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1. 发明授权

US08686299B2 Electronic element unit and reinforcing adhesive agent 有权
标题翻译：电子元件单元和增强粘合剂
公开(公告)号：US08686299B2
公开(公告)日：2014-04-01
申请号：US13382368
申请日：2010-05-26
申请人： Koji Motomura , Seiichi Yoshinaga , Tadahiko Sakai
发明人： Koji Motomura , Seiichi Yoshinaga , Tadahiko Sakai
IPC分类号： H05K1/16 , H05K3/34 , H05K3/30
CPC分类号： H05K3/305 , H01L21/563 , H01L23/295 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/98 , H01L2224/0401 , H01L2224/06151 , H01L2224/06155 , H01L2224/131 , H01L2224/14135 , H01L2224/16225 , H01L2224/16227 , H01L2224/1703 , H01L2224/17051 , H01L2224/17135 , H01L2224/17179 , H01L2224/17505 , H01L2224/17517 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/32052 , H01L2224/32225 , H01L2224/33179 , H01L2224/73203 , H01L2224/8114 , H01L2224/81191 , H01L2224/81193 , H01L2224/81194 , H01L2224/8121 , H01L2224/8159 , H01L2224/81599 , H01L2224/81609 , H01L2224/81611 , H01L2224/81613 , H01L2224/81616 , H01L2224/81639 , H01L2224/81644 , H01L2224/81647 , H01L2224/81815 , H01L2224/81855 , H01L2224/81905 , H01L2224/83104 , H01L2224/83136 , H01L2224/83192 , H01L2224/83194 , H01L2224/8321 , H01L2224/8359 , H01L2224/83599 , H01L2224/83609 , H01L2224/83611 , H01L2224/83613 , H01L2224/83616 , H01L2224/83639 , H01L2224/83644 , H01L2224/83647 , H01L2224/83855 , H01L2224/92125 , H01L2224/9221 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01048 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/225 , H05K3/3436 , H05K2203/0425 , H05K2203/176 , Y02P70/613 , Y10T29/49144 , Y10T29/49146 , H01L2924/00014 , H01L2924/01014 , H01L2924/00 , H01L2224/73204 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： An electronic element unit (1) includes an electronic element (2) having a plurality of connecting terminals (12) on a lower surface thereof, a circuit board (3) having a plurality of electrodes (22) corresponding to the connecting terminals (12) on an upper surface thereof. The connecting terminals (12) and the electrodes (22) are connected by solder bumps (23), and the electronic element (2) and the circuit board (3) are partly bond by a resin bond part (24) made of a thermosetting material of a thermosetting resin, and a metal powder (25) is included in the resin bond parts (24) in a dispersed state. The metal powder (25) has a melting point lower than a temperature at which the resin bond parts (24) are heated when a work (a repairing work) is carried out for removing the electronic element (2) from the circuit board (3).
摘要翻译：电子元件单元（1）包括在其下表面上具有多个连接端子（12）的电子元件（2），具有对应于连接端子（12）的多个电极（22）的电路板（3））在其上表面。连接端子（12）和电极（22）通过焊锡凸块（23）连接，电子元件（2）和电路板（3）通过由热固性树脂制成的树脂粘接部分（24）热固性树脂的材料和金属粉末（25）以分散状态包含在树脂粘合部分（24）中。当进行从电路板（3）移除电子元件（2）的工件（修理作业）时，金属粉末（25）的熔点低于加热树脂接合部分（24）的温度）。

