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51. 发明授权

US08828759B2 Formation of uniform phosphor regions for broad-area lighting systems 有权
标题翻译：形成用于广域照明系统的均匀磷光体区域
公开(公告)号：US08828759B2
公开(公告)日：2014-09-09
申请号：US13684806
申请日：2012-11-26
申请人： Cooledge Lighting, Inc.
发明人： Michael A. Tischler , Calvin W. Sheen
IPC分类号： H01L51/40 , H01L21/67 , H05K13/04 , H01L33/50
CPC分类号： H01L33/504 , H01L21/67132 , H01L33/005 , H01L33/50 , H01L33/505 , H01L33/507 , H01L2933/0041 , H05K13/046 , Y10T29/53174
摘要： In accordance with certain embodiments, phosphor arrangements are formed via adhering phosphors to activated regions on a substrate and transferring them to a different substrate.
摘要翻译：根据某些实施例，通过将磷光体粘附到衬底上的激活区域并将其转移到不同的衬底上来形成磷光体布置。

52. 发明授权

US08826522B2 Method and set of tools for inserting ferrite members onto electrical filter connectors 有权
标题翻译：将铁氧体部件插入电气过滤器连接器的方法和工具集
公开(公告)号：US08826522B2
公开(公告)日：2014-09-09
申请号：US13481010
申请日：2012-05-25
申请人： Robert Roblot
发明人： Robert Roblot
IPC分类号： H01R43/20 , H01R43/22 , H01R43/045 , H01R13/7193 , H01R13/7197
CPC分类号： H01R43/22 , H01R13/7193 , H01R13/7197 , H01R43/045 , Y10T29/49002 , Y10T29/49117 , Y10T29/49204 , Y10T29/49208 , Y10T29/5313 , Y10T29/53174 , Y10T29/532 , Y10T29/53209
摘要： A method for the insertion of ferrite members onto pins acting as the contacts of an electrical filter connector. The ferrite members are oriented to a desired orientation by a known method. The ferrite members are preferably oriented in the vertical position for storage and are conveyed to a dynamic storage lock chamber equipped with a ferrite member stopping mechanism. A ferrite member distribution system incorporating a horizontally moving distribution plate individually releases the ferrite members from the lock chamber into the distribution system and inserts ferrite members onto the contacts according to a rate controlled by the operator.
摘要翻译：一种用于将铁氧体部件插入到用作电过滤器连接器的触点的引脚上的方法。铁氧体部件通过公知的方法取向成所需的取向。铁氧体构件优选地定位在用于存储的垂直位置，并被输送到配备有铁氧体构件停止机构的动态存储锁定室。包括水平移动的分配板的铁氧体部件分配系统将铁氧体部件从锁定室单独地释放到分配系统中，并且根据操作者控制的速率将铁氧体部件插入到触头上。

53. 发明授权

US08792248B2 Method for providing improved power distribution or power dissipation to an electrical component attached to main circuit board 有权
标题翻译：为连接到主电路板的电气部件提供改进的配电或功率消耗的方法
公开(公告)号：US08792248B2
公开(公告)日：2014-07-29
申请号：US13507380
申请日：2012-06-22
申请人： James V Russell
发明人： James V Russell
IPC分类号： H05K1/18
CPC分类号： H05K1/185 , H05K1/023 , H05K1/0231 , H05K1/0234 , H05K3/4046 , H05K2201/096 , H05K2201/10636 , Y02P70/611 , Y10T29/4913 , Y10T29/49139 , Y10T29/49146 , Y10T29/53174
摘要： The present invention provides a method for embedding a power modification component such as a capacitance inside of an adaptor board located to extend over and beyond the vias of the main circuit board so that a portion of the interposer board containing the embedded capacitance is located beyond where the vias or blind vias are located. This permits that via to conduct through the opening. In this way, the capacitance and the resistance will have a closer contact point to the electrical component. With this methodology a resistance can also be embedded in an opening in the adaptor board and be vertically aligned within the opening to make contact with a pad on top of the adaptor board and a pad at the bottom of the adaptor board so that electricity conducts through the embedded component.
摘要翻译：本发明提供了一种用于将诸如电容内部的电容的功率改进组件嵌入位于延伸超过主电路板的通孔的适配器板的方法，使得包含嵌入电容的插入板的一部分位于通孔或盲孔位于。这允许via通过开放。以这种方式，电容和电阻将具有与电气部件更接近的接触点。使用这种方法，电阻也可以嵌入在适配器板的开口中，并且在开口内垂直对准，以使接触适配器板顶部的焊盘和适配器板底部的焊盘，使得电通过嵌入式组件。

