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61. 发明授权

US06260270B1 Method and apparatus for short-term relining or construction of blast furnace 失效
标题翻译：高炉短期改造或建造的方法和装置
公开(公告)号：US06260270B1
公开(公告)日：2001-07-17
申请号：US09404444
申请日：1999-09-22
申请人： Kazuo Kimura , Iwao Asada
发明人： Kazuo Kimura , Iwao Asada
IPC分类号： B23D600
CPC分类号： C21B7/00 , Y10S266/01 , Y10T29/4935 , Y10T29/49352 , Y10T29/49387 , Y10T29/49394 , Y10T29/49815 , Y10T29/49819 , Y10T29/49826 , Y10T29/49947 , Y10T29/53961
摘要： Method and apparatus for short-term relining or construction of a blast furnace uses a grounding apparatus for grounding of ring-shaped blast furnace segments having shells and a casting floor present as a blast furnace floor for transferring the ring-shaped blocks or shells onto a foundation of the blast furnace, and capable of safely and precisely mounting the ring-like blocks on the casting floor, wherein the grounding apparatus is integrated with a jack system utilizing rod type lift jacks and a sliding apparatus installed with intermittently movable hydraulic cylinders for safe and precision mounting of the ring-shaped blocks or shells on the casting floor.
摘要翻译：用于短期改造或建造高炉的方法和装置使用具有壳的环形高炉段接地的接地装置和作为高炉地板的铸造地板，用于将环形块或壳转移到高炉基础，能够安全，精确地将环状块安装在铸造地板上，其中接地装置与使用杆式提升千斤顶的千斤顶系统和安装有间歇式可移动液压缸的滑动装置集成，用于安全并将环形块或壳体精确安装在铸造地板上。

62. 发明授权

US6059626A Screen manufacturing method using flat display panel 失效
标题翻译：屏幕制作方法采用平板显示面板
公开(公告)号：US6059626A
公开(公告)日：2000-05-09
申请号：US263627
申请日：1999-03-05
申请人： Kazuo Kimura , Kazuhisa Hemmi , Kazumasa Ogura
发明人： Kazuo Kimura , Kazuhisa Hemmi , Kazumasa Ogura
IPC分类号： G09F9/00 , G09F9/313 , G09F9/40 , H01J9/24
CPC分类号： G09F9/313 , H01J2217/49
摘要： A screen manufacturing method makes it possible to manufacture a display screen using flat display panels and to consistently form a flat display screen. More specifically, m flat display panels are fixed on a holder during a manufacturing process of the display screen, and then a flexible substrate is fixed to electrode pins of a flat display panel which project over a back surface of the holder so as to form a unit. After fitting a frame to the unit, a part on which a connector is arranged with a part of the flexible substrate being bent is fitted on a surface of the frame so as to form a submodule. Then, by connecting submodules, a module is formed. By assembling the module, a display screen is produced.
摘要翻译：屏幕制造方法使得可以使用平板显示面板制造显示屏并且一贯地形成平面显示屏。更具体地，在显示屏的制造过程中将m个平板显示面板固定在支架上，然后将柔性基板固定在平板显示面板的电极销上，该平板显示面板突出在支架的后表面上，从而形成单元。在将框架安装到单元之后，将装配有弯曲柔性基板的一部分的连接器的部分安装在框架的表面上，以形成子模块。然后，通过连接子模块，形成一个模块。通过组装模块，生成显示屏。

