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    • 61. 发明授权
    • Pattern forming method
    • 图案形成方法
    • US08673771B2
    • 2014-03-18
    • US13597014
    • 2012-08-28
    • Daisuke Kawamura
    • Daisuke Kawamura
    • H01L21/00
    • H01L21/76838H01L21/0272H01L21/0332H01L21/0337H01L21/31144H01L21/76816H01L21/76885H01L21/76897
    • According to one embodiment, a pattern forming method comprises forming, on a metal layer and an insulating layer, an underlying layer the surface state of which is changeable by irradiation with a light ray, radiating the light ray to the underlying layer, thereby changing the surface state of a portion of the underlying layer above the metal layer, forming a block polymer layer on the underlying layer, forming, on the underlying layer, a directed self-assembly phase which contains a first polymer portion and a second polymer portion, the first polymer portion being positioned above the underlying layer portion the surface state of which has been changed by the radiation of the light ray, removing the first polymer portion, and the underlying layer portion underneath the first polymer portion to make a hole, and burying a conductive film into the hole.
    • 根据一个实施例,图案形成方法包括在金属层和绝缘层上形成其表面状态可通过用光线照射而变化的下层,将光线照射到下层,从而改变 在金属层上方的下层的一部分的表面状态,在下层上形成嵌段聚合物层,在下层上形成包含第一聚合物部分和第二聚合物部分的定向自组装相, 第一聚合物部分位于下面的层部分之上,其表面状态已经被光线的辐射改变,去除第一聚合物部分,并且在第一聚合物部分下方形成下面的层部分以形成孔,并且将 导电膜进入孔。