2. 发明授权

US08434665B2 Electronic component mounting system and electronic component mounting method 有权
标题翻译：电子元件安装系统和电子元件安装方法
公开(公告)号：US08434665B2
公开(公告)日：2013-05-07
申请号：US13255986
申请日：2010-03-24
申请人： Koji Motomura , Hideki Eifuku , Tadahiko Sakai
发明人： Koji Motomura , Hideki Eifuku , Tadahiko Sakai
IPC分类号： B23K31/00 , B23K31/02
CPC分类号： H05K3/363 , H05K3/305 , H05K3/341 , H05K3/3484 , H05K2201/10977
摘要： Disclosed are an electronic component mounting system and an electronic component mounting method capable of reducing the space occupied by equipment and equipment cost and ensuring high connection reliability. An electronic component mounting system (1) includes a solder printing device (M1), a coating/inspection device (M2), a component mounting device (M3), a bonding material supply/substrate mounting device (M4), and a reflow device (M5). The electronic component mounting system (1) mounts an electronic component on a main substrate (4) and connects a module substrate (5) to the main substrate (4). A cream solder is printed on the main substrate (4) to mount an electronic component, a bonding material in which solder particles are contained in thermosetting resin is supplied to a first connection portion of the main substrate (4), and a second connection portion of the module substrate (5) is landed on the first connection portion through the bonding material. Thereafter, the main substrate (4) is carried in the reflow device (M5) and heated in the same reflow step to solder-bond the electronic component onto the main substrate (4) and to bond the second connection portion of the module substrate (5) and the first connection portion of the main substrate (4) together by the bonding material.
摘要翻译：公开了一种电子部件安装系统和电子部件安装方法，其能够减少设备占用的空间和设备成本，并确保高连接可靠性。电子部件安装系统（1）包括焊料印刷装置（M1），涂布/检查装置（M2），部件安装装置（M3），接合材料供应/基板安装装置（M4）和回流装置（M5）。电子部件安装系统（1）将电子部件安装在主基板（4）上，并将模块基板（5）与主基板（4）连接。在主基板（4）上印刷奶油焊料以安装电子部件，将在热固性树脂中包含焊料颗粒的接合材料供应到主基板（4）的第一连接部分，第二连接部分通过所述接合材料将所述模块基板（5）落在所述第一连接部上。此后，将主基板（4）载入回流装置（M5），并在相同的回流步骤中加热，将电子部件焊接到主基板（4）上，并将模块基板的第二连接部 5）和主基板（4）的第一连接部分通过接合材料在一起。

3. 发明授权

US08367938B2 Method of bonding core wires to electrodes and electronic unit formed by bonding electrodes and core wires 有权
标题翻译：将芯线与电极接合的方法和通过电极和芯线接合形成的电子单元
公开(公告)号：US08367938B2
公开(公告)日：2013-02-05
申请号：US12595682
申请日：2008-06-18
申请人： Tadahiko Sakai
发明人： Tadahiko Sakai
IPC分类号： H05K1/09 , B32B38/10
CPC分类号： H05K3/323 , H01L24/45 , H01L24/46 , H01L24/48 , H01L24/85 , H01L2224/45565 , H01L2224/4847 , H01L2924/00011 , H01L2924/00014 , H01L2924/01047 , H05K3/3405 , H05K3/3484 , H05K3/3494 , H05K2201/10287 , H05K2201/10356 , H05K2203/0278 , H05K2203/0425 , Y10T156/10 , H01L2924/00 , H01L2224/45099 , H01L2924/01006
摘要： A method of bonding electrodes and core wires capable of shortening the operation time and improving the bonding strength and an electronic unit formed by bonding the electrodes and the core wires are intended to be provided.After supplying a thermosetting resin 8a incorporated with solider particles 7a so as to cover a plurality of electrodes 3 on a substrate 2, arranging each of core wires 6 while opposing vertically to each of the electrodes 3 above the substrate 2, locating a sheet member 11 above the core wires 6, hot pressing each of the core wires 6 and the thermosetting resin 8a by way of the sheet member 11 by hot press bonding tool 12 from above the sheet member 11 to thermally cure the thermosetting resin 8a and melt the solder particles 7a contained in the thermosetting resin 8a, detaching the hot press bonding tool 12 from the thermally cured product 8 of the thermosetting resin 8a, bonding the core wires 6 and the electrodes 3 by the solidification product 7 of solder formed by solidification of a molten product of the solder particles (molten solder 7b) and, finally, peeling the sheet member 11 from the thermally cured product 8.
摘要翻译：旨在提供一种能够缩短操作时间并提高接合强度的电极和芯线的接合方法以及通过接合电极和芯线而形成的电子单元。在提供结合有胶质颗粒7a的热固性树脂8a以覆盖基板2上的多个电极3之后，将每个芯线6布置在与基板2上方的每个电极3垂直相对的位置，从而定位片状部件11 在芯线6上方，通过热压接工具12从片状部件11上方通过片状部件11热压每个芯线6和热固性树脂8a，以热固化热固性树脂8a并熔化焊料颗粒 7a包含在热固性树脂8a中，从热固性树脂8a的热固化产物8分离热压接合工具12，通过熔融物固化形成的焊料固化产物7将芯线6和电极3接合的焊料颗粒（熔融焊料7b），最后从热固化产物8剥离片材11。

