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    • 61. 发明授权
    • Fuse construction for integrated circuit structure having low dielectric constant dielectric material
    • 具有低介电常数介电材料的集成电路结构的保险丝结构
    • US06806551B2
    • 2004-10-19
    • US10376401
    • 2003-02-28
    • Yauh-Ching LiuRuggero CastagnettiRamnath Venkatraman
    • Yauh-Ching LiuRuggero CastagnettiRamnath Venkatraman
    • H01L2900
    • H01L23/5258H01L23/5329H01L2224/05022H01L2924/01019
    • Fuses, and optionally metal pads, are formed over a layer of low k dielectric material structure having first openings lined with conductive barrier material and filled to form metal interconnects in the upper surface of the low k dielectric material. A dielectric layer is formed over the low k dielectric material and over the metal interconnects, and patterned to form second openings therein communicating with the metal interconnects. A conductive barrier layer is formed over this dielectric layer in contact with the metal interconnects, and patterned to form fuse portions between some of the metal interconnects, and a liner over one or more of the metal interconnects. A dielectric layer is then formed over the patterned conductive barrier layer to form a window above each fuse, and patterned to form openings over at least some of the conductive barrier liners filled with metal to form metal pads.
    • 保险丝和可选的金属焊盘形成在低k电介质材料结构的层上,其具有衬有导电阻挡材料的第一开口并且被填充以在低k电介质材料的上表面中形成金属互连。 电介质层形成在低k电介质材料上方和金属互连之上,并被图案化以形成其中与金属互连连通的第二开口。 导电阻挡层形成在与金属互连件接触的该电介质层上,并被图案化以在一些金属互连件之间形成熔丝部分,以及在一个或多个金属互连件上的衬垫。 然后在图案化的导电阻挡层上方形成电介质层,以形成每个保险丝上方的窗口,并且图案化以在填充有金属的至少一些导电阻挡衬里上形成开口以形成金属焊盘。
    • 62. 发明授权
    • Fuse construction for integrated circuit structure having low dielectric constant dielectric material
    • 具有低介电常数介电材料的集成电路结构的保险丝结构
    • US06566171B1
    • 2003-05-20
    • US09882404
    • 2001-06-12
    • Yauh-Ching LiuRuggero CastagnettiRamnath Venkatraman
    • Yauh-Ching LiuRuggero CastagnettiRamnath Venkatraman
    • H01L2182
    • H01L23/5258H01L23/5329H01L2224/05022H01L2924/01019
    • Fuses, and optionally metal pads, are formed over a layer of low k dielectric material structure having first openings lined with conductive barrier material and filled to form metal interconnects in the upper surface of the low k dielectric material. A dielectric layer is formed over the low k dielectric material and over the metal interconnects, and patterned to form second openings therein communicating with the metal interconnects. A conductive barrier layer is formed over this dielectric layer in contact with the metal interconnects, and patterned to form fuse portions between some of the metal interconnects, and a liner over one or more of the metal interconnects. A dielectric layer is then formed over the patterned conductive barrier layer to form a window above each fuse, and patterned to form openings over at least some of the conductive barrier liners filled with metal to form metal pads.
    • 保险丝和可选的金属焊盘形成在低k电介质材料结构的层上,其具有衬有导电阻挡材料的第一开口并且被填充以在低k电介质材料的上表面中形成金属互连。 电介质层形成在低k电介质材料上方和金属互连之上,并被图案化以形成其中与金属互连连通的第二开口。 导电阻挡层形成在与金属互连件接触的该电介质层上,并被图案化以在一些金属互连件之间形成熔丝部分,以及在一个或多个金属互连件上的衬垫。 然后在图案化的导电阻挡层上方形成电介质层,以形成每个保险丝上方的窗口,并且图案化以在填充有金属的至少一些导电阻挡衬里上形成开口以形成金属焊盘。
    • 64. 发明授权
    • Method of forming a field effect transistor
    • 形成场效应晶体管的方法
    • US5688700A
    • 1997-11-18
    • US552855
    • 1995-11-03
    • David KaoYauh-Ching Liu
    • David KaoYauh-Ching Liu
    • H01L21/336H01L29/10H01L29/78H01L21/265
    • H01L29/66583H01L29/1033H01L29/66553H01L29/7833H01L29/66537
    • A semiconductor processing method of forming a field effect transistor includes, a) providing a first layer of material over a substrate; b) providing a first opening through the first layer, the first opening having a width and a base; c) providing a second layer of material over the first layer and to within the first opening to a thickness which is less than one half the first opening width to less than completely fill the first opening and define a narrower second opening; d) anisotropically etching the second layer of material from outwardly of the first layer and from the first opening base to effectively provide inner sidewall spacers within the first opening; e) providing a gate dielectric layer within the second opening; f) providing a layer of electrically conductive gate material over the first layer and to within the second opening over the gate dielectric layer to fill the second opening with conductive gate material; g) without masking, planarize etching the conductive gate material layer substantially selective relative to the first layer to define a transistor gate within the second opening; and h) providing opposing source and drain regions relative to the transistor gate.
    • 形成场效应晶体管的半导体处理方法包括:a)在衬底上提供第一层材料; b)提供穿过第一层的第一开口,第一开口具有宽度和底部; c)在所述第一层之上提供第二层材料,并且在所述第一开口内提供厚度小于所述第一开口宽度的一半,以小于完全填充所述第一开口并限定较窄的第二开口; d)从所述第一层的外部和所述第一开口底部各向异性地蚀刻所述第二层材料,以有效地在所述第一开口内提供内部侧壁间隔物; e)在所述第二开口内提供栅极电介质层; f)在所述第一层上提供导电栅极材料层,并且在所述栅极介电层上方的所述第二开口内提供导电栅极材料层,以用导电栅极材料填充所述第二开口; g)没有掩蔽,平坦化蚀刻相对于第一层基本上选择性的导电栅极材料层,以在第二开口内限定晶体管栅极; 以及h)相对于所述晶体管栅极提供相对的源极和漏极区域。