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61. 发明授权

US07705093B2 Phosphor-filled curable silicone resin composition and cured product thereof 有权
标题翻译：荧光填充固化性有机硅树脂组合物及其固化物
公开(公告)号：US07705093B2
公开(公告)日：2010-04-27
申请号：US11762445
申请日：2007-06-13
申请人： Tsutomu Kashiwagi , Toshio Shiobara
发明人： Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： C08G77/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08G77/70 , C08K3/32 , C08L83/00
摘要： A phosphor-containing addition-curable silicone resin composition is provided. The composition is capable of forming a cured product which exhibits excellent crack resistance and shock resistance, and minimal surface tackiness. The composition includes (A) an organopolysiloxane including R1SiO1.5 units (T units), R22SiO units (D units), and R3aR4bSiO(4-a-b)/2 units (wherein, R1, R2 and R3 represent a methyl group or the like, R4 represents a vinyl group or allyl group, a represents an integer from 0 to 2, b represents 1 or 2, and a+b is either 2 or 3), in which the number of repetitions of the D units is within a range from 5 to 300; (B) an Si—H-containing polysiloxane including T units, D units, and R3cHdSiO(4-c-d)/2 units (wherein, c represents an integer from 0 to 2, d represents 1 or 2, and c+d is either 2 or 3), in which the number of repetitions of the D units is within a range from 5 to 300, in sufficient quantity that the molar ratio of Si-bonded hydrogen atoms within (B), relative to vinyl groups or allyl groups within (A), is within a range from 0.1 to 4.0; (C) a catalyst; and (D) a phosphor.
摘要翻译：提供含磷光体的可加成固化的有机硅树脂组合物。该组合物能够形成表现出优异的抗裂性和抗冲击性和最小表面粘性的固化产物。该组合物包含（A）包含R1SiO1.5单元（T单元），R22SiO单元（D单元）和R3aR4bSiO（4-ab）/ 2单元的有机聚硅氧烷（其中，R1，R2和R3表示甲基等，R4表示乙烯基或烯丙基，a表示0〜2的整数，b表示1或2，a + b为2或3），D单元的重复数在从5到300; （B）包含T单元，D单元和R3cHdSiO（4-cd）/ 2单元的Si-H的聚硅氧烷（其中，c表示0至2的整数，d表示1或2，c + d为 2或3），其中D单元的重复数在5至300的范围内，其量足以使（B）内的与Si键合的氢原子相对于乙烯基或烯丙基的摩尔比（A）范围内，为0.1〜4.0; （C）催化剂; 和（D）荧光体。

62. 发明授权

US07563854B2 Method of producing high molecular weight organopolysiloxane, composition comprising the high molecular weight organopolysiloxane, and optical semiconductor device sealed with cured product thereof 有权
标题翻译：生产高分子量有机聚硅氧烷的方法，包含高分子量有机聚硅氧烷的组合物和用其固化产物密封的光学半导体器件
公开(公告)号：US07563854B2
公开(公告)日：2009-07-21
申请号：US11586525
申请日：2006-10-26
申请人： Hisashi Shimizu , Toshio Shiobara , Tsutomu Kashiwagi
发明人： Hisashi Shimizu , Toshio Shiobara , Tsutomu Kashiwagi
IPC分类号： C08G77/06
CPC分类号： C08G77/04 , C08G77/06 , C08G77/08 , C08G77/14 , Y10T428/31663
摘要： Provided is a method of producing a high molecular weight organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 5×104, comprising the steps of producing an organopolysiloxane by subjecting a silane compound having a hydrolyzable group to a first hydrolysis and condensation, and then subjecting that organopolysiloxane to an additional second hydrolysis and condensation. The high molecular weight organopolysiloxane is stable, resistant to gelling, and resistant to cracking even when formed as a thick film. A resin composition comprising the high molecular weight organopolysiloxane and a condensation catalyst is useful for sealing an optical element and for producing an optical semiconductor device.
摘要翻译：本发明提供一种聚苯乙烯换算重均分子量为5×10 4以上的高分子量有机聚硅氧烷的制造方法，其特征在于，包括使具有水解性基团的硅烷化合物进行第一次水解缩合而制造有机聚硅氧烷的工序，该有机聚硅氧烷再次进行水解和缩合。高分子量有机聚硅氧烷是稳定的，耐胶凝的，即使形成厚膜也能耐裂纹。包含高分子量有机聚硅氧烷和缩合催化剂的树脂组合物可用于密封光学元件并用于制造光学半导体器件。

