翻译：集成电路散热结构的导风装置包括第一连接部分，宽引导管，第二连接部分和导风孔。第一连接部分连接到散热片。宽引导管与第一连接部一体连接。第二连接部分一体地连接到宽导向管。散热风扇安装在第二连接部分中。第二连接部不与第一连接部平行。宽引导孔贯穿第一连接部分，宽引导管和第二连接部分。由于第二连接部不与第一连接部平行，所以由第二连接部中的散热风扇产生的冷却气流可以吹向与散热翅片对应的区域。因此，冷却气流直接吹向散热片的最热的部分，从而提高冷却效率，降低集成电路的温度。

67. 发明申请

US20090266522A1 METHOD OF FLATTING EVAPORATING SECTION OF HEAT PIPE EMBEDDED IN HEAT DISSIPATION DEVICE AND HEAT DISSIPATION DEVICE WITH HEAT PIPE 有权
标题翻译：散热装置中嵌入的热管蒸发部分与热管散热装置的方法
公开(公告)号：US20090266522A1
公开(公告)日：2009-10-29
申请号：US12110438
申请日：2008-04-28
申请人： Kuo-Len Lin , Wen-Jung Liu , Chih-Hung Cheng , Ken Hsu
发明人： Kuo-Len Lin , Wen-Jung Liu , Chih-Hung Cheng , Ken Hsu
IPC分类号： F28D15/02 , B21D53/02
CPC分类号： B21D53/02 , F28D15/0233 , F28D15/0275 , F28F2013/006 , F28F2275/12 , H01L21/4882 , H01L23/427 , H01L2924/0002 , Y10T29/49353 , H01L2924/00
摘要： A method of flatting evaporating section of a heat pipe embedded in a heat dissipation device includes the following steps: (a) providing at least a heat pipe and a base of the heat dissipation device to be thermally connected with the heat pipe, the base defining at least a groove for embedding the heat pipe therein; (b) positioning an evaporating section of the heat pipe on the groove of the base; (c) pressing the evaporating section of the heat pipe to embed the evaporating section into the groove of the base with a partial uneven surface of the evaporating section protruding out of the base; (d) flatting the protruded uneven surface of the evaporating section by polishing.
摘要翻译：嵌入散热装置的热管的蒸发部的平坦化方法包括以下步骤：（a）至少提供与热管热连接的散热装置的热管和底座，所述基部限定至少一个用于将热管嵌入其中的凹槽; （b）将热管的蒸发区域定位在基座的槽上; （c）按压热管的蒸发部分将蒸发部分嵌入到基部的槽中，其中蒸发部分的部分不平坦表面突出到基部之外; （d）通过抛光使蒸发部的凸出的不平坦表面平坦化。

68. 发明申请

US20070261244A1 Leveling Method for Embedding Heat Pipe in Heat-Conducting Seat 审中-公开
标题翻译：在导热座中嵌入热管的调平方法
公开(公告)号：US20070261244A1
公开(公告)日：2007-11-15
申请号：US11383192
申请日：2006-05-12
申请人： Chih-Hung Cheng , Kuo-Len Lin , Ken Hsu
发明人： Chih-Hung Cheng , Kuo-Len Lin , Ken Hsu
IPC分类号： B21D53/02 , B23P6/00
CPC分类号： B21D39/00 , B21D53/02 , B23P2700/09 , F28D15/02 , F28D15/0233 , F28D15/0275 , Y10T29/4935 , Y10T29/49353
摘要： A leveling method for embedding a heat pipe in a heat-conducting seat includes preparing at least one heat pipe and a heat-conducting seat connected to the heat pipe, providing grooves at the bottom surface of the heat-conducting seat for embedding the heat pipe therein; horizontally arranging the heat pipe into the groove of the heat-conducting seat, pressing inwardly the portion of the heat pipe projecting from the groove into the groove via a first upper mold, forming a concave surface on the contacting surface between the first upper mold and the heat pipe; and pressing the heat pipe via a second upper mold to make the contacting surface between the second upper mold and the heat pipe substantially a leveled surface. In this way, the stress concentration caused by the pressing operation of the heat pipe can be reduced, and thus a more leveled surface to be heated of the heat pipe can be obtained.
摘要翻译：将热管嵌入导热座中的调平方法包括制备至少一个热管和连接到热管的导热座，在导热座的底表面设置用于嵌入热管的槽其中将热管水平布置在导热座的凹槽内，通过第一上模向内压入从凹槽突出的热管的部分，在第一上模和第二上模之间的接触表面上形成凹面; 热管; 并且经由第二上模压制所述热管，使得所述第二上模和所述热管之间的接触面基本上为平整的表面。以这种方式，可以减少由热管的按压操作引起的应力集中，从而可以获得热管的待加热表面。

