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    • 61. 发明授权
    • Image sensor with doped transfer gate
    • 具有掺杂传输门的图像传感器
    • US09000500B2
    • 2015-04-07
    • US12942517
    • 2010-11-09
    • Hung Q. DoanEric G. Stevens
    • Hung Q. DoanEric G. Stevens
    • H01L31/113H01L27/146
    • H01L27/14689H01L27/14603H01L27/14609H01L27/14612H01L27/14806
    • An image sensor includes an array of pixels, with at least one pixel including a photodetector formed in a substrate layer and a transfer gate disposed adjacent to the photodetector. The substrate layer further includes multiple charge-to-voltage conversion regions. A single photodetector can transfer collected charge to a single charge-to-voltage conversion region, or alternatively multiple photodetectors can transfer collected charge to a common charge-to-voltage conversion region shared by the photodetectors. An implant region formed when dopants are implanted into the substrate layer to form source/drain implant regions is disposed in only a portion of each transfer gate while each charge-to-voltage conversion region is substantially devoid of the implant region.
    • 图像传感器包括像素阵列,其中至少一个像素包括形成在基底层中的光电检测器和邻近光电检测器设置的传输栅极。 衬底层还包括多个电荷 - 电压转换区域。 单个光电检测器可以将收集的电荷转移到单个电荷至电压转换区域,或者多个光电检测器可以将收集的电荷转移到由光电检测器共享的公共电荷 - 电压转换区域。 当掺杂剂注入到衬底层中以形成源极/漏极注入区域时形成的注入区域仅设置在每个传输栅极的一部分中,而每个电荷 - 电压转换区域基本上没有植入区域。
    • 65. 发明授权
    • Photodetector isolation in image sensors
    • 图像传感器中的光电检测器隔离
    • US08101450B1
    • 2012-01-24
    • US12966238
    • 2010-12-13
    • Hung Q. DoanEric G. StevensRobert M. Guidash
    • Hung Q. DoanEric G. StevensRobert M. Guidash
    • H01L21/00H01L21/8238H01L21/176
    • H01L27/14689H01L27/1463H01L27/14683
    • Shallow trench isolation regions are disposed in an n-type silicon semiconductor layer laterally adjacent to a collection region of a photodetector and laterally adjacent to a charge-to-voltage conversion region. The shallow trench isolation regions each include a trench disposed in the silicon semiconductor layer and a first dielectric structure disposed along an interior bottom and sidewalls of each trench. A second dielectric structure is disposed over the pinning layer. The dielectric structures include a silicon nitride layer disposed over an oxide layer. An n-type isolation layer is disposed along only a portion of the exterior bottom of the trench and the exterior sidewall of the trench immediately adjacent to the photodetector. The n-type isolation layer is not disposed along the remaining portion of the bottom or the opposing exterior sidewall of the trench.
    • 浅沟槽隔离区设置在与光电检测器的收集区域相邻并且横向邻近电荷 - 电压转换区域的n型硅半导体层中。 浅沟槽隔离区域各自包括设置在硅半导体层中的沟槽和沿着每个沟槽的内部底部和侧壁设置的第一介电结构。 第二电介质结构设置在钉扎层之上。 电介质结构包括设置在氧化物层上的氮化硅层。 n型隔离层仅沿着沟槽的外部底部的一部分和紧邻光电检测器的沟槽的外侧壁设置。 n型隔离层不沿着沟槽的底部或相对的外侧壁的剩余部分设置。
    • 67. 发明申请
    • METHOD FOR FORMING DEEP ISOLATION IN IMAGERS
    • 在图像中形成深度隔离的方法
    • US20110159635A1
    • 2011-06-30
    • US12942507
    • 2010-11-09
    • Hung Q. DoanEric G. Stevens
    • Hung Q. DoanEric G. Stevens
    • H01L31/18
    • H01L27/1463H01L21/2253H01L27/14683
    • An image sensor having an imaging area that includes a substrate layer and a plurality of pixels formed therein. Multiple pixels each include a photodetector formed in the substrate layer. Isolation layers are formed in the substrate layer by performing a series of implants of one or more dopants of a first conductivity type into the substrate layer. Each isolation layer implant is performed with a different energy than the other isolation layer implants in the series and each implant implants the one or more dopants into the entire imaging area. The photodetectors are formed in the substrate layer by performing a series of implants of one or more dopants of a second conductivity type into each pixel in the substrate layer. Each photodetector implant is performed with a different energy than the other photodetector implants in the series.
    • 一种图像传感器,其具有包括基板层和形成在其中的多个像素的成像区域。 多个像素各自包括形成在基底层中的光电检测器。 通过将一种或多种第一导电类型的掺杂剂的一系列植入物进入衬底层,在衬底层中形成隔离层。 每个隔离层植入物以与串联中的其它隔离层植入物不同的能量来执行,并且每个植入物将一种或多种掺杂剂植入整个成像区域。 通过在衬底层中的每个像素中执行一系列对第二导电类型的掺杂剂的一种或多种注入物,在衬底层中形成光电检测器。 每个光电探测器植入物以与该系列中的其它光电检测器植入物不同的能量来执行。