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    • 8. 发明申请
    • PHOTODETECTOR ISOLATION IN IMAGE SENSORS
    • 图像传感器中的光电隔离
    • US20120080731A1
    • 2012-04-05
    • US12894262
    • 2010-09-30
    • Hung Q. DoanEric G. StevensRobert M. Guidash
    • Hung Q. DoanEric G. StevensRobert M. Guidash
    • H01L27/146
    • H01L27/1463H01L27/14607H01L27/1461H01L27/14645H01L27/14689
    • A first shallow trench isolation region is disposed in the silicon semiconductor layer laterally adjacent to a photodetector while a second shallow trench isolation region is disposed in the silicon semiconductor layer laterally adjacent to other electrical components in a pixel. The first and second shallow trench isolation regions each include a trench disposed in the silicon semiconductor layer that is filled with a dielectric material. An isolation layer having the second conductivity is disposed only along a portion of a bottom and only along a sidewall of the trench immediately adjacent to the photodetector. The isolation layer is not disposed along the other portion of the bottom and along the other sidewall of the trench adjacent the photodetector. The isolation layer is not disposed along the bottom and sidewalls of the trench adjacent to the other electrical components.
    • 第一浅沟槽隔离区域设置在与半导体器件的光电探测器侧向相邻的硅半导体层中,而第二浅沟槽隔离区域设置在与半导体层中的像素中的其它电气元件横向相邻的硅半导体层中。 第一和第二浅沟槽隔离区域各自包括设置在硅半导体层中的填充有电介质材料的沟槽。 具有第二导电性的隔离层仅沿着底部的一部分并且仅沿着与光电检测器紧邻的沟槽的侧壁设置。 隔离层不沿着底部的另一部分并且沿着邻近光电检测器的沟槽的另一个侧壁设置。 绝缘层不沿着与其它电气部件相邻的沟槽的底部和侧壁设置。
    • 9. 发明申请
    • TRENCH ISOLATION REGIONS IN IMAGE SENSORS
    • 图像传感器中的分离区域
    • US20100148230A1
    • 2010-06-17
    • US12332407
    • 2008-12-11
    • Eric G. StevensHung Q. Doan
    • Eric G. StevensHung Q. Doan
    • H01L21/762H01L31/112
    • H01L27/14689H01L21/76224H01L27/1463
    • Trenches are formed in a substrate or layer and a solid source doped with one or more dopants is deposited over the image sensor such that the solid source fills the one or more trenches and is disposed on the surface of the substrate. The surface of the image sensor is then planarized so that the solid source remains only in the trenches. A thermal drive operation is performed to cause at least a portion of the one or more dopants in the solid source to diffuse into the portions of the substrate or layer that are immediately adjacent to and surround the sidewall and bottom surfaces of the trenches. The diffused dopant or dopants form passivation regions that passivate the interface between the substrate or layer and the sidewall and bottom surfaces of the trenches.
    • 沟槽形成在衬底或层中,并且掺杂有一种或多种掺杂剂的固体源沉积在图像传感器上,使得固体源填充一个或多个沟槽并且设置在衬底的表面上。 然后将图像传感器的表面平坦化,使得固体源仅保留在沟槽中。 执行热驱动操作以使固体源中的一种或多种掺杂剂的至少一部分扩散到紧邻和围绕沟槽的侧壁和底表面的衬底或层的部分。 扩散掺杂剂或掺杂剂形成钝化区域,其钝化衬底或层与沟槽的侧壁和底表面之间的界面。
    • 10. 发明申请
    • METHOD FOR FORMING PHOTODETECTOR ISOLATION IN IMAGERS
    • 在图像中形成光电离分离的方法
    • US20120083067A1
    • 2012-04-05
    • US12894281
    • 2010-09-30
    • Hung Q. DoanEric G. StevensRobert M. Guidash
    • Hung Q. DoanEric G. StevensRobert M. Guidash
    • H01L31/18
    • H01L27/14689H01L27/14607H01L27/1463
    • A first shallow trench isolation region is disposed in the silicon semiconductor layer laterally adjacent to a photodetector while a second shallow trench isolation region is disposed in the silicon semiconductor layer laterally adjacent to other electrical components in a pixel. The first and second shallow trench isolation regions each include a trench disposed in the silicon semiconductor layer that is filled with a dielectric material. An isolation layer having the second conductivity is disposed only along a portion of a bottom and only along a sidewall of the trench immediately adjacent to the photodetector. The isolation layer is not disposed along the other portion of the bottom and along the other sidewall of the trench adjacent the photodetector. The isolation layer is not disposed along the bottom and sidewalls of the trench adjacent to the other electrical components.
    • 第一浅沟槽隔离区域设置在与半导体器件的光电探测器侧向相邻的硅半导体层中,而第二浅沟槽隔离区域设置在与半导体层中的像素中的其它电气元件横向相邻的硅半导体层中。 第一和第二浅沟槽隔离区域各自包括设置在硅半导体层中的填充有电介质材料的沟槽。 具有第二导电性的隔离层仅沿着底部的一部分并且仅沿着与光电检测器紧邻的沟槽的侧壁设置。 隔离层不沿着底部的另一部分并且沿着邻近光电检测器的沟槽的另一个侧壁设置。 绝缘层不沿着与其它电气部件相邻的沟槽的底部和侧壁设置。