专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07244495B2 Dicing/die bonding adhesion tape 失效
标题翻译：切割/芯片粘合胶带
公开(公告)号：US07244495B2
公开(公告)日：2007-07-17
申请号：US10829150
申请日：2004-04-22
申请人： Shouhei Kozakai , Akio Suzuki , Nobuhiro Ichiroku , Toshio Shiobara
发明人： Shouhei Kozakai , Akio Suzuki , Nobuhiro Ichiroku , Toshio Shiobara
IPC分类号： C09J7/02 , B32B7/12
CPC分类号： H01L21/6836 , C09J7/22 , C09J7/38 , C09J2201/36 , C09J2203/326 , C09J2483/00 , H01L24/27 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/8319 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , Y10T428/28 , Y10T428/2848 , Y10T428/2852 , Y10T428/287 , Y10T428/2878 , Y10T428/2887 , Y10T428/31663 , H01L2924/00 , H01L2924/01026 , H01L2924/01028
摘要： A dicing/die bonding adhesion tape includes a substrate, a silicone adhesive layer, and a bonding layer. A tack strength of 0.2–2.0 N/25 mm is developed between the silicone adhesive layer and the bonding layer. The bonding layer is formed of a bonding composition comprising (A) a polyimide resin, (B) an epoxy resin, and (C) an epoxy resin curing catalyst.
摘要翻译：切割/贴合粘合带包括基底，硅氧烷粘合剂层和粘合层。在硅胶粘合剂层和粘合层之间产生0.2-2.0N / 25mm的粘着强度。接合层由包含（A）聚酰亚胺树脂，（B）环氧树脂和（C）环氧树脂固化催化剂的粘合组合物形成。

2. 发明申请

US20050065296A1 Adhesive composition and adhesive film 有权
标题翻译：粘合剂组合物和粘合剂膜
公开(公告)号：US20050065296A1
公开(公告)日：2005-03-24
申请号：US10942077
申请日：2004-09-16
申请人： Shouhei Kozakai , Nobuhiro Ichiroku , Akio Suzuki , Toshio Shiobara
发明人： Shouhei Kozakai , Nobuhiro Ichiroku , Akio Suzuki , Toshio Shiobara
IPC分类号： C09J7/02 , C08L63/00 , C08L79/08 , C09J7/00 , C09J163/00 , C09J177/00 , C09J179/08 , C09J183/10 , H01L21/52 , C08L83/04
CPC分类号： C09J179/08 , C08L63/00 , C08L79/085 , C08L2666/14 , C08L2666/20 , C08L2666/22 , C09J7/10 , C09J163/00 , C09J183/10 , C09J2463/00 , C09J2479/08 , Y10T428/31511 , Y10T428/31663 , Y10T428/31721 , Y10T428/31786 , Y10T428/31855
摘要： An adhesive composition is provided comprising (A) a polyimide resin containing a diorganopolysiloxane linkage having vinyl groups as organic substituent groups on the backbone, (B) an epoxy resin, and (C) an epoxy resin-curing catalyst. An adhesive film prepared from the adhesive composition has a high bond strength to various substrates and to encapsulating resins when thermocompression bonded and heat cured thereto, and possesses a low modulus of elasticity and high heat resistance, ensuring manufacture of resin packaged semiconductor devices with high reliability.
摘要翻译：提供了一种粘合剂组合物，其包含（A）在主链上含有具有乙烯基作为有机取代基的二有机聚硅氧烷键的聚酰亚胺树脂，（B）环氧树脂和（C）环氧树脂固化催化剂。由粘合剂组合物制备的粘合剂膜对于各种基材具有高的粘合强度，并且当热压粘合并热固化时具有高的粘合强度，并且具有低弹性模量和高耐热性，确保制造具有高可靠性的树脂封装的半导体器件。