63. 发明授权

US07550204B2 Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element 有权
标题翻译：用于密封光学元件的树脂组合物，其固化产物，以及密封半导体元件的方法
公开(公告)号：US07550204B2
公开(公告)日：2009-06-23
申请号：US11586564
申请日：2006-10-26
申请人： Hisashi Shimizu , Toshio Shiobara , Tsutomu Kashiwagi
发明人： Hisashi Shimizu , Toshio Shiobara , Tsutomu Kashiwagi
IPC分类号： B32B9/04 , C08G77/18
CPC分类号： C08L83/04 , C08G77/14 , C08G77/18 , C08G77/20 , C08G77/70 , C08J7/047 , C08J2483/00 , C08K5/0091 , H01L23/296 , H01L2924/0002 , Y10T428/31663 , H01L2924/00
摘要： The present invention provides a composition for sealing an optical device comprising (i) a silylated organopolysiloxane with a polystyrene equivalent weight average molecular weight of 5×104 or greater, represented by an average composition formula: R1a(OX)bSiO(4−a−b)/2 (wherein, R1 represents an alkyl group, alkenyl group, or aryl group; X represents a combination of a group represented by a formula —SiR2R3R4 (wherein, RE to R4 are monovalent hydrocarbon groups), and an alkyl group, alkenyl group, alkoxyalkyl group or acyl group; a represents a number within a range from 1.00 to 1.5; b represents a number that satisfies 0 b 2, and a+b satisfies 1.00 a+b 2), and (ii) a condensation catalyst, as well as a transparent cured product obtained by curing the composition, and a method of sealing a semiconductor element that comprises a step of applying the composition to a semiconductor element, and a step of curing the composition that has been applied to the semiconductor element. The composition can form a coating film that exhibits excellent levels of heat resistance, ultraviolet light resistance, optical transparency, toughness and adhesion.
摘要翻译：本发明提供了一种用于密封光学装置的组合物，其包含（i）聚苯乙烯换算的重均分子量为5×10 4或更大的甲硅烷基化有机聚硅氧烷，其平均组成式为：<？in-line-formula description =“In- 线形式“end =”lead“→> R1a（OX）bSiO（4-ab）/ 2 <？in-line-formula description =”In-line Formulas“end =”tail“？>（其中，R1表示烷基，烯基或芳基; X表示由式-SiR 2 R 3 R 4表示的基团（其中，RE至R 4为一价烃基）和烷基，烯基，烷氧基烷基或酰基的组合; 表示在1.00〜1.5的范围内的数字; b表示满足0 b 2的数，a + b满足1.00 a + b 2），（ii）缩合催化剂，以及由固化组合物，以及密封半导体元件的方法，其包括施加组合物的步骤涉及半导体元件，以及固化已经施加到半导体元件上的组合物的步骤。该组合物可以形成表现出优异的耐热性，耐紫外线性，光学透明性，韧性和粘附性的涂膜。

64. 发明申请

US20070249790A1 Silicone lens and silicone resin composition for molding lens 有权
标题翻译：硅胶透镜和用于成型镜片的硅树脂组合物
公开(公告)号：US20070249790A1
公开(公告)日：2007-10-25
申请号：US11785791
申请日：2007-04-20
申请人： Tsutomu Kashiwagi , Toshio Shiobara
发明人： Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： C08L83/04 , C08G77/00
CPC分类号： C08L83/04 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , C08G77/80 , C08K5/56 , C08L83/00
摘要： A colorless transparent silicone lens produced by thermally curing a silicone resin composition comprising (A) an organopolysiloxane having a resin structure comprising R1SiO1.5 unit, R22SiO unit, and R3aR4bSiO(4-a-b)/2 unit wherein R1, R2, and R3 are independently methyl group, ethyl group, propyl group, cyclohexyl group, or phenyl group, R4 is vinyl group or allyl group, a is 0, 1, or 2, b is 1 or 2, and a+b is 2 or 3, and wherein number of repetition of the R22SiO unit is 5 to 300, (B) an organohydrogen polysiloxane having a resin structure comprising R1SiO1.5 unit, R22SiO unit, and R3cHdSiO(4-c-d)/2 unit wherein c is 0, 1, or 2, d is 1 or 2, and c+d is 2 or 3, and wherein number of repetition of the R22SiO unit is 5 to 300, the component, and (C) a platinum group catalyst. A silicone lens having excellent flexibility, transparency, and moldability as well as reduced surface tackiness is provided.
摘要翻译：通过热固化有机硅树脂组合物制得的无色透明硅氧烷透镜，该有机硅树脂组合物包含（A）具有包含R 1 SiO 1/2单元的树脂结构的有机聚硅氧烷，R 2， SiO 2单元和R 3 SiO 2 SiO 2 SiO 2单元和/或SiO 2 其中R 1，R 2和R 3独立地是（4-ab）/ 2单元独立地是甲基乙基，丙基，环己基或苯基，R 4是乙烯基或烯丙基，a是0,1或2，b是1或2，a + b是 2或3，其中R 2 SiO 2 SiO单元的重复次数为5〜300，（B）具有包含R 2 SiO 2的树脂结构的有机氢聚硅氧烷， 1个SiO 1单元，R 2 O 2 SiO单元和R 3 -S 3单元其中c为0,1或2，d为1或2，c + d为（4-cd）/ 2单元 2或3，其中R 2 O 2 SiO单元的重复次数为5〜300，该成分为（C）铂族催化剂。提供了具有优异的柔性，透明性和成型性以及降低的表面粘性的硅氧烷透镜。