4. 发明申请

US20100327044A1 METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE 审中-公开
标题翻译：制造电子元件模块的方法
公开(公告)号：US20100327044A1
公开(公告)日：2010-12-30
申请号：US12866911
申请日：2009-02-18
申请人： Tadahiko Sakai , Koji Motomura , Hideki Eifuku
发明人： Tadahiko Sakai , Koji Motomura , Hideki Eifuku
IPC分类号： B23K31/02
CPC分类号： H05K3/3484 , H01L24/81 , H01L24/83 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/73204 , H01L2224/83192 , H01L2224/83851 , H01L2924/19105 , H01L2924/3511 , H05K1/186 , H05K3/323 , H05K3/341 , H05K2201/10636 , H05K2201/10674 , H05K2201/10977 , H05K2203/0278 , Y02P70/611 , Y02P70/613
摘要： After disposing bonding material including thermosetting resin containing solder particles in a region that covers at least land part on an upper surface of base wiring layer and holding electronic component by base wiring layer by positioning terminal part with respect to land part and adhesively bonding at least terminal part to bonding material that covers at least land part, bonding material is semi-cured by heating. Therefore, warp deformation of the base wiring layer can be suppressed and bonding reliability can be secured.
摘要翻译：在包括焊料颗粒的热固性树脂的粘合材料在基底布线层的上表面上至少覆盖陆地部分的区域中设置并且通过基板布线层将基板布线层保持电子部件，并且将至少端子至少覆盖陆地部分的接合材料的一部分，通过加热将粘结材料半固化。因此，可以抑制基底布线层的翘曲变形，并且可以确保接合可靠性。

5. 发明申请

US20100200282A1 METHOD OF BONDING CORE WIRES TO ELECTRODES AND ELECTRONIC UNIT FORMED BY BONDING ELECTRODES AND CORE WIRES 有权
标题翻译：将芯线连接到电极和通过电极和芯线形成的电子单元的方法
公开(公告)号：US20100200282A1
公开(公告)日：2010-08-12
申请号：US12595682
申请日：2008-06-18
申请人： Tadahiko Sakai
发明人： Tadahiko Sakai
IPC分类号： H05K1/09 , B32B38/10
CPC分类号： H05K3/323 , H01L24/45 , H01L24/46 , H01L24/48 , H01L24/85 , H01L2224/45565 , H01L2224/4847 , H01L2924/00011 , H01L2924/00014 , H01L2924/01047 , H05K3/3405 , H05K3/3484 , H05K3/3494 , H05K2201/10287 , H05K2201/10356 , H05K2203/0278 , H05K2203/0425 , Y10T156/10 , H01L2924/00 , H01L2224/45099 , H01L2924/01006
摘要： A method of bonding electrodes and core wires capable of shortening the operation time and improving the bonding strength and an electronic unit formed by bonding the electrodes and the core wires are intended to be provided.After supplying a thermosetting resin 8a incorporated with solider particles 7a so as to cover a plurality of electrodes 3 on a substrate 2, arranging each of core wires 6 while opposing vertically to each of the electrodes 3 above the substrate 2, locating a sheet member 11 above the core wires 6, hot pressing each of the core wires 6 and the thermosetting resin 8a by way of the sheet member 11 by hot press bonding tool 12 from above the sheet member 11 to thermally cure the thermosetting resin 8a and melt the solder particles 7a contained in the thermosetting resin 8a, detaching the hot press bonding tool 12 from the thermally cured product 8 of the thermosetting resin 8a, bonding the core wires 6 and the electrodes 3 by the solidification product 7 of solder formed by solidification of a molten product of the solder particles (molten solder 7b) and, finally, peeling the sheet member 11 from the thermally cured product 8.
摘要翻译：旨在提供一种能够缩短操作时间并提高接合强度的电极和芯线的接合方法以及通过接合电极和芯线而形成的电子单元。在提供结合有胶质颗粒7a的热固性树脂8a以覆盖基板2上的多个电极3之后，将每个芯线6布置在与基板2上方的每个电极3垂直相对的位置，从而定位片状部件11 在芯线6上方，通过热压接工具12从片状部件11上方通过片状部件11热压每个芯线6和热固性树脂8a，以热固化热固性树脂8a并熔化焊料颗粒 7a包含在热固性树脂8a中，从热固性树脂8a的热固化产物8分离热压接合工具12，通过熔融物固化形成的焊料固化产物7将芯线6和电极3接合的焊料颗粒（熔融焊料7b），最后从热固化产物8剥离片材11。