63. 发明授权

US5969413A Semiconductor device having a tab chip on a tape carrier with lead wirings provided on the tape carrier used as external leads 失效
标题翻译：半导体器件具有在载带上具有引线布线的片状芯片，该导线布置在用作外部引线的载带上
公开(公告)号：US5969413A
公开(公告)日：1999-10-19
申请号：US855931
申请日：1997-05-14
申请人： Keiichi Yano , Kazuo Kimura , Hironori Asai , Jun Monma , Koji Yamakawa , Mitsuyoshi Endo , Hirohisa Osoguchi
发明人： Keiichi Yano , Kazuo Kimura , Hironori Asai , Jun Monma , Koji Yamakawa , Mitsuyoshi Endo , Hirohisa Osoguchi
IPC分类号： H01L23/10 , H01L23/15 , H01L23/28 , H01L23/495 , H01L23/02 , H01L23/12 , H01L23/48
CPC分类号： H01L23/10 , H01L23/15 , H01L23/49572 , H01L24/50 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/07802 , H01L2924/30107
摘要： A semiconductor chip is supported on a tape carrier provided with lead wirings. The semiconductor chip is electrically connected to the lead wirings. The semiconductor chip of this quality is bonded in combination with the pe carrier to an aluminum nitride substrate. The lead wirings provided on the carrier combine the two functions as an internal lead and an external lead. The semiconductor package of such a structure as is described above allows multi-terminal connection by the narrowing of pitches between the leads and permits provision of a miniature package excelling in the heat-radiating property. Alternatively, the lead wirings supported on the tape carrier and electrically connected to the semiconductor chip are utilized as internal leads. For the external leads, such lead frames as are bonded to the aluminum nitride substrate are used. The lead frames are electrically connected to the internal leads provided in the tape carrier.
摘要翻译：半导体芯片被支撑在带有引线配线的带载体上。半导体芯片电连接到引线配线。该质量的半导体芯片与pe载体结合到氮化铝衬底上。载体上提供的导线结合了作为内部引线和外部引线的两个功能。如上所述的这种结构的半导体封装允许通过引线之间的间距变窄来实现多端子连接，并且允许提供具有优异的散热性能的微型封装。或者，支撑在带载体上并电连接到半导体芯片的引线配线被用作内部引线。对于外部引线，使用与氮化铝基板结合的引线框架。引线框架电连接到设置在带式载体中的内部引线。

64. 发明授权

US5825086A Ceramic lid assembly for semiconductor packages 失效
标题翻译：用于半导体封装的陶瓷盖组件
公开(公告)号：US5825086A
公开(公告)日：1998-10-20
申请号：US690460
申请日：1996-07-29
申请人： Kazuo Kimura , Haruhiko Murata , Yukihiro Aoyama
发明人： Kazuo Kimura , Haruhiko Murata , Yukihiro Aoyama
IPC分类号： H01L23/02 , H01L23/04 , H01L23/08 , H01L23/10 , H05K3/24
CPC分类号： H01L23/10 , H05K3/248 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , Y10T428/12486 , Y10T428/12528 , Y10T428/12611 , Y10T428/12868
摘要： A ceramic lid assembly includes an integral metallized layer provided around the periphery of a ceramic lid substrate to serve as a foundation for a solder layer. A portion of the metallized layer for contact with the ceramic lid substrate is formed from a metallized paste containing glass frits so that the metallized layer is baked to adhere to the ceramic lid by reflowed glass frits. A portion of the metallized layer for contact with the solder layer is formed from a metallized paste containing no glass frits so that substantially no void is formed in the solder layer.
摘要翻译：陶瓷盖组件包括设置在陶瓷盖衬底周围的整体金属化层，以作为焊料层的基础。用于与陶瓷盖衬底接触的金属化层的一部分由含有玻璃料的金属化糊料形成，使得金属化层被烘烤以通过回流玻璃料粘附到陶瓷盖。用于与焊料层接触的金属化层的一部分由不含玻璃料的金属化糊料形成，使得在焊料层中基本上不形成空隙。

65. 发明授权

US5771599A Method of and instrument for measuring roll diameter in roll grinder 失效
标题翻译：轧辊研磨机辊径测量方法及仪器
公开(公告)号：US5771599A
公开(公告)日：1998-06-30
申请号：US704998
申请日：1996-08-29
申请人： Hiroshi Uchimura , Takazumi Watanabe , Masayuki Tatara , Yoshinori Hata , Kazuo Kimura
发明人： Hiroshi Uchimura , Takazumi Watanabe , Masayuki Tatara , Yoshinori Hata , Kazuo Kimura
IPC分类号： B24B5/37 , B24B49/06 , B24B49/14 , G01B5/08 , G01B7/12
CPC分类号： B24B5/37 , B24B49/06 , B24B49/14
摘要： A method of measuring a roll diameter of a roll is provided. At first, a step-shaped conical master roll consisting of a plurality of diametrical parts is prepared and then, the diameters of the diametrical parts under predetermined standard temperature are measured. After mounting the master roll on a roll grinder under a temperature condition similar to that surrounding the roll mounted on the roll grinder, a diameter of one diametrical part, of which standard diameter is closest to the roll diameter of the roll, is measured. Next, a difference between the diameter value of the diametrical part and the standard diameter value is calculated as a correction value, so that the roll diameter value of the roll is corrected by the correction value.
摘要翻译：提供了一种测量卷筒直径的方法。首先，准备由多个直径部件构成的阶梯形的圆锥形主辊，然后测量在预定标准温度下的直径部分的直径。在与辊式研磨机上安装的辊周围的温度条件相似的温度条件下将母辊安装在辊式研磨机上之后，测量其直径最接近轧辊直径的一个直径部分的直径。接下来，计算直径部分的直径值与标准直径值之间的差作为校正值，从而通过校正值校正辊的辊直径值。