3. 发明授权

US07364797B2 Adhesive composition and adhesive film 有权
标题翻译：粘合剂组合物和粘合剂膜
公开(公告)号：US07364797B2
公开(公告)日：2008-04-29
申请号：US10942077
申请日：2004-09-16
申请人： Shouhei Kozakai , Nobuhiro Ichiroku , Akio Suzuki , Toshio Shiobara
发明人： Shouhei Kozakai , Nobuhiro Ichiroku , Akio Suzuki , Toshio Shiobara
IPC分类号： B32B9/04 , C08G77/455
CPC分类号： C09J179/08 , C08L63/00 , C08L79/085 , C08L2666/14 , C08L2666/20 , C08L2666/22 , C09J7/10 , C09J163/00 , C09J183/10 , C09J2463/00 , C09J2479/08 , Y10T428/31511 , Y10T428/31663 , Y10T428/31721 , Y10T428/31786 , Y10T428/31855
摘要： An adhesive composition is provided comprising (A) a polyimide resin containing a diorganopolysiloxane linkage having vinyl groups as organic substituent groups on the backbone, (B) an epoxy resin, and (C) an epoxy resin-curing catalyst. An adhesive film prepared from the adhesive composition has a high bond strength to various substrates and to encapsulating resins when thermocompression bonded and heat cured thereto, and possesses a low modulus of elasticity and high heat resistance, ensuring manufacture of resin packaged semiconductor devices with high reliability.
摘要翻译：提供了一种粘合剂组合物，其包含（A）在主链上含有具有乙烯基作为有机取代基的二有机聚硅氧烷键的聚酰亚胺树脂，（B）环氧树脂和（C）环氧树脂固化催化剂。由粘合剂组合物制备的粘合剂膜对于各种基材具有高的粘合强度，并且当热压粘合并热固化时具有高的粘合强度，并且具有低弹性模量和高耐热性，确保制造具有高可靠性的树脂封装的半导体器件。

4. 发明授权

US07488539B2 Adhesive composition and sheet having an adhesive layer of the composition 失效
标题翻译：粘合剂组合物和具有该组合物的粘合剂层的片材
公开(公告)号：US07488539B2
公开(公告)日：2009-02-10
申请号：US11583699
申请日：2006-10-20
申请人： Shouhei Kozakai , Nobuhiro Ichiroku
发明人： Shouhei Kozakai , Nobuhiro Ichiroku
IPC分类号： B32B9/04 , B32B27/00 , B32B27/06
CPC分类号： C09J163/00 , C08L63/00 , C08L79/08 , C08L83/00 , C08L2666/14 , C08L2666/20 , C08L2666/22 , C09J7/22 , C09J7/38 , C09J179/08 , C09J183/10 , C09J2201/36 , C09J2201/622 , C09J2479/08 , C09J2483/00 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29191 , H01L2224/2929 , H01L2224/293 , H01L2224/83191 , H01L2224/8385 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01021 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/12042 , H01L2924/181 , Y10T428/31663 , Y10T428/31721 , H01L2924/0715 , H01L2924/07025 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： An adhesive composition comprising 5 to 60 wt % of (A) a polyimidesilicone resin 5 to 60 wt % of (B) an epoxy resin having a softening point of 80° C. or lower, 0.001 to 20 wt % of (C) at least one epoxy resin curing catalyst selected from imidazole compounds and dicyandiamide 20 to 70 wt % of (D) spherical silica having an average diameter of 0.1 to 10 μm, and 5 to 30 wt % of (E) spherical fine particles of silicone rubber composite, wt % being based on a total weight of the composition.
摘要翻译：一种粘合剂组合物，其包含5至60重量％的（A）聚酰亚胺硅酮树脂5至60重量％的（B）软化点为80℃或更低的环氧树脂，（C）在选自咪唑化合物和双氰胺的至少一种环氧树脂固化催化剂20至70重量％的（D）平均直径为0.1至10微米的球形二氧化硅和5至30重量％的（E）球形微粒硅橡胶复合材料，wt％是基于组合物的总重量。