54. 发明申请

US20140201971A1 ASSEMBLY OF ELECTRONIC AND OPTICAL DEVICES 审中-公开
标题翻译：电子和光学装置的组装
公开(公告)号：US20140201971A1
公开(公告)日：2014-07-24
申请号：US14224331
申请日：2014-03-25
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Tymon Barwicz , Bing Dang
IPC分类号： B23P11/00
CPC分类号： B23P11/00 , B25B11/02 , H05K13/0404 , H05K13/0409 , Y10T29/49126 , Y10T29/49133 , Y10T29/49826 , Y10T29/49895 , Y10T29/49901 , Y10T29/53174 , Y10T29/53191 , Y10T29/53974
摘要： A method for operating an assembly tool includes deposing a first component on an assembly surface with a first tool tip of a manipulator having a range of motion defined by a plane and an axis that is substantially normal to the plane, deposing a second component on the assembly surface, changing an orientation of the assembly surface relative to the axis from a first orientation to a second orientation, lifting the first component from the assembly surface with a second tool tip of the manipulator, and deposing the first component on the second component.
摘要翻译：一种用于操作组装工具的方法包括：在装配表面上拆卸第一部件，其中操纵器的第一工具尖端具有由平面和基本垂直于该平面的轴限定的运动范围，组装表面，使组装表面相对于轴线从第一方向改变到第二方向，使第一部件从组装表面用操纵器的第二工具尖端提升，并将第一部件放置在第二部件上。

55. 发明申请

US20140169927A1 MICRO PICK UP ARRAY WITH INTEGRATED PIVOT MOUNT 有权
标题翻译：微型拾取阵列与集成的装置
公开(公告)号：US20140169927A1
公开(公告)日：2014-06-19
申请号：US13715591
申请日：2012-12-14
申请人： LUXVUE TECHNOLOGY CORPORATION
发明人： Dariusz Golda , John A. Higginson , Andreas Bibl
IPC分类号： B25J15/00 , H02N13/00
CPC分类号： B25J15/0085 , B25J7/00 , B81C99/002 , H01L24/75 , H01L2224/7598 , Y10T29/53174
摘要： Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a micro pick up array structure allows the micro pick up array to automatically align with the carrier substrate. Deflection of the micro pick up array may be detected to control further movement of the micro pick up array.
摘要翻译：公开了用于从载体衬底传送微器件的系统和方法。在一个实施例中，微拾取阵列结构允许微拾取阵列自动地与载体衬底对准。可以检测微拾取阵列的偏转以控制微拾取阵列的进一步移动。

56. 发明申请

US20140157591A1 ELECTRONIC COMPONENT MOUNTING SYSTEM 有权
标题翻译：电子元件安装系统
公开(公告)号：US20140157591A1
公开(公告)日：2014-06-12
申请号：US14131807
申请日：2012-08-31
申请人： Daisuke Nagai
发明人： Daisuke Nagai
IPC分类号： H05K13/04 , H05K13/08
CPC分类号： H05K13/04 , H05K3/341 , H05K13/08 , H05K13/0817 , H05K13/084 , H05K2203/163 , Y10T29/53174
摘要： A substrate standby unit that is capable of keeping only one substrate 4 on standby in a substrate sorting mechanism 40 that moves the substrate 4 from the print inspection device M2 to the component installation device M4, a memory device 60 that stores a substrate ID on the substrate 4 that is on standby in the substrate standby unit, and a substrate ID management unit 46 that updates the substrate ID that is stored in the memory device 60 accompanying the transfer of the substrate 4 from the print inspection device M2 to the substrate standby unit are included. The substrate ID stored in the memory device 60 and the inspection result data associated with this substrate ID and stored in an inspection result data memory unit 45 are transmitted to the component installation device M4.
摘要翻译：基板待机单元，其能够将基板4从印刷检查装置M2移动到部件安装装置M4的基板分选机构40中仅保持一个基板4待机;存储装置60，其将基板ID存储在在衬底备用单元中待机的衬底4和衬底ID管理单元46，其将伴随着衬底4的转印的存储在存储器件60中的衬底ID从打印检查装置M2更新到衬底备用单元46 包括在内。存储在存储装置60中的基板ID和与该基板ID相关联并存储在检查结果数据存储单元45中的检查结果数据被发送到部件安装装置M4。