69. 发明申请

US20100282444A1 HEAT-DISSIPATING FIN ASSEMBLY WITH HEAT-CONDUCTING STRUCTURE 审中-公开
标题翻译：热传导结构散热装置
公开(公告)号：US20100282444A1
公开(公告)日：2010-11-11
申请号：US12512341
申请日：2009-07-30
申请人： Kuo-Len LIN , Chih-Hung Cheng , Kuan-Da Pan
发明人： Kuo-Len LIN , Chih-Hung Cheng , Kuan-Da Pan
IPC分类号： F28D15/04 , F28F7/00
CPC分类号： F28D15/0275 , F28F1/325 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a heat-dissipating fin capable of increasing surface turbulence, which includes a first heat-dissipating fin and a second heat-dissipating fin. A first surface of the first heat-dissipating fin is provided with a plurality of first protrusions arranged at intervals. The second heat-dissipating fin has a second surface toward the first surface. The second surface is also provided with a plurality of second protrusions arranged at intervals. The second protrusions are arranged to correspond to the first protrusions. The second heat-dissipating fin is overlapped with the first heat-dissipating fin. With the arrangement of the first protrusions and the second protrusions, the heat-dissipating area of the first heat-dissipating fin and the second heat-dissipating fin can be increased so as to increase the surface turbulence. Thus, the heat-exchange efficiency can be enhanced.
摘要翻译：本发明涉及能够增加表面紊流的散热片，其包括第一散热翅片和第二散热翅片。第一散热片的第一表面设置有间隔设置的多个第一突起。第二散热片具有朝向第一表面的第二表面。第二表面还设置有间隔布置的多个第二突起。第二突起被布置成对应于第一突起。第二散热片与第一散热片重叠。通过第一突起和第二突起的布置，可以增加第一散热片和第二散热片的散热面积，以增加表面紊流。因此，可以提高热交换效率。

70. 发明授权

US07891414B2 Method for manufacturing heat dissipator having heat pipes and product of the same 有权
标题翻译：具有热管及其制品的散热器的制造方法
公开(公告)号：US07891414B2
公开(公告)日：2011-02-22
申请号：US11863583
申请日：2007-09-28
申请人： Chih-Hung Cheng , Ken Hsu
发明人： Chih-Hung Cheng , Ken Hsu
IPC分类号： H05K7/20
CPC分类号： F28D15/0275 , F28D15/0233 , F28F2210/08 , Y10T29/4935 , Y10T29/49353
摘要： A heat dissipator having heat pipes includes a heat-conducting base, a first heat pipe and a second heat pipe. The heat-conducting base has an accommodating trough. After the first heat pipe is accommodated in the accommodating trough, it is deformed so as to abut against the inner wall face of the accommodating trough. Further, the second heat pipe and the first heat pipe are provided in the same accommodating trough, and the second heat pipe is overlapped vertically on the first heat pipe. As a result, the second heat pipe is deformed so as to abut against the first heat pipe and the interior of the accommodating trough, thereby enhancing the heat-conducting performance of the heat dissipator.
摘要翻译：具有热管的散热器包括导热基座，第一热管和第二热管。导热基座具有容纳槽。在第一热管容纳在容纳槽中之后，其变形以抵靠容纳槽的内壁面。此外，第二热管和第一热管设置在相同的容纳槽中，第二热管在第一热管上垂直重叠。结果，第二热管变形成与第一热管和容纳槽的内部抵接，从而提高散热器的导热性能。

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