5. 发明申请

US20070191552A1 Adhesive composition, adhesive film, and method of producing semiconductor device 有权
标题翻译：粘合剂组合物，粘合剂膜以及半导体装置的制造方法
公开(公告)号：US20070191552A1
公开(公告)日：2007-08-16
申请号：US11706272
申请日：2007-02-15
申请人： Nobuhiro Ichiroku , Shouhei Kozakai
发明人： Nobuhiro Ichiroku , Shouhei Kozakai
IPC分类号： C08L83/04 , C08L63/00 , C08G77/455
CPC分类号： C09J163/00 , C08L63/00 , C08L79/08 , C08L2666/14 , C08L2666/20 , C09J183/10 , C08L2666/22
摘要： Provided is an adhesive composition, which exhibits a melt viscosity at 40 to 80° C. of not more than 10,000 Pa·s, and which after heating for a period of 1 minute to 2 hours at a temperature within a range from 80° C. to (T+50)° C., exhibits a melt viscosity at a temperature of 100° C. to (T+30)° C. that is within a range from 100 to 10,000 Pa·s (wherein, T represents the curing start temperature for the composition). The adhesive composition is capable of forming a cured product that exhibits excellent filling of substrates with finely patterned circuits, excellent lamination performance at low temperatures, a low elastic modulus, and excellent levels of adhesion and heat resistance. The adhesive composition is useful for providing an adhesive film and for producing a semiconductor device.
摘要翻译：提供一种粘合剂组合物，其在40〜80℃下的熔融粘度为10000Pa·s以下，在80℃以上的温度下加热1分钟〜2小时后，至（T + 50）℃，在100℃至（T + 30）℃的温度下显示出在100至10,000Pa·s范围内的熔体粘度（其中，T表示组合物的固化开始温度）。粘合剂组合物能够形成具有精细图案化电路的基材的优异填充性，低温下优异的层压性能，低弹性模量和优异的粘合性和耐热性水平的固化产物。粘合剂组合物可用于提供粘合剂膜和用于制造半导体器件。

6. 发明授权

US07820742B2 Adhesive exhibiting maximum melt viscosity of 10,000 Pa s at 40 to 80 degrees C 有权
标题翻译：粘合剂在40〜80℃下显示10,000Pa·s的最大熔融粘度
公开(公告)号：US07820742B2
公开(公告)日：2010-10-26
申请号：US11706272
申请日：2007-02-15
申请人： Nobuhiro Ichiroku , Shouhei Kozakai
发明人： Nobuhiro Ichiroku , Shouhei Kozakai
IPC分类号： B32B27/38 , C08K3/36 , C08L63/02 , C08L79/08
CPC分类号： C09J163/00 , C08L63/00 , C08L79/08 , C08L2666/14 , C08L2666/20 , C09J183/10 , C08L2666/22
摘要： Provided is an adhesive composition, which exhibits a melt viscosity at 40 to 80° C. of not more than 10,000 Pa·s, and which after heating for a period of 1 minute to 2 hours at a temperature within a range from 80° C. to (T+50)° C., exhibits a melt viscosity at a temperature of 100° C. to (T+30)° C. that is within a range from 100 to 10,000 Pa·s (wherein, T represents the curing start temperature for the composition). The adhesive composition is capable of forming a cured product that exhibits excellent filling of substrates with finely patterned circuits, excellent lamination performance at low temperatures, a low elastic modulus, and excellent levels of adhesion and heat resistance. The adhesive composition is useful for providing an adhesive film and for producing a semiconductor device.
摘要翻译：本发明提供一种粘合剂组合物，其在40〜80℃下的熔融粘度为10000Pa·s以下，在80℃以上的温度下加热1分钟〜2小时后，至（T + 50）℃，在100℃〜100℃的范围内，在100℃〜（T + 30℃）的温度下具有熔融粘度（其中，T表示组合物的固化开始温度）。粘合剂组合物能够形成具有精细图案化电路的基材的优异填充性，低温下优异的层压性能，低弹性模量和优异的粘合性和耐热性水平的固化产物。粘合剂组合物可用于提供粘合剂膜和用于制造半导体器件。

