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    • 66. 发明授权
    • Method and apparatus for forming a thin polymer layer on an integrated circuit structure
    • 在集成电路结构上形成薄聚合物层的方法和装置
    • US06663713B1
    • 2003-12-16
    • US08734978
    • 1996-10-22
    • Stuardo A. RoblesVisweswaren SivaramakrishnanBang C. NguyenGayathri RaoGary FongVicente LamPeter Wai-Man LeeMei Chang
    • Stuardo A. RoblesVisweswaren SivaramakrishnanBang C. NguyenGayathri RaoGary FongVicente LamPeter Wai-Man LeeMei Chang
    • C23C1600
    • H01L21/02118B05D1/60C23C16/44C23C16/452H01L21/02271H01L21/02301H01L21/312
    • A method and apparatus are disclosed for forming thin polymer layers on semiconductor substrates. In one embodiment, the method and apparatus include the vaporization of stable di-pxylylene, the pyrolytic conversion of such gaseous dimer material into reactive monomers, and the optional blending of the resulting gaseous p-xylylene monomers with one or more polymerizable materials in gaseous form capable of copolymerizing with the p-xylylene monomers to form a low dielectric constant polymerized parylene material. An apparatus is also disclosed which provides for the distribution of the polymerizable gases into the deposition chamber, for cooling the substrate down to a temperature at which the gases will condense to form a polymerized dielectric material, for heating the walls of the deposition chamber to inhibit formation and accumulation of polymerized residues thereon, and for recapturing unreacted monomeric vapors exiting the deposition chamber. An apparatus is further provided downstream of the deposition chamber to control both the flow rate or residence time of the reactive monomer in the deposition chamber as well as to control the pressure of the deposition chamber. Provision is further made for an electrical bias to permit the apparatus to function as a plasma etch chamber, for in situ plasma cleaning of the chamber between depositions, for enhancing cracking of polymerizable precursor material, for heating the walls of the chamber and for providing heat sufficient to prevent polymerization in the gas phase.
    • 公开了用于在半导体衬底上形成薄聚合物层的方法和装置。 在一个实施方案中,所述方法和装置包括稳定的二 - 二甲苯的蒸发,将这种气态二聚体材料热解转化成反应性单体,以及任选地将所得气态对二甲苯单体与一种或多种气态形式的可聚合材料 能够与对二甲苯单体共聚以形成低介电常数的聚对二甲苯聚合物。 还公开了一种设备,其提供可聚合气体分布到沉积室中,用于将衬底冷却至气体冷凝以形成聚合电介质材料的温度,以加热沉积室的壁以抑制 在其上聚合的残余物的形成和积累,以及用于重新捕获离开沉积室的未反应的单体蒸气。 还在沉积室的下游设置一个装置,以控制反应性单体在沉积室中的流速或停留时间以及控制沉积室的压力。 进一步提供电偏压以允许该装置用作等离子体蚀刻室,用于沉积之间的腔室的原位等离子体清洁,用于增强可聚合前体材料的裂化,用于加热室的壁并提供热量 足以防止气相中的聚合。
    • 67. 发明授权
    • In-situ liquid flow rate estimation and verification by sonic flow method
    • 声流法原位液体流量估算与验证
    • US5968588A
    • 1999-10-19
    • US819674
    • 1997-03-17
    • Visweswaren SivaramakrishnanYen-Kun WangFong ChangThanh PhamJeff Plante
    • Visweswaren SivaramakrishnanYen-Kun WangFong ChangThanh PhamJeff Plante
    • C23C16/448C23C16/52C23C16/00
    • C23C16/52C23C16/4481
    • An apparatus for in-situ control of the flow of a liquid precursor into a deposition chamber comprises a liquid injection system having a liquid injection outlet connected to a chamber inlet line upstream of the deposition chamber. The liquid injection system includes a liquid precursor supply, a carrier gas supply, a vaporizer, and a controller managing flows of the liquid precursor and carrier gas to the chamber. A bypass line is connected to the chamber inlet line and includes a bypass valve, a sonic orifice, and a pressure gauge upstream of the sonic orifice. To calibrate the flow of the liquid precursor, a flow of carrier gas is directed into the bypass line at a carrier gas sonic flow rate. A first steady state pressure is measured with the pressure gauge. The liquid precursor is vaporized and directed to the flow of carrier gas into the bypass line. A second steady state pressure is measured with the pressure gauge. Calibration information is computed using the first steady state pressure and second steady state pressure based on sonic flow theory. The calibration information is used to calibrate the controller to correct deviations in the liquid flow rate and achieve a target liquid precursor flow rate for improving wafer uniformity.
    • 用于原位控制液体前体进入沉积室的装置包括液体注射系统,其具有连接到沉积室上游的室入口管的液体注入口。 液体注射系统包括液体前体供应源,载气供应器,蒸发器和控制液体前体和载气流到腔室的控制器。 旁路管路连接到腔室入口管线,并且包括旁通阀,声波孔口和声波孔口上游的压力计。 为了校准液体前体的流动,以载气声音流速将载气流引导到旁路管线中。 用压力表测量第一稳态压力。 液体前体蒸发并引导到载气流入旁通管线。 用压力表测量第二稳态压力。 基于声流理论,使用第一稳态压力和第二稳态压力计算校准信息。 校准信息用于校准控制器以校正液体流速中的偏差,并实现目标液体前体流速以改善晶片均匀性。