65. 发明申请

US20070066796A1 Resin solution composition, polyimide resin, and semiconductor device 有权
标题翻译：树脂溶液组合物，聚酰亚胺树脂和半导体器件
公开(公告)号：US20070066796A1
公开(公告)日：2007-03-22
申请号：US11475043
申请日：2006-06-27
申请人： Hideki Akiba , Toshio Shiobara
发明人： Hideki Akiba , Toshio Shiobara
IPC分类号： C08G69/26
CPC分类号： H01L23/296 , C08L79/08 , C08L2205/02 , C09D179/08 , H01L2924/0002 , C08L2666/20 , H01L2924/00
摘要： A resin solution composition comprising (A) a polyamic acid resin, (B) an alkoxysilyl-containing polyamic acid resin, and (C) an organic solvent cures into a product that has good substrate adhesion and heat resistance and is effective in forming a protective film on a semiconductor device prior to encapsulation with epoxy resin molding material (molding compound) in that it overcomes the chip cracking and thermal deterioration problems of semiconductor packages by thermal stress.
摘要翻译：包含（A）聚酰胺酸树脂，（B）含烷氧基甲硅烷基的聚酰胺酸树脂和（C）有机溶剂的树脂溶液组合物固化成具有良好的基材粘合性和耐热性的产品，并且有效地形成保护在用环氧树脂成型材料（模塑料）封装之前，半导体器件上的薄膜通过热应力克服了半导体封装的芯片裂纹和热劣化问题。

66. 发明授权

US07169833B2 Liquid epoxy resin composition and semiconductor device 有权
标题翻译：液体环氧树脂组合物和半导体器件
公开(公告)号：US07169833B2
公开(公告)日：2007-01-30
申请号：US10808329
申请日：2004-03-25
申请人： Kazuaki Sumita , Kaoru Katoh , Tokue Kojima , Toshio Shiobara
发明人： Kazuaki Sumita , Kaoru Katoh , Tokue Kojima , Toshio Shiobara
IPC分类号： C08K5/101 , C08K5/103 , C08L63/00 , C08L63/02
CPC分类号： C08G59/5033 , C08L63/00 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/83951 , H01L2924/00014 , C08L83/00 , H01L2924/00 , H01L2224/0401
摘要： A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) an aromatic amine curing agent comprising 5–100% by weight of a specific aromatic amine compound having a purity of at least 99%, (C) an inorganic filler, and (D) an ester organic solvent having a boiling point of 130–250° C. is useful for semiconductor encapsulation. The composition has an infiltration ability, adhesion to silicon chips, resistance to deterioration under hot humid conditions, and resistance to thermal shocks.
摘要翻译：一种液体环氧树脂组合物，其包含（A）液体环氧树脂，（B）包含5-100重量％的纯度至少为99％的特定芳族胺化合物的芳族胺固化剂，（C）无机填料，（D）沸点为130-250℃的酯类有机溶剂可用于半导体封装。该组合物具有渗透能力，对硅片的粘附性，耐热湿条件下的耐劣化性和耐热冲击性。

67. 发明申请

US20060035092A1 Resin composition for sealing LED elements and cured product generated by curing the composition 审中-公开
标题翻译：用于密封LED元件的树脂组合物和通过固化组合物产生的固化产物
公开(公告)号：US20060035092A1
公开(公告)日：2006-02-16
申请号：US11199175
申请日：2005-08-09
申请人： Hisashi Shimizu , Tsutomu Kashiwagi , Toshio Shiobara
发明人： Hisashi Shimizu , Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： B32B27/04 , C08L83/04 , H01L21/00
CPC分类号： C09D183/04 , H01L33/56 , Y10T428/31663
摘要： Provided is a resin composition for sealing LED elements, including (i) an organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 5×103, represented by an average composition formula (1): R1a(OX)bSiO(4-a-b)/2, in which, each R1 represents, independently, an alkyl group, alkenyl group or aryl group of 1 to 6 carbon atoms, each X represents, independently, a hydrogen atom, or an alkyl group, alkenyl group, alkoxyalkyl group or acyl group of 1 to 6 carbon atoms, a represents a number within a range from 1.05 to 1.5, b represents a number that satisfies 0
摘要翻译：提供一种用于密封LED元件的树脂组合物，其包含（i）由平均组成式（1）表示的聚苯乙烯换算重均分子量为至少5×10 3的有机聚硅氧烷：R

