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61. 发明申请

US20060134330A1 Cluster tool architecture for processing a substrate 审中-公开
公开(公告)号：US20060134330A1
公开(公告)日：2006-06-22
申请号：US11112932
申请日：2005-04-22
申请人： Tetsuya Ishikawa , Rick Roberts , Helen Armer , Leon Volfovski , Jay Pinson , Michael Rice , David Quach , Mohsen Salek , Robert Lowrance , William Weaver , Charles Carlson , Chongyang Wang , Jeffrey Hudgens , Harald Herchen , Brian Lue , John Backer
发明人： Tetsuya Ishikawa , Rick Roberts , Helen Armer , Leon Volfovski , Jay Pinson , Michael Rice , David Quach , Mohsen Salek , Robert Lowrance , William Weaver , Charles Carlson , Chongyang Wang , Jeffrey Hudgens , Harald Herchen , Brian Lue , John Backer
IPC分类号： C23C16/00
CPC分类号： H01L21/67225 , G03B27/32 , G03D13/006 , G03F7/40 , G05B19/41825 , G05B2219/40476 , G05B2219/45031 , G05B2219/49137 , H01L21/67109 , H01L21/6715 , H01L21/67161 , H01L21/67173 , H01L21/67178 , H01L21/67184 , H01L21/6719 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67754 , H01L21/6831 , H01L21/6838 , H01L21/68707 , H01L22/26 , Y02P90/087 , Y10S414/135 , Y10S414/136 , Y10T29/53187 , Y10T29/5323
摘要： Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool. In track lithography type cluster tools, since the chamber processing times tend to be rather short, and the number of processing steps required to complete a typical track system process is large, a significant portion of the time it takes to process a substrate is taken up by the processes of transferring the substrates in a cluster tool between the various processing chambers. In one embodiment of the cluster tool, the cost of ownership is reduced by grouping substrates together and transferring and processing the substrates in groups of two or more to improve system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. In one aspect of the invention, the substrate processing sequence and cluster tool are designed so that the substrate transferring steps performed during the processing sequence are only made to chambers that will perform the next processing step in the processing sequence. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

62. 发明申请

US20060061979A1 Substrate carrier having reduced height 审中-公开
标题翻译：基板载体具有降低的高度
公开(公告)号：US20060061979A1
公开(公告)日：2006-03-23
申请号：US11219332
申请日：2005-09-02
申请人： Martin Elliott , Michael Rice
发明人： Martin Elliott , Michael Rice
IPC分类号： G06F19/00 , H05K7/04
CPC分类号： H01L21/67353 , H01L21/67379
摘要： A first substrate carrier is provided that includes a body adapted to store one or more substrates; and either (1) a bottom surface having one or more coupling features that extend into a storage region of the body or (2) coupling features that extend alongside the body, so that the substrate carrier's overall height is not increased by the entire height of the coupling feature. Numerous other aspects are provided.
摘要翻译：提供了第一衬底载体，其包括适于存储一个或多个衬底的主体; 和（1）具有一个或多个连接特征的底表面，其延伸到主体的存储区域中，或者（2）耦合沿着身体延伸的特征，使得基板载体的整体高度不会增加整个高度耦合功能。提供了许多其他方面。

63. 发明申请

US20050186063A1 Calibration of high speed loader to substrate transport system 失效
标题翻译：高速装载机对基板运输系统的校准
公开(公告)号：US20050186063A1
公开(公告)日：2005-08-25
申请号：US10987956
申请日：2004-11-12
申请人： Michael Rice , Eric Englhardt , Robert Lowrance , Martin Elliott , Jeffrey Hudgens , Kirk Katwyk , Amit Puri
发明人： Michael Rice , Eric Englhardt , Robert Lowrance , Martin Elliott , Jeffrey Hudgens , Kirk Katwyk , Amit Puri
IPC分类号： H01L21/68 , B65G49/05 , B65G49/06 , B65G49/07 , H01L21/00 , H01L21/677 , B65F3/02
CPC分类号： H01L21/67769 , H01L21/67253 , H01L21/67276
摘要： In a first aspect, a first method of calibrating a substrate carrier loader to a moving conveyor is provided. The first method includes the steps of (1) providing a substrate carrier loader adapted to load substrate carriers onto a moving conveyor; (2) aligning the substrate carrier loader to the moving conveyor; and (3) calibrating the substrate carrier loader to the moving conveyor. Numerous other aspects are provided.
摘要翻译：在第一方面，提供了一种将基板载体加载器校准到移动输送机的第一种方法。第一种方法包括以下步骤：（1）提供适于将基板载体加载到移动输送机上的基底载体加载器; （2）将基板载体装载器对准移动的输送机; 和（3）将衬底载体装载器校准到移动的输送机。提供了许多其他方面。