6. 发明申请

US20100089628A1 COMPONENT BUILT-IN CIRCUIT SUBSTRATE AND METHOD OF PRODUCING THE SAME 有权
标题翻译：组件内置电路基板及其制造方法
公开(公告)号：US20100089628A1
公开(公告)日：2010-04-15
申请号：US12576572
申请日：2009-10-09
申请人： Yoshiyuki WADA , Tadahiko SAKAI
发明人： Yoshiyuki WADA , Tadahiko SAKAI
IPC分类号： H05K1/16 , B23K37/00
CPC分类号： H05K3/3442 , H05K1/0227 , H05K1/0231 , H05K1/186 , H05K3/305 , H05K3/3452 , H05K3/3484 , H05K2201/093 , H05K2201/09663 , H05K2201/09909 , H05K2201/10636 , H05K2201/10977 , Y02P70/611 , Y02P70/613
摘要： A core layer has on its front surface a pair of connecting electrodes forming a wiring pattern and a resist formed between the pair of electrodes; an electronic component having a pair of connecting terminals; a solder part joining between electrodes and connecting terminals; and a sealing resin part filling a gap between the bottom surface of the electronic component and the front surface of the core layer and covering the resist and the solder part, to prevent a defect of a component built-in printed circuit substrate.
摘要翻译：核心层在其前表面上形成一对形成布线图案的连接电极和形成在该对电极之间的抗蚀剂; 具有一对连接端子的电子部件; 连接电极和连接端子之间的焊料部分; 以及密封树脂部分，填充电子部件的底表面和芯层的前表面之间的间隙并覆盖抗蚀剂和焊料部分，以防止组件内置印刷电路基板的缺陷。

7. 发明申请

US20100000773A1 ELECTRONIC COMPONENT MOUNTING STRUCTURE 有权
标题翻译：电子元件安装结构
公开(公告)号：US20100000773A1
公开(公告)日：2010-01-07
申请号：US12159837
申请日：2007-09-21
申请人： Seiichi Yoshinaga , Yoshiyuki Wada , Tadahiko Sakai
发明人： Seiichi Yoshinaga , Yoshiyuki Wada , Tadahiko Sakai
IPC分类号： H05K1/16
CPC分类号： H01L21/563 , H01L23/293 , H01L2224/73203 , H01L2924/15311 , H01L2924/3511 , H05K3/305 , H05K3/3436 , H05K2201/0133 , H05K2201/10734 , H05K2203/0545 , Y02P70/613 , Y10T428/23971 , Y10T428/31525
摘要： The invention intends to provide an electronic component mounting structure where the repairability and the impact resistance are combined. In an electronic component mounting structure, a plurality of solder balls disposed in plane between an electronic component and a substrate is melted to bond the electronic component and the substrate and a resin of which tensile elongation after the curing is in the range of 5 to 40% is filled in portions that are gaps between the electronic component and the substrate and correspond to at least four comers of the electronic component to reinforce. Since the reinforcement area is small, the repairability such as the easy removability of the resin and the reusability of the substrate are excellent, the resin itself is allowed to expand to the impact at the drop to play a role of reinforcing the bonding without breaking, and the impact resistance is excellent as well.
摘要翻译：本发明旨在提供组合可修复性和耐冲击性的电子部件安装结构。在电子部件安装结构中，将电子部件与基板的平面内配置的多个焊锡球融化，使电子部件和基板接合，固化后的拉伸伸长率为5〜40的树脂％填充在电子部件和基板之间的间隙的部分中，并且对应于电子部件的至少四个角以加强。由于加强面积小，树脂的易去除性和基材的可再利用性等的可修复性优异，因此树脂本身能够在液滴下膨胀到冲击，起到加强粘合而不破裂的作用，耐冲击性也优异。