66. 发明授权

US5641718A Sintered aluminum nitride and circuit substrate using sintered aluminum nitride 失效
标题翻译：烧结氮化铝和使用烧结氮化铝的电路基板
公开(公告)号：US5641718A
公开(公告)日：1997-06-24
申请号：US521475
申请日：1995-08-30
申请人： Akihiro Horiguchi , Katsuyoshi Oh-Ishi , Mitsuo Kasori , Hiroyasu Sumino , Fumio Ueno , Jun Monma , Kazuo Kimura
发明人： Akihiro Horiguchi , Katsuyoshi Oh-Ishi , Mitsuo Kasori , Hiroyasu Sumino , Fumio Ueno , Jun Monma , Kazuo Kimura
IPC分类号： C04B35/581 , C04B41/51 , C04B41/88 , H01L23/15 , H05K1/03 , C04B35/58 , C04B35/03 , B32B7/00
CPC分类号： C04B41/009 , C04B35/581 , C04B41/5133 , C04B41/88 , H01L23/15 , C04B2111/00844 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01004 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01025 , H01L2924/01039 , H01L2924/01057 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15192 , H01L2924/15312 , H01L2924/1532 , H01L2924/16152 , Y10T428/24926
摘要： Disclosed is a sintered aluminum nitride composition and a circuit substrate for use in semiconductor device. The sintered aluminum nitride composition comprises: aluminum nitride; a first component given by a compound containing an element which is selected from the group consisting of alkaline earth elements and group IIIa elements of the periodic table; a second component made of either a simple silicon or a silicon-containig compound; and a third component made of either a simple manganese or a manganese-containing compound. The circuit substrate has an insulating layer which is compoesd of the above-described sintered aluminum nitride composition, and an electrically conductive layer containing an electrically conductive material and the same components as those of the insulating layer.
摘要翻译：公开了一种用于半导体器件的烧结氮化铝组合物和电路基板。烧结的氮化铝组合物包括：氮化铝; 由含有选自元素周期表的碱土元素和IIIa族元素的元素的化合物给出的第一组分; 由简单硅或含硅化合物制成的第二组分; 以及由简单的锰或含锰化合物制成的第三组分。电路基板具有由上述烧结氮化铝组合物构成的绝缘层和包含导电材料的导电层和与绝缘层相同的部件。

67. 发明授权

US5583379A Outer lead for a semiconductor IC package having individually annealed plated layers 失效
标题翻译：具有单独退火镀层的半导体IC封装的外引线
公开(公告)号：US5583379A
公开(公告)日：1996-12-10
申请号：US514838
申请日：1995-08-14
申请人： Kazuhisa Sato , Kazuo Kimura
发明人： Kazuhisa Sato , Kazuo Kimura
IPC分类号： H01H1/04 , H01L23/495 , H01L23/48
CPC分类号： H01L23/49582 , H01L2924/00014 , H01L2924/0002
摘要： An outer lead having a plurality of external leads 1 for electrically connecting the semiconductor IC of a semiconductor IC package to external devices comprises a base plate 11, a plated base structure formed over the surface of the base plate 11 and consisting of a plurality of plated base layers 12, 13 and 14 of Ni or a Ni alloy, and a surface layer 15 of Au or an Au alloy formed over the uppermost plated base layer 14 of the plated base structure. The number of the plated base layers is at least three. Each plated base layer 12, 13 and 14 of the plated base structure is subjected to crystal-growth annealing after being formed by plating to crystal-grow the grains thereof. A method of fabricating such an outer lead is provided.
摘要翻译：具有用于将半导体IC封装的半导体IC电连接到外部器件的多个外部引线1的外部引线包括基板11，形成在基板11的表面上的镀覆基体结构，由多个电镀 Ni或Ni合金的基底层12,13和14以及形成在镀覆基底结构的最上面镀覆的基底层14上的Au或Au合金的表面层15。电镀基层的数量至少为3个。电镀基体结构的每个镀覆基底层12,13和14在通过电镀形成晶体生长其晶粒之后进行结晶生长退火。提供一种制造这种外引线的方法。