64. 发明申请

US20050135903A1 Wafer loading station that automatically retracts from a moving conveyor in response to an unscheduled event 有权
标题翻译：晶圆加载站，响应于非计划事件，自动从运动的输送机回缩
公开(公告)号：US20050135903A1
公开(公告)日：2005-06-23
申请号：US10987452
申请日：2004-11-12
申请人： Michael Rice , Eric Englhardt , Robert Lowrance , Martin Elliott , Jeffrey Hudgens
发明人： Michael Rice , Eric Englhardt , Robert Lowrance , Martin Elliott , Jeffrey Hudgens
IPC分类号： H01L21/677 , B65G1/00
CPC分类号： H01L21/67769 , H01L21/67775 , H01L21/67778 , Y10S414/135 , Y10S414/136
摘要： In a first aspect, a wafer loading station adapted to exchange wafer carriers with a wafer carrier transport system comprises a biasing element adapted to urge the end effector of the wafer loading station away from a moveable conveyor of the wafer carrier transport system upon the occurrence of a unscheduled event such as a power failure or an emergency shutdown. In a second aspect, an uninterruptible power supply commands a controller to cause the wafer carrier handler to retract the end effector from the wafer carrier transport system upon the occurrence of the unscheduled event, and provides the power necessary for the same. Numerous other aspects are provided.
摘要翻译：在第一方面，一种适于与晶片载体传输系统交换晶片载体的晶片装载站包括偏置元件，该偏置元件适于在晶片载体传输系统发生时将晶片载体站的末端执行器远离晶片载体传输系统的可移动传送器一个非计划的事件，如停电或紧急停机。在第二方面，不间断电源命令控制器使晶片载体处理器在发生非预定事件时从晶片载体传输系统缩回端部执行器，并提供其所需的功率。提供了许多其他方面。

65. 发明申请

US20050121293A1 Break-away positioning conveyor mount for accommodating conveyor belt bends 有权
标题翻译：分离定位输送机支架，用于容纳输送带弯头
公开(公告)号：US20050121293A1
公开(公告)日：2005-06-09
申请号：US10987955
申请日：2004-11-12
申请人： Michael Rice , Eric Englhardt , Robert Lowrance , Martin Elliott , Jeffrey Hudgens
发明人： Michael Rice , Eric Englhardt , Robert Lowrance , Martin Elliott , Jeffrey Hudgens
IPC分类号： B65G15/30 , B65G49/05 , H01L21/00 , H01L21/677 , H01L21/68 , H01L21/687 , B65G47/24
CPC分类号： H01L21/68707 , H01L21/6773 , H01L21/67733
摘要： A break-away mounting system for a continuous-motion, high-speed position conveyor system is disclosed. A support cradle may be suspended from a conveyor belt such that the support cradle maintains a fixed position and orientation relative to at least one point on the conveyor belt without inducing appreciable stress on the conveyor belt, the support cradle, or the coupling between the conveyor belt and the support cradle. The mount may include a leading rotatable bearing attached to the support cradle which may releasably engage a first key attached to the conveyor belt, the rotatable bearing adapted to accommodate rotational forces applied to the support cradle by the conveyor belt. The mount may also include a slide bearing attached to the support cradle which may releasably engage a second key attached to the conveyor belt, the slide bearing adapted to accommodate longitudinal forces applied to the support cradle by the conveyor belt.
摘要翻译：公开了一种用于连续运动的高速位置传送器系统的分离安装系统。支撑托架可以从传送带悬挂，使得支撑托架相对于传送带上的至少一个点保持固定的位置和方向，而不会在传送带，支撑架或传送带之间的联接中引起明显的应力皮带和支撑架。安装件可以包括附接到支撑架的前导可旋转轴承，其可释放地接合附接到传送带的第一键，该旋转轴承适于容纳由传送带施加到支撑支架的旋转力。安装件还可以包括附接到支撑支架的滑动轴承，其可以可释放地接合附接到传送带的第二键，滑动轴承适于容纳由传送带施加到支撑支架的纵向力。