8. 发明申请

US20090229123A1 ELECTRIC COMPONENTS CONNECTING METHOD 有权
标题翻译：电气组件连接方法
公开(公告)号：US20090229123A1
公开(公告)日：2009-09-17
申请号：US12159832
申请日：2007-09-13
申请人： Tadahiko Sakai , Hideki Eifuku
发明人： Tadahiko Sakai , Hideki Eifuku
IPC分类号： H01R43/00
CPC分类号： H05K3/323 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/16225 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/293 , H01L2224/29399 , H01L2224/32225 , H01L2224/73204 , H01L2224/75252 , H01L2224/83192 , H01L2224/83204 , H01L2224/83851 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H05K2201/0272 , H05K2203/0425 , H05K2203/1476 , Y10T29/49144 , Y10T29/49169 , H01L2924/00 , H01L2924/0105 , H01L2924/01083 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method for connecting a first terminal array 6 provided in a connection portion 5 of a first electric component and a second terminal array 8 provided in a connection portion 7 of a second electric component to each other in such a manner that electric continuity is established between them has two steps, that is, a step of tentatively fixing the two connection portions 5 and 7 with each other whose terminal arrays 6 and 8 are positioned with respect to each other by soldering them with solder particles 3 using a paste-like anisotropic conductive adhesive 1 in which the solder particles 3 and conductive particles 4 are dispersed in a thermosetting resin 2, and a step of finally fixing the two connection portions 5 and 7 with each other with the thermosetting resin 2 that has been set thermally. This prevents positional deviation from occurring between the two terminal arrays 6 and 8 during a transport from a tentative fixing apparatus to a final fixing apparatus.
摘要翻译：一种将设置在第一电气部件的连接部分5中的第一端子阵列6和设置在第二电气部件的连接部分7中的第二端子阵列8彼此连接的方法，它们具有两个步骤，即，通过使用糊状各向异性导电性的焊料颗粒3焊接它们来临时固定端子阵列6和8相对于彼此定位的两个连接部分5和7的步骤粘合剂1，其中焊料颗粒3和导电颗粒4分散在热固性树脂2中，以及最后用热固化的热固性树脂2将两个连接部分5和7彼此固定的步骤。这防止了在从临时定影装置传送到最终定影装置期间在两个端子阵列6和8之间发生位置偏移。

