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    • 51. 发明授权
    • Bubble propagation circuits and formation thereof
    • 气泡传播电路及其形成
    • US3996573A
    • 1976-12-07
    • US569626
    • 1975-04-21
    • Shalendra Kumar Singh
    • Shalendra Kumar Singh
    • G11C19/08H01F10/06G11C11/14
    • G11C19/0816H01F10/06
    • A magnetic domain memory comprising a planar layer of magnetic material in which magnetic bubbles are moved by a rotating magnetic field in the plane of the layer. At least one circuit or path is provided for guiding the propagation of the bubbles in the layer. This path comprises an overlay pattern of magnetically soft material the periphery of which defines the travel of the bubbles. The surface area of the layer bounding the outside of the overlay pattern comprises an ion-implanted region. This magnetic bubble propagation circuit is made by forming a thin film pattern of a magnetically soft material, such as permalloy, on the surface of a layer of magnetic material, and then directing at the surface of this layer ions having a sufficiently high energy level so as to effect implantation thereof in the lattice structure of the magnetic layer while utilizing the pattern of magnetically soft material to block the ions from penetration of the magnetic layer underlying the pattern.
    • 一种磁畴存储器,其包括磁性材料的平面层,其中通过所述层的平面中的旋转磁场使磁性气泡移动。 提供至少一个电路或路径来引导层中气泡的传播。 该路径包括磁性软材料的覆盖图案,其周边限定气泡的行进。 覆盖覆盖图案外侧的层的表面积包括离子注入区域。 该磁性气泡传播电路通过在磁性材料层的表面上形成诸如坡莫合金的软磁性材料的薄膜图案,然后在该层的表面上引导具有足够高的能级的离子, 为了在磁性层的晶格结构中实现其植入,同时利用磁软材料的图案阻挡离子从图案下方的磁性层的穿透。
    • 52. 发明授权
    • Apparatus for plating elongated bodies
    • 用于电镀细长体的装置
    • US3963569A
    • 1976-06-15
    • US529778
    • 1974-12-05
    • Emil Toledo
    • Emil Toledo
    • C25D7/06H01F10/06H01F41/26C25D5/08C25D17/00
    • H01F41/26C25D7/0607H01F10/06
    • An electropolished, copper plated, beryllium copper wire is plated with a composite coating of a nickel-iron-cobalt alloy. Such coating consists of a layer having a high anisotropic field parameter, of the order of 6 oersteds or higher, adjacent the surface of the wire, superimposed by a layer having a lower anisotropic field parameter, of the order of 4 oersteds or less. The wire is plated in two plating cells, the first of which is provided with a plurality of passages directing the flow of a plating electrode with a major component of flow across the wire and a minor component of flow in one direction along the wire. The second plating cell is provided with a plurality of passages directing the flow of a plating electrolyte substantially transverse to the wire. The electrolyte supplied to the first cell contains salts of iron, nickel and cobalt, with cobalt being present in a relatively high concentration. A similar electrolyte is supplied to the second cell except that its maximum concentration of cobalt is about one fifth of that of the first electrolyte.
    • 电抛光,镀铜的铍铜线镀有镍 - 钴 - 钴合金复合涂层。 这样的涂层由具有大于6奥斯特或更高的高各向异性场参数的层构成,邻近线的表面,叠加有具有较低各向异性场参数的层,大约为4奥斯特或更小。 导线被镀在两个电镀单元中,其中第一个电镀槽设置有多个通道,其引导镀层电极的流动,其中流动的主要成分流过电线,并且沿导线沿一个方向流动一小部分流。 第二电镀单元设置有多个通道,其引导电镀电解液的流动基本横向于电线。 提供给第一个电池的电解质含有铁,镍和钴的盐,其中钴以较高的浓度存在。 将类似的电解质供应到第二电池,不同之处在于钴的最大浓度是第一电解质的约五分之一。