68. 发明申请

US20050244649A1 Epoxy-silicone mixed resin composition and light-emitting semiconductor device 有权
标题翻译：环氧硅酮混合树脂组合物和发光半导体装置
公开(公告)号：US20050244649A1
公开(公告)日：2005-11-03
申请号：US11116295
申请日：2005-04-28
申请人： Tsutomu Kashiwagi , Toshio Shiobara
发明人： Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： C08L63/00 , B32B27/38 , C08G59/40 , C08L83/04 , H01L33/48 , H01L33/56 , H01S5/022
CPC分类号： C08L83/04 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/20 , C08G77/70 , C08L63/00 , H01L33/56 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73265 , H01L2924/12044 , Y10T428/31511 , Y10T428/31663 , C08L2666/14 , C08L83/00 , C08L2666/02 , H01L2924/00014 , H01L2924/00
摘要： An epoxy-silicone mixed resin composition to give a transparent cured product which comprises [I] 100 parts by weight of a curable resin composition containing an organosilicon compound and an epoxy resin as essential components, and [II] 0.1 to 50 parts by weight of a silicone elastomer having a refractive index within 10% of that of a cured product of the curable resin composition. It is suitable for use as an encapsulator for light-emitting semiconductors.
摘要翻译：一种环氧硅酮混合树脂组合物，得到透明固化物，其包含[I] 100重量份的含有有机硅化合物和环氧树脂作为必要成分的固化性树脂组合物，[II]将0.1〜50重量份折射率在固化树脂组合物的固化物的折射率的10％以内的有机硅弹性体。适用于发光半导体的封装。

69. 发明申请

US20050065296A1 Adhesive composition and adhesive film 有权
标题翻译：粘合剂组合物和粘合剂膜
公开(公告)号：US20050065296A1
公开(公告)日：2005-03-24
申请号：US10942077
申请日：2004-09-16
申请人： Shouhei Kozakai , Nobuhiro Ichiroku , Akio Suzuki , Toshio Shiobara
发明人： Shouhei Kozakai , Nobuhiro Ichiroku , Akio Suzuki , Toshio Shiobara
IPC分类号： C09J7/02 , C08L63/00 , C08L79/08 , C09J7/00 , C09J163/00 , C09J177/00 , C09J179/08 , C09J183/10 , H01L21/52 , C08L83/04
CPC分类号： C09J179/08 , C08L63/00 , C08L79/085 , C08L2666/14 , C08L2666/20 , C08L2666/22 , C09J7/10 , C09J163/00 , C09J183/10 , C09J2463/00 , C09J2479/08 , Y10T428/31511 , Y10T428/31663 , Y10T428/31721 , Y10T428/31786 , Y10T428/31855
摘要： An adhesive composition is provided comprising (A) a polyimide resin containing a diorganopolysiloxane linkage having vinyl groups as organic substituent groups on the backbone, (B) an epoxy resin, and (C) an epoxy resin-curing catalyst. An adhesive film prepared from the adhesive composition has a high bond strength to various substrates and to encapsulating resins when thermocompression bonded and heat cured thereto, and possesses a low modulus of elasticity and high heat resistance, ensuring manufacture of resin packaged semiconductor devices with high reliability.
摘要翻译：提供了一种粘合剂组合物，其包含（A）在主链上含有具有乙烯基作为有机取代基的二有机聚硅氧烷键的聚酰亚胺树脂，（B）环氧树脂和（C）环氧树脂固化催化剂。由粘合剂组合物制备的粘合剂膜对于各种基材具有高的粘合强度，并且当热压粘合并热固化时具有高的粘合强度，并且具有低弹性模量和高耐热性，确保制造具有高可靠性的树脂封装的半导体器件。

70. 发明授权

US06506822B2 Epoxy resin composition 有权
公开(公告)号：US06506822B2
公开(公告)日：2003-01-14
申请号：US09898026
申请日：2001-07-05
申请人： Nobuhiro Ichiroku , Miyuki Wakao , Toshio Shiobara
发明人： Nobuhiro Ichiroku , Miyuki Wakao , Toshio Shiobara
IPC分类号： C08L6300
CPC分类号： H01L23/293 , C08L63/00 , H01L2924/0002 , C08L83/00 , H01L2924/00
摘要： An epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, and (C) a silicone stress-reducing agent further includes (D) a foam-suppressing composition comprising (D-i) an oil compound consisting of a hydrophobic organopolysiloxane and finely divided silica, (D-ii) a hydrophilic polyoxyalkylene-modified silicone oil, and optionally, (D-iii) a polyoxyalkylene polymer. The epoxy resin composition has the advantages of improved infiltration to semiconductor device-substrate gaps and minimized formation of internal and surface voids.

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