66. 发明申请

US20050112509A1 Method of depositing an amrphous carbon layer 有权
标题翻译：淀积碳膜的方法
公开(公告)号：US20050112509A1
公开(公告)日：2005-05-26
申请号：US11019860
申请日：2004-12-21
申请人： Kevin Fairbairn , Michael Rice , Timothy Weidman , Christopher Ngai , Ian Latchford , Christopher Bencher , Yuxiang Wang
发明人： Kevin Fairbairn , Michael Rice , Timothy Weidman , Christopher Ngai , Ian Latchford , Christopher Bencher , Yuxiang Wang
IPC分类号： H01L21/20 , H01L21/027 , H01L21/28 , H01L21/308 , H01L21/311 , H01L21/314 , H01L21/316 , H01L21/3213 , H01L21/768 , G03F7/16
CPC分类号： H01L21/76829 , C23C16/26 , H01L21/0276 , H01L21/28035 , H01L21/3081 , H01L21/3088 , H01L21/31138 , H01L21/31144 , H01L21/3146 , H01L21/31612 , H01L21/32137 , H01L21/76802 , H01L21/76807
摘要： A method of forming an integrated circuit using an amorphous carbon film. The amorphous carbon film is formed by thermally decomposing a gas mixture comprising a hydrocarbon compound and an inert gas. The amorphous carbon film is compatible with integrated circuit fabrication processes. In one integrated circuit fabrication process, the amorphous carbon film is used as a hardmask. In another integrated circuit fabrication process, the amorphous carbon film is an anti-reflective coating (ARC) for deep ultraviolet (DUV) lithography. In yet another integrated circuit fabrication process, a multi-layer amorphous carbon anti-reflective coating is used for DUV lithography.
摘要翻译：一种使用无定形碳膜形成集成电路的方法。无定形碳膜通过热分解包含烃化合物和惰性气体的气体混合物而形成。无定形碳膜与集成电路制造工艺兼容。在一个集成电路制造工艺中，非晶碳膜用作硬掩模。在另一个集成电路制造工艺中，无定形碳膜是用于深紫外（DUV）光刻的抗反射涂层（ARC）。在又一集成电路制造工艺中，多层无定形碳抗反射涂层用于DUV光刻。

67. 发明申请

US20050105997A1 Methods and apparatus for carriers suitable for use in high-speed/high-acceleration transport systems 审中-公开
标题翻译：适用于高速/高加速度运输系统的载体的方法和装置
公开(公告)号：US20050105997A1
公开(公告)日：2005-05-19
申请号：US10934641
申请日：2004-09-04
申请人： Eric Englhardt , Michael Rice
发明人： Eric Englhardt , Michael Rice
IPC分类号： B65G49/07 , B65D81/02 , B65D85/30 , B65D85/86 , B65G1/00 , H01L21/673 , H01L21/68
CPC分类号： H01L21/6732 , H01L21/67379 , H01L21/67383
摘要： A substrate carrier is counterbalanced so that the center of gravity of the carrier is aligned with the center of gravity of any substrates that the carrier may hold. In some embodiments, substrate supports disposed within the carrier are adapted to hold substrates such that the center of gravity of the substrates are aligned with the center of gravity of the carrier. A flange may be coupled to the carrier so as to provide a means to apply a net lifting or support force to the carrier that is aligned with the center of gravity of the carrier.
摘要翻译：衬底载体被平衡，使得载体的重心与载体可以保持的任何基底的重心对齐。在一些实施例中，设置在载体内的衬底支撑件适于保持衬底，使得衬底的重心与载体的重心对准。凸缘可以联接到载体上，以便提供一种将载荷提升或支撑力施加到与载体的重心相对准的载体上的装置。

68. 发明申请

US20050095110A1 Method and apparatus for unloading substrate carriers from substrate carrier transport system 审中-公开
标题翻译：从衬底载体传输系统卸载衬底载体的方法和装置
公开(公告)号：US20050095110A1
公开(公告)日：2005-05-05
申请号：US10650481
申请日：2003-08-28
申请人： Robert Lowrance , Michael Rice , Martin Elliott , Jeffrey Hudgens , Eric Englhardt
发明人： Robert Lowrance , Michael Rice , Martin Elliott , Jeffrey Hudgens , Eric Englhardt
IPC分类号： H01L21/677 , B66C1/00
CPC分类号： H01L21/67769
摘要： A substrate loading station includes a load/unload mechanism which unloads substrates or substrate carriers from a conveyor and loads substrates or substrate carriers onto the conveyor. The load/unload mechanism includes a rotary arm that rotates to match the speed of the conveyor to lift a substrate or substrate carrier off the conveyor or to lower a substrate or substrate carrier into engagement with the conveyor.
摘要翻译：基板装载站包括装载/卸载机构，其从输送机卸载基板或基板载体，并将基板或基板载体装载到输送机上。装载/卸载机构包括旋转臂，其旋转以匹配输送机的速度以将基板或基板载体从输送机提起，或者将基板或基板载体降低成与输送机接合。