9. 发明申请

US20050116323A1 Semiconductor device and method for assembling the same 有权
标题翻译：半导体装置及其组装方法
公开(公告)号：US20050116323A1
公开(公告)日：2005-06-02
申请号：US10509025
申请日：2003-04-14
申请人： Tadahiko Sakai , Mitsuru Ozono , Yoshiyuki Wada
发明人： Tadahiko Sakai , Mitsuru Ozono , Yoshiyuki Wada
IPC分类号： H01L21/60 , H01L23/02 , H01L23/12 , H01L23/22 , H01L23/29 , H01L23/31
CPC分类号： H01L24/27 , H01L23/12 , H01L23/3114 , H01L24/29 , H01L24/97 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/83192 , H01L2224/97 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/01075 , H01L2924/01082 , Y10S438/959 , H01L2224/83 , H01L2924/3512 , H01L2924/00
摘要： In a semiconductor device provided with a thinned semiconductor element, the present invention intends to provide a semiconductor device in which a damage of a semiconductor element is inhibited from occurring in the neighborhood of an outer periphery and thereby the reliability can be secured. In order to realize the object, the invention relates to a semiconductor device in which to a rear surface of a thinned semiconductor element on a front surface of which a plurality of external connection terminals is formed, a plate higher in the rigidity than the semiconductor element is adhered with a resin binder, wherein an outer shape of the plate is made larger than that of the semiconductor element, and the resin binder covers a side face of the semiconductor element to form a reinforcement portion for reinforcing a periphery of the semiconductor element.
摘要翻译：在具有减薄半导体元件的半导体器件中，本发明旨在提供一种半导体器件，其中半导体元件的损伤被抑制在外周附近，从而可以确保可靠性。为了实现该目的，本发明涉及一种半导体器件，其中在形成有多个外部连接端子的前表面上的薄型半导体元件的后表面上，刚性比半导体元件高的板粘附有树脂粘合剂，其中板的外部形状比半导体元件的外形大，并且树脂粘合剂覆盖半导体元件的侧面，以形成用于加强半导体元件的周边的加强部分。

10. 发明授权

US06209196B1 Method of mounting bumped electronic components 有权
标题翻译：安装凸起的电子部件的方法
公开(公告)号：US06209196B1
公开(公告)日：2001-04-03
申请号：US09234299
申请日：1999-01-21
申请人： Mitsuru Ozono , Hideki Eifuku , Tadahiko Sakai
发明人： Mitsuru Ozono , Hideki Eifuku , Tadahiko Sakai
IPC分类号： H05K334
CPC分类号： H01L24/81 , H01L21/563 , H01L24/29 , H01L24/743 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/13111 , H01L2224/13144 , H01L2224/16225 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/293 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81193 , H01L2224/81355 , H01L2224/81801 , H01L2224/83192 , H01L2224/83851 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/351 , H05K3/284 , H05K3/3436 , H05K2201/0209 , H05K2201/0379 , H05K2201/10977 , H05K2203/0278 , Y02P70/613 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/4921 , Y10T29/49211 , H01L2924/00 , H01L2924/0133 , H01L2924/01049 , H01L2924/00012 , H01L2224/13109 , H01L2224/29099 , H01L2224/29199 , H01L2224/05599
摘要： A method of mounting bumped electronic components without using a flux during the solder joining process, which is low in cost and offers high reliability of the assembly. Resin adhesive 4 containing filler particles 4a is applied to a board 1 formed with electrodes 2, and a bumped electronic component 5 is mounted onto the board 1 to press the bumps 7 of the electronic component 5 against the electrodes 2 of the board 1. As a result, the oxide films 7a over the surfaces of the solder bumps 7 are broken by the filler particles 4a present in a gap between the lower ends of the solder bumps 7 and the surfaces of the electrodes 2, thus exposing the solder. This process eliminates the need for using the flux when the solder bumps 7 are melted and soldered to the electrodes 2, and therefore the cleaning process after soldering is not required, assuring high reliability of the assembly.
摘要翻译：一种在焊接工艺期间安装凸起的电子部件而不使用焊剂的方法，其成本低廉并且提供了组装的高可靠性。将含有填充剂颗粒4a的树脂粘合剂4施加到形成有电极2的基板1上，将凸起的电子部件5安装在基板1上，将电子部件5的凸块7压靠在基板1的电极2上。结果，焊料凸块7的表面上的氧化物膜7a被存在于焊料凸块7的下端和电极2的表面之间的间隙中的填料颗粒4a断裂，从而暴露焊料。当焊料凸块7熔化并焊接到电极2时，该工艺消除了使用焊剂的需要，因此不需要焊接后的清洁工艺，从而确保组装的高可靠性。

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