68. 发明授权

US5565069A Process for producing 5-vinyl-2-norbornene 失效
标题翻译： 5-乙烯基-2-降冰片烯的制备方法
公开(公告)号：US5565069A
公开(公告)日：1996-10-15
申请号：US452279
申请日：1995-05-26
申请人： Nobuo Oi , Kazuo Kimura , Kenichi Nariyama
发明人： Nobuo Oi , Kazuo Kimura , Kenichi Nariyama
IPC分类号： C07C4/22 , C07C13/43 , B01D3/34 , C07C2/50
CPC分类号： C07C13/43 , C07C4/22 , C07C2101/10 , C07C2102/42 , Y02P20/582
摘要： A process for producing 5-vinyl-2-norbornene which comprises the steps of subjecting a liquid raw material in which tetrahydroindene/dicyclopentadiene ratio (by weight) falls within the range of from 5/100 to 80/100 to a thermal decomposition in liquid phase in the presence of an aromatic hydrocarbon solvent having a boiling point of from 250.degree. C. to 300.degree. C. at a reaction temperature of not lower than 200.degree. C. and lower than 240.degree. C. for a reaction time of from 10 minutes to 120 minutes to obtain a liquid reaction mixture (A-1) composed of 50% to 70% by weight of cyclopentadiene, distilling the liquid reaction mixture (A-1) to obtain fraction (B-1) composed of 90% to 100% by weight of cyclopentadiene and fraction (B-2) composed of 60% to 90% by weight of the total of dicyclopentadiene and tetrahydroindene, further distilling the fraction (B-2) to obtain fraction (B-3) composed of 15% to 40% by weight of dicyclopentadiene and fraction (B-4) composed of 60% to 100% by weight of tetrahydroindene, recycling the fraction (B-3) into the liquid raw material, removing the fraction (B-4) out of the system, and subjecting the fraction (B-1) to a Diels Alder reaction with butadiene to obtain a liquid reaction mixture (C-1) composed of 20% to 40% by weight of 5-vinyl-2-norbornene.
摘要翻译：一种制备5-乙烯基-2-降冰片烯的方法，其包括以下步骤：使四氢茚/二环戊二烯比（重量比）的液体原料在5/100至80/100范围内与液体中的热分解在不低于200℃且低于240℃的反应温度下，在沸点为250℃至300℃的芳族烃溶剂存在下，反应时间为10 分钟至120分钟，得到由50重量％至70重量％的环戊二烯组成的液体反应混合物（A-1），蒸馏出液体反应混合物（A-1），得到组分（B-1）为90％〜 100重量％的环戊二烯和由二环戊二烯和四氢茚的总量的60重量％至90重量％组成的级分（B-2），进一步蒸馏馏分（B-2），得到组分（B-3）15 ％至40重量％的二环戊二烯和由60重量％至100重量％组成的组分（B-4）四氢茚，将级分（B-3）再循环到液体原料中，从体系中除去级分（B-4），并将级分（B-1）与丁二烯进行Diels Alder反应，得到液体反应由20重量％至40重量％的5-乙烯基-2-降冰片烯组成的混合物（C-1）。

