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    • 61. 发明授权
    • Magnetoresistive (MR) sensor element with sunken lead structure
    • 具有凹陷引线结构的磁阻(MR)传感元件
    • US06798622B2
    • 2004-09-28
    • US10370346
    • 2003-02-19
    • Kochan JuJei-Wei ChangCheng Horng
    • Kochan JuJei-Wei ChangCheng Horng
    • G11B5127
    • G11B5/3903B82Y10/00B82Y25/00G01R33/09G11B5/3163G11B5/3967G11B2005/3996
    • A method for forming a magnetoresistive (MR) sensor element. There is first provided a substrate. There is then formed over the substrate a seed layer. There is then formed contacting a pair of opposite ends of the seed layer a pair of patterned conductor lead layer structures. There is then etched, while employing an ion etch method, the seed layer and the pair of patterned conductor lead layer structures to form an ion etched seed layer and a pair of ion etched patterned conductor lead layer structures. Finally, there is then formed upon the ion etched seed layer and the pair of ion etched patterned conductor lead layers structures a magnetoresistive (MR) layered structure. Within the magnetoresistive (MR) sensor element, the pair of patterned conductor lead layer structures may be formed within a pair of recesses within an ion etch recessed dielectric isolation layer.
    • 一种用于形成磁阻(MR)传感器元件的方法。 首先提供基板。 然后在衬底上形成种子层。 然后形成一对图案化的导体引线层结构使种子层的一对相对端接触。 然后蚀刻,同时采用离子蚀刻方法,晶种层和一对图案化的导体引线层结构,以形成离子蚀刻种子层和一对离子蚀刻图案化导体引线层结构。 最后,然后形成在离子蚀刻种子层上,并且一对离子蚀刻图案化的导体引线层构成磁阻(MR)层状结构。 在磁阻(MR)传感器元件内,一对图案化的导体引线层结构可以形成在离子蚀刻凹陷的介电隔离层内的一对凹槽内。
    • 63. 发明授权
    • CPP and MTJ reader design with continuous exchange-coupled free layer
    • CPP和MTJ读卡器设计,具有连续的交换耦合自由层
    • US07201947B2
    • 2007-04-10
    • US10238269
    • 2002-09-10
    • Simon LiaoKochan JuYoufeng Zheng
    • Simon LiaoKochan JuYoufeng Zheng
    • B29C35/08
    • B82Y25/00B82Y10/00G11B5/3116G11B5/313G11B5/3163G11B5/3903G11B5/3909G11B2005/3996Y10T29/49046
    • As track widths of magnetic read heads grow very small, conventional longitudinal bias stabilization has been found to no longer be suitable since the strong magnetostatic coupling at the track edges also pins the magnetization of the free layer. This problem has been overcome by extending the free layer so that it is no longer confined to the area immediately below the spacer or tunneling layer. A longitudinal bias layer immediately below the free layer is given a relatively weak magnetic exchange coupling field of about 200 Oe. Although there is strong exchange coupling between this and the free layer, the degree of pinning of the free layer is low so that the device's output signal is reduced by less than about 10%. A process for manufacturing both the CPP SV and a MTJ versions of the invention is described.
    • 随着磁读头的轨道宽度增长非常小,传统的纵向偏置稳定性已经被发现不再适用,因为轨道边缘处的强静磁耦合也引导自由层的磁化。 已经通过延伸自由层来克服这个问题,使得它不再局限于间隔物或隧道层正下方的区域。 在自由层正下方的纵向偏置层被给予约200Oe的相对较弱的磁交换耦合场。 尽管在这种自由层之间存在很强的交换耦合,但是自由层的钉扎程度很低,因此器件的输出信号减少了约10%。 描述了用于制造本发明的CPP SV和MTJ版本的方法。
    • 66. 发明授权
    • CPP head with parasitic shunting reduction
    • CPP头与寄生分流减少
    • US07279269B2
    • 2007-10-09
    • US10734422
    • 2003-12-12
    • Jeiwei ChangStuart KaoChao Peng ChenChunping LuoKochan JuMin Li
    • Jeiwei ChangStuart KaoChao Peng ChenChunping LuoKochan JuMin Li
    • G11B5/39
    • G11B5/3163G11B5/398Y10T428/1171
    • The series resistance of a CPP GMR stack can be reduced by shaping it into a small upper, on a somewhat larger, lower part. Because of the sub-micron dimensions involved, good alignment between these is normally difficult to achieve. The present invention discloses a self-alignment process based on first laying down a mask that will determine the shape of the top part. Ion beam etching is then initiated, the ion beam being initially applied from one side only at an angle to the surface normal. During etching, all material on the near side of the mask gets etched but, on the far side, only material that is outside the mask's shadow gets removed so, depending on the beam's angle, the size of the lower part is controlled and the upper part is precisely centrally aligned above it.
    • CPP GMR堆叠的串联电阻可以通过将其成形为较小的上部,在较小的较低部分上来减小。 由于涉及亚微米尺寸,这些之间的良好对准通常难以实现。 本发明公开了一种基于第一次铺设掩模的自对准过程,该掩模将确定顶部的形状。 然后开始离子束蚀刻,离子束最初仅从一侧以与表面法线成一定角度施加。 在蚀刻期间,掩模近侧的所有材料都被蚀刻,但在远侧,只有在掩模阴影之外的材料被去除,因此根据光束的角度,下部的尺寸被控制,并且上部 部分精确地集中在其上。