57. 发明申请

US20140130341A1 METHOD AND SYSTEM FOR PINS DETECTION AND INSERTION OF ELECTRONIC COMPONENT 有权
标题翻译：用于PINS检测和插入电子元件的方法和系统
公开(公告)号：US20140130341A1
公开(公告)日：2014-05-15
申请号：US14074960
申请日：2013-11-08
申请人： Industrial Technology Research Institute
发明人： KUO-FENG HUNG , YUNG-JUNG CHANG , YEN-CHIA PENG
IPC分类号： H05K3/30 , H05K13/00
CPC分类号： H05K13/0015 , H05K3/306 , H05K13/08 , H05K13/0812 , Y10T29/49004 , Y10T29/53174
摘要： A method and system for pins detection and insertion of an electronic component are provided. The method includes picking an electronic component having a plurality of pins by a pick and place device, acquiring a plurality of serial images with respect to the plurality of pins at different height along an image acquiring direction by an image acquiring device, separately detecting image positions corresponding to the plurality of pins in the plurality of serial images, determining whether the electronic component is qualified according to a distance between the image positions of two adjacent pins, and if the electronic component is qualified, inserting the electronic component to a circuit board according to a position relationship between the image positions of the pins and a geometric center position of the pick and place device.
摘要翻译：提供了一种用于针检测和插入电子部件的方法和系统。该方法包括通过拾取和放置装置拾取具有多个销的电子部件，通过图像获取装置沿着图像获取方向获取与多个针脚相对于多个针脚的多个串行图像，分别检测图像位置对应于多个串行图像中的多个引脚，根据两个相邻引脚的图像位置之间的距离来确定电子元件是否合格，并且如果电子元件合格，则将电子元件插入到电路板中到针脚的图像位置与拾放装置的几何中心位置之间的位置关系。

58. 发明授权

US08707550B2 Bonding machine incorporating dual-track transfer mechanism 有权
标题翻译：粘合机结合双轨传输机制
公开(公告)号：US08707550B2
公开(公告)日：2014-04-29
申请号：US12508780
申请日：2009-07-24
申请人： Keng Yew James Song , Ka Shing Kenny Kwan , Choong Kead Leslie Lum , Ting Yu He
发明人： Keng Yew James Song , Ka Shing Kenny Kwan , Choong Kead Leslie Lum , Ting Yu He
IPC分类号： H01L21/58 , H01L21/60 , H05K13/04
CPC分类号： H01L24/85 , H01L24/48 , H01L2224/05599 , H01L2224/45015 , H01L2224/45144 , H01L2224/48 , H01L2224/78 , H01L2224/85 , H01L2224/85207 , H01L2224/85399 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/3011 , Y10T29/49126 , Y10T29/4913 , Y10T29/5313 , Y10T29/53174 , Y10T29/53183 , Y10T29/53261 , Y10T29/53265 , H01L2924/00 , H01L2924/20757 , H01L2924/00015 , H01L2924/00014 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756
摘要： A bonding apparatus for bonding electronic devices including substrates comprises first and second rails arranged adjacent to each other which are configured to align the substrates in vertical orientations during transportation along the rails. A bonding system is locatable over a first bonding site which is located along the first rail and a second bonding site which is located along the second rail. A first indexer is located adjacent to the first rail and a second indexer is located adjacent to the second rail wherein each indexer is independently operative to transport a substrate along one rail while a substrate held on the other rail is being bonded. A container located at one end of the rails for holding multiple unbonded substrates is operative to feed unbonded substrates directly to the rails.
摘要翻译：用于接合包括基板的电子设备的接合装置包括彼此相邻布置的第一和第二轨道，所述第一和第二轨道被配置为在沿着轨道的运输期间沿垂直取向对准基板。接合系统可位于沿着第一轨道定位的第一接合位置和沿着第二轨道定位的第二接合位置。第一分度器位于第一轨道附近并且第二分度器位于第二轨道附近，其中每个分度器独立地操作以沿着一个轨道输送基板，同时保持在另一个导轨上的基板被接合。位于轨道一端的用于保持多个未粘结基底的容器可操作以将未粘合的基底直接供给到轨道。