69. 发明授权

US06736931B2 Inductively coupled RF plasma reactor and plasma chamber enclosure structure therefor 失效
公开(公告)号：US06736931B2
公开(公告)日：2004-05-18
申请号：US09970121
申请日：2001-10-02
申请人： Kenneth S. Collins , Michael Rice , John Trow , Douglas Buchberger , Craig A. Roderick
发明人： Kenneth S. Collins , Michael Rice , John Trow , Douglas Buchberger , Craig A. Roderick
IPC分类号： C23C1600
CPC分类号： H01J37/32458 , B01D53/22 , B01D53/226 , B01D53/268 , C23C16/517 , H01F2029/143 , H01J37/32082 , H01J37/321 , H01J37/32146 , H01J37/32165 , H01J37/32467 , H01J37/32522 , H01J37/32688 , H01J37/32706 , H01J37/32871 , H01J2237/3343 , H01J2237/3345 , H01J2237/3346 , H01L21/31116 , H01L21/6831
摘要： A plasma chamber enclosure structure for use in an RF plasma reactor. The plasma chamber enclosure structure being a single-wall dielectric enclosure structure of an inverted cup-shape configuration and having ceiling with an interior surface of substantially flat conical configuration extending to a centrally located gas inlet. The plasma chamber enclosure structure having a sidewall with a lower cylindrical portion generally transverse to a pedestal when positioned over a reactor base, and a transitional portion between the lower cylindrical portion and the ceiling. The transitional portion extends inwardly from the lower cylindrical portion and includes a radius of curvature. The structure being adapted to cover the base to comprise the RF plasma reactor and to define a plasma-processing volume over the pedestal. The structure being formed of a dielectric material of silicon, silicon carbide, quartz, and/or alumina being capable of transmitting inductive power therethrough from an adjacent antenna.

70. 发明授权

US06514376B1 Thermal control apparatus for inductively coupled RF plasma reactor having an overhead solenoidal antenna 失效
标题翻译：具有架空螺线管天线的电感耦合射频等离子体反应器的热控制装置
公开(公告)号：US06514376B1
公开(公告)日：2003-02-04
申请号：US09520623
申请日：2000-03-07
申请人： Kenneth Collins , Michael Rice , Eric Askarinam , Douglas Buchberger , Craig Roderick
发明人： Kenneth Collins , Michael Rice , Eric Askarinam , Douglas Buchberger , Craig Roderick
IPC分类号： C23C1600
CPC分类号： C23C16/517 , H01F2029/143 , H01J37/32082 , H01J37/321 , H01J37/32146 , H01J37/32165 , H01J37/32458 , H01J37/32467 , H01J37/32522 , H01J37/32688 , H01J37/32706 , H01J37/32871 , H01J2237/3343 , H01J2237/3345 , H01J2237/3346 , H01L21/31116 , H01L21/6831
摘要： The invention is embodied in a plasma reactor including a plasma reactor chamber and a workpiece support for holding a workpiece near a support plane inside the chamber during processing, the chamber having a reactor enclosure portion facing the support, a cold body overlying the reactor enclosure portion, a plasma source power applicator between the reactor enclosure portion and the cold body and a thermally conductor between and in contact with the cold body and the reactor enclosure. The thermal conductor and the cold sink define a cold sink interface therebetween, the reactor preferably further including a thermally conductive substance within the cold sink interface for reducing the thermal resistance across the cold sink interface. The thermally conductive substance can be a thermally conductive gas filling the cold body interface. Alternatively, the thermally conductive substance can be a thermally conductive solid material. The reactor can include a gas manifold in the cold body communicable with a source of the thermally conductive gas an inlet through the cold body from the gas manifold and opening out to the cold body interface. The reactor can further include an O-ring apparatus sandwiched between the cold body and the thermal conductor and defining a gas-containing volume in the cold body interface of nearly infinitesimal thickness in communication with the inlet from the cold body. More generally, the reactor can include the facilitation of thermal transfer across an interface between a hot and/or cold sink and any part exposed to the reactor chamber interior atmosphere, such as the ceiling, wall or polymer-hardening precursor ring, for example, by the insertion into that interface of a thermally conductive gas or substance.
摘要翻译：本发明体现在等离子体反应器中，该等离子体反应器包括等离子体反应器室和工件支撑件，用于在加工期间将工件保持在室内的支撑平面附近，该室具有面向支撑件的反应器外壳部分，覆盖反应器外壳部分的冷体，反应器外壳部分和冷体之间的等离子体源功率施加器和在冷体和反应器外壳之间并与其接触的导热体。热导体和冷却槽在它们之间限定冷沉接口，反应器优选地还包括在冷沉接口内的导热物质，以降低冷接口接口上的热阻。导热物质可以是填充冷体界面的导热气体。或者，导热物质可以是导热固体材料。反应器可以包括在冷体中的气体歧管，其与导热气体源连通，通过来自气体歧管的冷体和通向冷体界面的入口。反应器还可以包括夹在冷体和热导体之间的O形环装置，并且在与冷体的入口连通的几乎无穷小的厚度的冷体界面中限定含气体体积。更一般地，反应器可以包括促进热和/或冷沉之间的界面和暴露于反应室内部大气的任何部分（例如天花板，壁或聚合物硬化前体环）之间的热传递，例如，通过插入该导热气体或物质的界面。

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