69. 发明授权

US5418933A Bidirectional tri-state data bus buffer control circuit for delaying direction switching at I/O pins of semiconductor integrated circuit 失效
标题翻译：双向三态数据总线缓冲控制电路，用于延迟半导体集成电路I / O引脚的方向切换
公开(公告)号：US5418933A
公开(公告)日：1995-05-23
申请号：US829472
申请日：1992-02-03
申请人： Kazuo Kimura , Takeshi Yoshii , Shigeki Imai , Katsuhiro Masui
发明人： Kazuo Kimura , Takeshi Yoshii , Shigeki Imai , Katsuhiro Masui
IPC分类号： G06F13/40 , H04L5/16 , G06F13/00 , G06F13/38
CPC分类号： G06F13/4072 , H04L5/16
摘要： A data bus control circuit is formed on a single semiconductor integrated circuit that includes input/output terminals for external data exchange and a plurality of functional blocks including a CPU. A bi-directional bus buffer buffers data sent over a data bus between the CPU and the input/output terminals. The signal propagation direction of the bus buffer is determined according to a logic level of a read control signal supplied from the CPU.
摘要翻译：数据总线控制电路形成在包括用于外部数据交换的输入/输出端子和包括CPU的多个功能块的单个半导体集成电路上。双向总线缓冲器缓冲通过CPU和输入/输出端子之间的数据总线发送的数据。总线缓冲器的信号传播方向根据从CPU提供的读取控制信号的逻辑电平来确定。

70. 发明授权

US5334774A Process for purifying phenol 失效
标题翻译：苯酚纯化方法
公开(公告)号：US5334774A
公开(公告)日：1994-08-02
申请号：US64982
申请日：1993-05-24
申请人： Kayoko Kogure , Kazuo Kimura , Michihiro Kawasaki , Masaaki Toma , Eiji Imamura
发明人： Kayoko Kogure , Kazuo Kimura , Michihiro Kawasaki , Masaaki Toma , Eiji Imamura
IPC分类号： C07B61/00 , C07C7/06 , C07C15/02 , C07C37/68 , C07C37/80 , C07C37/88 , C07C39/04 , C07C37/74
CPC分类号： C07C37/685 , C07C37/80 , C07C37/88 , Y02P20/582
摘要： A process for purifying and recovering phenol present in a mixed solution containing phenol and one or more compounds capable of forming azeotropic mixtures with phenol wherein an additive which is at least one compound belonging to the following groups 1 to 5 is added to the mixed solution and the resulting mixture is distilled:group 1: dialkylene glycols having 2-10 carbon atoms, polyalkylene glycols having 2-10 carbon atoms, and the ethers thereof,group 2: alkanediols having 2-20 carbon atoms,group 3: ethanolamine-type compounds represented by the formula (1) shown below,group 4: lactam compounds represented by the formula (2) shown below,group 5: quinoline, sulfolane, and N,N-dimethylimidazolidinone, ##STR1## wherein R.sub.1 represents an alkyl group having 1-6 carbon atoms, a cycloalkyl group having 1-6 carbon atoms, a monohydroxyalkyl group having 1-6 carbon atoms or a hydrogen atom, m represents an integer of 1-4, and X represents a hydroxyl group, an amino group or a hydrogen atom provided that R.sub.1 and X may conjointly represent a group which can be formed by removing respectively one hydrogen atom from R.sub.1 and X, respectively, and connecting the rests of R.sub.1 and X to form a cyclic ring, ##STR2## wherein R.sub.2 represents an alkyl group having 1-6 carbon atoms, a cycloalkyl group having 1-6 carbon atoms, a monohydroxyalkyl group having 1-6 carbon atoms, or a hydrogen atom, and n represents an integer of 3-7.
摘要翻译：一种纯化和回收苯酚存在于苯酚和一种或多种与苯酚形成共沸混合物的混合溶液中的苯酚的方法，其中将至少一种属于下列基团1至5的化合物的添加剂加入到混合溶液中，蒸馏得到的混合物：组1：具有2-10个碳原子的二亚烷基二醇，具有2-10个碳原子的聚亚烷基二醇及其醚，第2组：具有2-20个碳原子的烷二醇，第3组：乙醇胺型化合物由下式（1）表示的组4：由下式（2）表示的内酰胺化合物，组5：喹啉，环丁砜和N，N-二甲基咪唑烷酮，其中R1表示烷基具有1-6个碳原子的基团，具有1-6个碳原子的环烷基，具有1-6个碳原子的一羟基烷基或氢原子，m表示1-4的整数，X表示羟基，氨基组或水平条件是R1和X可以共同表示可以通过分别从R1和X分别除去一个氢原子并连接其余的R 1和X以形成环状而形成的基团，其中（2）其中 R2表示具有1-6个碳原子的烷基，具有1-6个碳原子的环烷基，具有1-6个碳原子的一羟基烷基或氢原子，n表示3-7的整数。

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