59. 发明授权

US08701275B2 Surface mounting apparatus 有权
标题翻译：表面贴装装置
公开(公告)号：US08701275B2
公开(公告)日：2014-04-22
申请号：US12470105
申请日：2009-05-21
申请人： Hiroyuki Kagaya
发明人： Hiroyuki Kagaya
IPC分类号： H05K13/08
CPC分类号： H05K13/0812 , Y10T29/49131 , Y10T29/53091 , Y10T29/53174 , Y10T29/53178
摘要： A surface mounting apparatus includes a mounting head which is movable in X and Y directions and which mounts an electronic component on a positioned board, and a board recognizing camera is fixed to a base and which moves integrally with the mounting head. A correction jig includes a correction mark which is imaged by the board recognizing camera, and an imaging result is used to correct temporal change in an interior portion of the camera including an optical system, and is fixed to the base.
摘要翻译：表面安装装置包括可在X和Y方向上移动的安装头，并且将电子部件安装在定位的板上，并且板识别照相机固定到基座并与安装头一体移动。校正夹具包括由板识别摄像机成像的校正标记，并且成像结果用于校正包括光学系统的照相机的内部部分中的时间变化，并且固定到基座。

60. 发明申请

US20140096379A1 ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMENT MACHINE, AND ELECTRONIC COMPONENT MOUNTING SYSTEM 有权
标题翻译：电子元件安装方法，电子元件放置机和电子元件安装系统
公开(公告)号：US20140096379A1
公开(公告)日：2014-04-10
申请号：US14119832
申请日：2012-06-01
申请人： Tsubasa Saeki , Yoshiyuki Wada , Koji Motomura , Tadahiko Sakai
发明人： Tsubasa Saeki , Yoshiyuki Wada , Koji Motomura , Tadahiko Sakai
IPC分类号： H05K3/30
CPC分类号： H05K3/305 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/11822 , H01L2224/131 , H01L2224/16225 , H01L2224/16265 , H01L2224/29012 , H01L2224/2919 , H01L2224/30155 , H01L2224/32225 , H01L2224/73103 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/7501 , H01L2224/7515 , H01L2224/75611 , H01L2224/75821 , H01L2224/81011 , H01L2224/8102 , H01L2224/81024 , H01L2224/81143 , H01L2224/81193 , H01L2224/81815 , H01L2224/81903 , H01L2224/81986 , H01L2224/83104 , H01L2224/83192 , H01L2224/83194 , H01L2224/8385 , H01L2224/83862 , H01L2224/9211 , H01L2924/19105 , H01L2924/351 , H05K3/34 , H05K3/3405 , H05K3/3436 , H05K3/3468 , H05K3/3484 , H05K3/3489 , H05K3/3494 , H05K13/0465 , H05K2201/10977 , Y02P70/613 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49149 , Y10T29/49179 , Y10T29/53174 , H01L2924/00 , H01L2924/00014 , H01L2924/00012 , H01L2924/014 , H01L2224/81 , H01L2224/83 , H01L2224/9205
摘要： An electronic component mounting method including the steps of: providing a first electronic component having a principal surface provided with a plurality of bumps; providing a substrate having a placement area provided with a plurality of first electrodes corresponding to the plurality of bumps; applying flux to the plurality of bumps; applying flux to at least one of the first electrodes adjacent to at least one reinforcement position set on a peripheral portion of the placement area; dispensing a thermosetting resin onto the reinforcement position, and at least partially coating the first electrode adjacent to the reinforcement position, with the thermosetting resin; placing the first electronic component on the substrate such that the bumps land on the corresponding first electrodes, and thus bringing the thermosetting resin into contact with a peripheral edge portion of the first electronic component; and heating the substrate with the first electronic component placed thereon.
摘要翻译：一种电子部件安装方法，包括以下步骤：提供具有设置有多个凸块的主表面的第一电子部件; 提供具有设置有与所述多个凸块相对应的多个第一电极的放置区域的基板; 向所述多个凸起施加通量; 向与所述放置区域的周边部分上设置的至少一个加强位置相邻的所述第一电极中的至少一个施加通量; 将热固性树脂分配到加强位置，并用热固性树脂至少部分地涂覆邻近加强位置的第一电极; 将所述第一电子部件放置在所述基板上，使得所述凸起落在相应的第一电极上，从而使所述热固性树脂与所述第一电子部件的周缘部接触; 并且将第一电子部件放置在基板上进行加热。

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