7. 发明申请

US20070120271A1 Dicing and die bonding adhesive tape 审中-公开
标题翻译：切割和芯片粘合胶带
公开(公告)号：US20070120271A1
公开(公告)日：2007-05-31
申请号：US11604800
申请日：2006-11-28
申请人： Shouhei Kozakai , Nobuhiro Ichiroku
发明人： Shouhei Kozakai , Nobuhiro Ichiroku
IPC分类号： H01L23/48
CPC分类号： H01L21/6836 , C09J7/22 , C09J7/29 , C09J7/38 , C09J2201/162 , C09J2203/326 , C09J2483/00 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01021 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01045 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/181 , H01L2924/00 , H01L2924/3512
摘要： A dicing and die bonding tape, comprising a substrate 1, a pressure sensitive adhesive layer (A) 2 superimposed on the substrate 1, a substrate 3 superimposed on the pressure sensitive adhesive layer (A) 2, a pressure sensitive adhesive layer (B) 4 superimposed on the substrate 3, and an adhesive layer 5 super imposed on the pressure sensitive adhesive layer (B) 4, said dicing and die bonding tape having an adhesion strength between the pressure sensitive adhesive layer (A) 2 and a dicing flame of 0.6 N/25 mm or larger, and an adhesion strength between the pressure sensitive adhesive layer (B) 4 and the adhesive layer 5 of from 0.05 to 0.5 N/25 mm.
摘要翻译：一种切割和芯片粘合带，包括基板1，叠加在基板1上的压敏粘合剂层（A）2，叠加在压敏粘合剂层（A）2上的基板3，压敏粘合剂层（B） 4和叠加在基板3上的粘合层5和超过施加在压敏粘合剂层（B）4上的粘合剂层5），所述切割和芯片粘合带具有在压敏粘合剂层（A）2和切割火焰之间的粘合强度 0.6N / 25mm以上，粘合剂层（B）4和粘合剂层5之间的粘合强度为0.05〜0.5N / 25mm。

8. 发明申请

US20070090299A1 Adhesive composition and sheet having an adhesive layer of the composition 失效
标题翻译：粘合剂组合物和具有该组合物的粘合剂层的片材
公开(公告)号：US20070090299A1
公开(公告)日：2007-04-26
申请号：US11583699
申请日：2006-10-20
申请人： Shouhei Kozakai , Nobuhiro Ichiroku
发明人： Shouhei Kozakai , Nobuhiro Ichiroku
IPC分类号： G01T1/24 , G01T1/20 , H01L27/146 , H01L25/00 , H01L27/00
CPC分类号： C09J163/00 , C08L63/00 , C08L79/08 , C08L83/00 , C08L2666/14 , C08L2666/20 , C08L2666/22 , C09J7/22 , C09J7/38 , C09J179/08 , C09J183/10 , C09J2201/36 , C09J2201/622 , C09J2479/08 , C09J2483/00 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29191 , H01L2224/2929 , H01L2224/293 , H01L2224/83191 , H01L2224/8385 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01021 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/12042 , H01L2924/181 , Y10T428/31663 , Y10T428/31721 , H01L2924/0715 , H01L2924/07025 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： An adhesive composition comprising 5 to 60 wt % of (A) a polyimidesilicone resin 5 to 60 wt % of (B) an epoxy resin having a softening point of 80° C. or lower, 0.001 to 20 wt % of (C) at least one epoxy resin curing catalyst selected from imidazole compounds and dicyandiamide 20 to 70 wt % of (D) spherical silica having an average diameter of 0.1 to 10 μm, and 5 to 30 wt % of (E) spherical fine particles of silicone rubber composite, wt % being based on a total weight of the composition.
摘要翻译：一种粘合剂组合物，其包含5至60重量％的（A）聚酰亚胺硅酮树脂5至60重量％的（B）软化点为80℃或更低的环氧树脂，（C）在选自咪唑化合物和双氰胺的至少一种环氧树脂固化催化剂20至70重量％的（D）平均直径为0.1至10微米的球形二氧化硅和5至30重量％的（E）球形微粒硅橡胶复合材料，wt％是基于组合物的总重量。

9. 发明授权

US07125948B2 Silicone adhesive and silicone adhesive film 失效
标题翻译：硅胶和硅胶胶膜
公开(公告)号：US07125948B2
公开(公告)日：2006-10-24
申请号：US10676146
申请日：2003-10-02
申请人： Shouhei Kozakai , Akio Suzuki
发明人： Shouhei Kozakai , Akio Suzuki
IPC分类号： C08G77/12
CPC分类号： C09J183/14 , C08K5/14 , C08L83/00 , C09J183/10
摘要： A silicone adhesive comprises (A) a reaction mixture obtained by subjecting a partially condensed mixture of (i) a hydroxy-terminated diorganopolysiloxane and (ii) an organopolysiloxane copolymer having hydroxyl and alkenyl radicals and comprising R33SiO1/2 units and SiO2 units, and (iii) a silicon compound having a silicon atom-bonded hydrogen atom and a silicon atom-bonded alkoxy radical to addition reaction in the presence of a platinum catalyst and (B) a crosslinking agent. The silicone adhesive exhibits at the initial a tackiness sufficient to fixedly secure a substrate. By press bonding another substrate to the adhesive-bearing substrate and heating them, the substrates can be firmly bonded together.
摘要翻译：硅氧烷粘合剂包含（A）通过使（i）羟基封端的二有机聚硅氧烷和（ii）具有羟基和烯基的有机聚硅氧烷共聚物的部分冷凝的混合物（R 3 3）（iii）具有硅原子键合氢原子和硅原子的硅化合物在铂催化剂和（B）交联剂的存在下进行加成反应。硅氧烷粘合剂在初始时表现出足以固定基材的粘性。通过将另一基板压接到承载基材并加热它们，可以将基板牢固地结合在一起。

10. 发明授权

US07312296B2 Silicone adhesive and adhesive film 失效
标题翻译：硅胶和胶膜
公开(公告)号：US07312296B2
公开(公告)日：2007-12-25
申请号：US10644976
申请日：2003-08-21
申请人： Shouhei Kozakai , Akio Suzuki
发明人： Shouhei Kozakai , Akio Suzuki
IPC分类号： C08G77/08
CPC分类号： C09J183/10 , C08K5/14 , C08K5/54 , C08L83/00
摘要： A silicone adhesive having (A) an organopolysiloxane partial condensate of (i) a diorganopolysiloxane end-capped with a hydroxyl radical and (ii) an organopolysiloxane copolymer having hydroxyl radicals and having R33SiO1/2 units and SiO4/2 units wherein R3 is hydroxyl or a monovalent hydrocarbon radical, (B) a silane or siloxane compound having a silicon atom-bonded alkoxy radical and/or an epoxy radical, and (C) a crosslinking agent exhibits pressure-sensitive adhesion and permanent adhesion.
摘要翻译：一种硅氧烷粘合剂，其具有（A）有机聚硅氧烷部分缩合物，所述有机聚硅氧烷部分缩合物包含（i）用羟基封端的二有机聚硅氧烷和（ii）具有羟基自由基并具有R 3 3的有机聚硅氧烷共聚物， / SUB> SiO 1/2单元和其中R 3的SiO 2/2 / 2单元是羟基或一价烃基，（B）a 具有硅原子键合的烷氧基和/或环氧基的硅烷或硅氧烷化合物，（C）交联剂表现出压敏粘合性和永久性粘合性。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式